IP Library Granted Patent US 8,537,616
Granted Patent B2
US 8,537,616 · App. 13/347,064 · Granted Sep 17, 2013

Nonvolatile memory device and method for operating the same

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Quick Facts
Patent No.
US 8,537,616
App. No.
13/347,064
Granted
Sep 17, 2013
Kind
B2
Abstract

A nonvolatile memory device includes a plurality of memory blocks and a high voltage application unit configured to apply a high voltage to a word line of a memory block unselected from among the plurality of memory blocks and float the word line, during the erase operation.

Claims (29)

1. A nonvolatile memory device comprising:

a plurality of memory blocks; and

a high voltage application unit configured to apply a high voltage to a word line of a memory block unselected from among the plurality of memory blocks and float the word line, during an erase operation.

2. The nonvolatile memory device of claim 1 , further comprising a row decoder coupled to one end of a word line of each of the memory blocks,

wherein the high voltage application unit is coupled to the other end of the word line of the unselected memory block.

3. The nonvolatile memory device of claim 2 , wherein the row decoder is configured to apply a ground voltage to the word line of the unselected memory block and float the word line before high voltage application unit is configured to apply the high voltage to the word line of the unselected memory block and float the word line, during the erase operation.

4. The nonvolatile memory device of claim 1 , wherein the high voltage application unit comprises:

a latch section configured to store the high voltage; and

a switch section configured to transfer the voltage stored in the latch section to the word line of the unselected memory block.

5. The nonvolatile memory device of claim 1 , wherein the high voltage is set to have a voltage level for the word line of the unselected memory block to be boosted from a level of the high voltage to a level of an erase voltage when the erase voltage is applied to a substrate during the erase operation.

6. A method for operating a nonvolatile memory device, comprising:

applying a high voltage to a word line of a memory block unselected from among a plurality of memory blocks in an erase operation mode;

floating the word line to which the high voltage is applied; and

applying an erase voltage to a substrate.

7. The method of claim 6 , further comprising applying a ground voltage to the word line of the unselected memory block and floating the word line, before the applying of the high voltage.

8. The method of claim 6 , wherein the high voltage is set to have a voltage level for the word line of the unselected memory block to be boosted from a level of the high voltage to a level of the erase voltage in the applying of the erase voltage.

9. A nonvolatile memory device comprising:

a plurality of memory blocks;

a plurality of row decoders corresponding to the respective memory blocks and each configured to apply a ground voltage to word lines of a corresponding memory block and float the word lines when the memory block is unselected in an erase operation mode; and

a plurality of high voltage application units corresponding to the respective memory blocks and each configured to apply a high voltage to word lines of a corresponding memory block and float the word lines when the memory block is unselected in an erase operation mode.

10. The nonvolatile memory device of claim 9 , wherein each of the row decoders is configured to apply the ground voltage to word lines of a corresponding memory block when the memory block is selected in the erase operation mode, and

each of the high voltage application units is deactivated when a corresponding memory block is selected in the erase operation mode.

11. The nonvolatile memory device of claim 9 , wherein each of the row decoders is coupled to one ends of the word lines of the corresponding memory block, and

each of the high voltage application units is coupled to the other ends of the word lines of the corresponding memory block.

12. The nonvolatile memory device of claim 9 , wherein an operation of the row decoder corresponding the unselected memory block is performed before an operation of the high voltage application unit corresponding the unselected memory block in the erase operation mode.

13. The nonvolatile memory device of claim 9 , wherein each of the high voltage application units comprises:

a latch section configured to store the high voltage; and

a switch section configured to transfer the high voltage stored in the latch section to the word lines of the unselected memory block.

14. The nonvolatile memory device of claim 9 , wherein the high voltage is set to have a voltage level for the word lines of the unselected memory block to be boosted from a level of the high voltage to a level of an erase voltage when the erase voltage is applied to a substrate during the erase operation.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS HYNIX SEMICONDUCTOR INC. NOT HYNIX-SEMICONDUCTOR INC. THERE IS NO HYPHEN IN THE NAME. PREVIOUSLY RECORDED ON REEL 67328 FRAME 814. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
CHANGE OF NAME Recorded May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2012
From: KIM, NAM-KYEONG
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 027508/0419 →