Method of manufacturing semiconductor device
View Patent ↗A semiconductor device includes a storage node contact plug, a bit line in communication with to the storage node contact plug, and an expansion unit formed on a sidewall of the bit line. Thermal expansion of the expansion unit serves to increase capacitance by ensuring a distance between the bit line and the storage node contact plug, thereby improving a sensing margin. A cell characteristic such as a record recovery time (tWR) may be enhanced.
1. A semiconductor device, comprising:
a bit line contact plug formed over a semiconductor substrate;
a bit line coupled to the bit line contact plug, the bit line including a bit line conductive layer and a hard mask layer; and
an expansion unit disposed on a sidewall of the bit line conductive layer and the bit line contact plug,
wherein a width of a central portion of the expansion unit is greater than a width of an upper portion of the expansion unit and a width of a lower portion of the expansion unit.
2. The semiconductor device of claim 1 , further comprising a buried gate disposed within the semiconductor substrate and coupled to the bit line.
3. The semiconductor device of claim 1 , wherein the bit line contact plug includes a polysilicon layer.
4. The semiconductor device of claim 1 , wherein the bit line includes a barrier metal layer, a bit line conductive layer, and a hard mask layer.
5. The semiconductor device of claim 4 , wherein the barrier metal layer includes any one selected from the group consisting of a titanium (Ti) layer, a titanium nitride (TiN) layer, and a combination thereof.
6. The semiconductor device of claim 4 , wherein the bit line conductive layer includes tungsten (W).
7. The semiconductor device of claim 4 , further comprising an insulating layer disposed on a sidewall and an upper surface of the hard mask layer.
8. The semiconductor device of claim 7 , wherein the insulating layer includes low pressure tetra ethyl ortho silicate (LP-TEOS).
9. The semiconductor device of claim 7 , wherein a linewidth of the expansion unit is larger than a linewidth of the insulating layer.
10. The semiconductor device of claim 7 , wherein the expansion unit is configured to have a first volume when it is originally formed, a second volume when thermal energy is applied to the expansion unit, and a third volume after the thermal energy that induced the second volume is no longer applied, and wherein the second and third volumes are larger than the first volume.
11. The semiconductor device of claim 1 , wherein the expansion unit includes plasma enhanced tetra ethyl ortho silicate (PE-TEOS).
12. The semiconductor device of claim 1 , wherein the expansion unit is a unit that permanently expands its size.
13. The semiconductor device of claim 1 , wherein a lower portion of the expansion unit is disposed in a bit line contact hole.
14. The semiconductor device of claim 1 , further comprising first and second trenches disposed on opposing sides of the bit line;
wherein the expansion unit extends from the sidewalls of the conductive layer of the bit line to a first insulation layer filling an upper portion of the first and second trenches.
15. A semiconductor device, comprising:
a bit line contact plug formed over a semiconductor substrate;
a bit line coupled to the bit line contact plug, the bit line including a bit line conductive layer and a hard mask layer;
an expansion unit disposed on a sidewall of the bit line conductive layer and the bit line contact plug; and
first and second trenches disposed on opposing sides of the bit line,
wherein the expansion unit extends from the sidewalls of the conductive layer of the bit line to a first insulation layer filling an upper portion of the first and second trenches.