IP Library Granted Patent US 8,961,832
Granted Patent B2
US 8,961,832 · App. 13/352,181 · Granted Feb 24, 2015

High temperature material compositions for high temperature thermal cutoff devices

Inventors: Perry Kent (Mansfield, OH); Truong Nguyen (Wooster, OH)
Assignee: Therm-O-Disc, Incorporated
H01H85/055H01H37/765H01H2037/762
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Quick Facts
Patent No.
US 8,961,832
App. No.
13/352,181
Granted
Feb 24, 2015
Kind
B2
Abstract

The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.

Claims (31)

1. A high-temperature thermally-actuated, current cutoff device comprising:

a housing;

a high-temperature pellet composition comprising triptycene, wherein the pellet composition is disposed in the housing and maintains its structural rigidity up to a transition temperature of about 240° C.

2. The high-temperature thermally-actuated, current cutoff device of claim 1 , wherein the triptycene is present at greater than or equal to about 96% by weight of the total pellet composition.

3. The high-temperature thermally-actuated, current cutoff device of claim 1 , wherein the triptycene is present at greater than or equal to about 99% by weight of the total pellet composition.

4. The high-temperature thermally-actuated, current cutoff device of claim 1 , wherein the high-temperature pellet composition further comprises one or more components selected from the group consisting of: a binder, a press aid, a release agent, a pigment, and combinations thereof.

5. The high-temperature thermally-actuated, current cutoff device of claim 1 , wherein the high-temperature pellet composition consists essentially of triptycene and one or more components cumulatively present at greater than 0% to less than or equal to about 10% by weight of the pellet composition, wherein the one or more components are selected from the group consisting of: binders, lubricants, press-aids, pigments, and combinations thereof.

6. The high-temperature thermally-actuated, current cutoff device of claim 1 , wherein the high-temperature pellet composition consists essentially of triptycene.

7. A method of making the high-temperature thermally-actuated, current cutoff device of claim 1 , comprising disposing the high-temperature pellet composition in the housing and sealing one or more openings in the housing with a high-temperature sealant material comprising a cured epoxy.

8. A high-temperature thermally-actuated, current cutoff device comprising:

a high-temperature material system comprising:

a pellet composition comprising a single polycrystalline organic compound comprising triptycene, wherein the pellet composition maintains its structural rigidity up to a transition temperature of about 240° C.; and

a high-temperature seal comprising an epoxy resin that is cured and creates a barrier that interacts with the pellet composition to substantially prevent escape of the pellet composition into an external environment up to the transition temperature.

9. The high-temperature thermally-actuated, current cutoff device of claim 8 , wherein the epoxy resin of the high-temperature seal is formed from a precursor comprising bisphenol A.

10. The high-temperature thermally-actuated, current cutoff device of claim 8 , wherein the high-temperature seal is formed from the precursor comprising a diglycidyl ether bisphenol A resin and a hardener comprising a modified imidazole compound.

11. The high-temperature thermally-actuated, current cutoff device of claim 10 , wherein the hardener comprises 2-ethyl-4-methyl-1H-imidazole.

12. The high-temperature thermally-actuated, current cutoff device of claim 10 , wherein the high-temperature seal is formed by combining at least two precursors, wherein a first precursor comprises at least one bisphenol A diglycidyl ether, an elastomer, and neopentyl glycol diglycidyl ether; and a second precursor comprises 2-ethyl-4-methyl-1H-imidazole.

13. The high-temperature thermally-actuated, current cutoff device of claim 10 , wherein the high-temperature seal is formed by combining at least three precursors, wherein a first precursor comprises a bisphenol A diglycidyl ether polymer; a second precursor comprises 1-(2-cyanoethyl)-2-ethyl-4-methyl imidizole; and a third precursor comprises benzenetetracarboxylic-1,2,4,5-dianhydride, hexahydrophthalic anhydride, and phthalic anhydride.

