IP Library Granted Patent US 8,631,291
Granted Patent B2
US 8,631,291 · App. 13/333,959 · Granted Jan 14, 2014

Semiconductor device and test method with boundary scan

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Quick Facts
Patent No.
US 8,631,291
App. No.
13/333,959
Granted
Jan 14, 2014
Kind
B2
Abstract

A semiconductor device includes a clock control unit configured to receive an external test clock signal in a boundary scan test mode and generate a boundary test clock signal in synchronization with an entry time point of the boundary scan test mode, and a plurality of latches configured to receive and store a plurality of data in parallel in a boundary capture test mode and form a boundary scan path to sequentially output the plurality of stored data in the boundary scan test mode in response to the boundary test clock signal.

Claims (27)

1. A semiconductor device comprising:

a clock control unit configured to receive an external test clock signal in a boundary scan test mode and generate a boundary test clock signal during the boundary scan test mode; and

a plurality of latches configured to form a boundary scan path to sequentially output the plurality of stored data in the boundary scan test mode in response to the boundary test clock signal,

wherein the clock control unit comprises:

a clock buffer configured to buffer the external test clock signal in response to a scan test entry signal indicating an entry/exit of the boundary scan test mode and output the buffered external test clock signal as an output clock signal; and

a clock transmission control signal generator configured to activate the clock transmission control signal at an activation transitioning point of the scan test entry signal and deactivate the clock transmission control signal at the later transitioning point between a deactivation transitioning point of the scan test entry signal and a deactivation transitioning point of the output clock signal of the clock buffer.

2. The semiconductor device of claim 1 ., wherein the plurality of latches receive and store a plurality of data in parallel in a boundary capture test mode.

3. The semiconductor device of claim 1 , wherein the clock control unit further comprising:

a clock transmission controller configured to output an output clock signal of the clock buffer as the boundary test clock signal in response to a clock transmission control signal.

4. The semiconductor device of claim 1 , wherein, during an activation period of the scan test entry signal, each of the latches is configured to store an input data in response to the boundary test clock signal, when a capture test entry signal indicating an entry/exit of the boundary capture test mode is activated, and output the stored data to the boundary scan path in response to the boundary test clock signal, when the capture test entry signal is deactivated,

wherein, during a deactivation period of the scan test entry signal, the each of the latches is configured to hold the stored data regardless of the capture test entry signal.

5. The semiconductor device of claim 1 , wherein the data transmitted through the boundary scan path are outputted through a scan data output channel of the semiconductor device.

6. A semiconductor device comprising:

at least one latch configured to store test data serially received from an outside;

a scan path configured to output serially the test data stored in the latch; and

a control unit configured to control the latch to serially store the test data in a boundary capture test mode and control the scan path to serially output the test data stored in the latch in a boundary scan test mode,

wherein the control unit is configured to control a test data outputted at a first moment in which the semiconductor device exits from the boundary scan test mode to be held as an output data, and

the control unit is configured to control a next test data subsequent to the held test data to be outputted at a second moment after the first moment, in which the semiconductor device enters the boundary scan test mode again,

wherein the control unit comprises:

a clock buffer configured to buffer the test clock signal in response to the scan test ent signal; and

a clock transmission control signal generator configured to activate the clock transmission control signal at an activation transitioning point of the scan test entry signal and deactivate the clock transmission control signal at the later transitioning point between a deactivation transitioning point of the scan test entry signal and a deactivation transitioning point of the output clock signal of the clock buffer.

7. The semiconductor device of claim 6 , wherein the control unit is configured to control a storing operation of the latch in response to a test clock signal and a scan test entry signal indicating an entry of the boundary scan test mode.

8. The semiconductor device of claim 7 , wherein the control unit is configured to control an output operation of the scan path in response to the test clock signal, the scan test entry signal, and a capture test entry signal indicating an entry of the boundary capture test mode.

9. The semiconductor device of claim 8 , wherein the control unit further comprising:

a clock transmission controller configured to output an output clock signal of the clock buffer as a boundary test clock signal in response to a clock transmission control signal.

10. The semiconductor device of claim 9 , wherein, during an activation period of the scan test entry signal, the latch is configured to store the test data in response to the boundary test clock signal, when the capture test entry signal is activated, and output the stored test data to the scan path in response to the boundary test clock signal, when the capture test entry signal is deactivated,

wherein, during a deactivation period of the scan test entry signal, the latch is configured to hold the stored test data regardless of the capture test entry signal.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS HYNIX SEMICONDUCTOR INC. NOT HYNIX-SEMICONDUCTOR INC. THERE IS NO HYPHEN IN THE NAME. PREVIOUSLY RECORDED ON REEL 67328 FRAME 814. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
CHANGE OF NAME Recorded May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2011
From: KIM, KI-TAE
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 027430/0169 →