14. A high-temperature thermally-actuated, current cutoff device comprising:

a high-temperature material system comprising:

a pellet composition comprising triptycene, wherein the pellet composition maintains its structural rigidity up to a transition temperature of about 240° C.; and

a high-temperature seal comprising an epoxy resin formed from a bisphenol A precursor that is cured and creates a barrier that interacts with the pellet composition to substantially prevent escape of the pellet composition into an external environment up to the transition temperature.

15. The high-temperature thermally-actuated, current cutoff device of claim 14 , wherein the epoxy resin comprises a diglycidyl ether bisphenol A resin.

16. The high-temperature thermally-actuated, current cutoff device of claim 14 , wherein the high-temperature seal further comprises a hardener comprising a modified imidazole compound.

17. A high-temperature thermally-actuated, current cutoff device comprising:

a high-temperature material system comprising:

(i) a pellet composition consisting essentially of:

a single organic polycyclic compound comprising triptycene present at greater than or equal to about 90% to less than or equal to about 100% by weight of the pellet composition; and

one or more additives cumulatively present at greater than 0% by weight to less than or equal to about 10% by weight of the pellet composition, wherein the one or more additives are selected from the group consisting of: binders, lubricants, press-aids, colorants, and combinations thereof; wherein the pellet composition maintains its structural rigidity up to a transition temperature of about 240° C.; and

(ii) a high-temperature seal comprising an epoxy resin formed from a bisphenol A precursor that is cured and creates a barrier that interacts with the pellet composition to substantially prevent escape of the pellet composition into an external environment up to the transition temperature.

18. The high-temperature thermally-actuated, current cutoff device of claim 17 , wherein a binder is present in the pellet composition at greater than or equal to 0% to less than or equal to about 10% by weight, a lubricant or press aid is present in the pellet composition at greater than or equal to 0% to less than or equal to about 5% by weight of the pellet composition, and a pigment is present in the pellet composition at greater than or equal to 0% to less than or equal to about 2% by weight of the pellet composition.

Assignments (8)
SECURITY INTEREST Recorded Jun 9, 2026
From: THERM-O-DISC, INCORPORATED
To: MORGAN STANLEY SENIOR FUNDING, INC. AS COLLATERAL AGENT
Reel/Frame 074895/0763 →
RELEASE OF SECURITY INTEREST Recorded Jun 9, 2026
From: MORGAN STANLEY SENIOR FUNDING, INC. AS COLLATERAL AGENT
To: THERM-O-DISC, INCORPORATED
Reel/Frame 075844/0075 →
RELEASE OF SECURITY INTEREST Recorded Jun 9, 2026
From: MORGAN STANLEY SENIOR FUNDING, INC. AS COLLATERAL AGENT
To: THERM-O-DISC, INCORPORATED
Reel/Frame 075844/0512 →
RELEASE OF SECURITY INTEREST Recorded Jun 5, 2026
From: ARGENT INSTITUTIONAL TRUST COMPANY
To: THERM-O-DISC, INCORPORATED
Reel/Frame 075697/0530 →
OMNIBUS ASSIGNMENT OF INTELLECTUAL PROPERTY SECURITY AGREEMENTS Recorded Nov 13, 2024
From: TOKEN FINANCE HOLDINGS, LLC, AS EXISTING AGENT
To: ARGENT INSTITUTIONAL TRUST COMPANY, AS SUCCESSOR AGENT
Reel/Frame 069351/0180 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Jan 31, 2024
From: THERM-O-DISC, INCORPORATED
To: TOKEN FINANCE HOLDINGS, LLC, AS COLLATERAL AGENT
Reel/Frame 066382/0576 →
SECURITY INTEREST Recorded May 31, 2022
From: THERM-O-DISC, INCORPORATED
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 061521/0328 →
SECURITY INTEREST Recorded May 31, 2022
From: THERM-O-DISC, INCORPORATED
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 060243/0871 →
Continuity (3)
Continuation 12512369 · Jul 30, 2009
Provisional Application 61086330 · Aug 5, 2008
Related Publication 20120121795A1 · May 17, 2012