IP Library Assignment 075844/0512
Patent Assignment
Reel/Frame 075844/0512

Release of Security Interest

Recorded: 2026-06-09 Pages: 10
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Assignor
Assignee
THERM-O-DISC, INCORPORATED
570 POLARIS PKWY, STE. 500, WESTERVILLE, OHIO, 43082
Covered Properties (46)
Temperature Sensor Assembly And Method Of Making Temperature Sensor Assembly
Application: 63/185,028 →
Sensor
Application: 63/216,745 →
Robust Gas Sensor For Harsh Environments
Application: 63/179,790 →
Gas Sensor for Refrigerant Leak Detection
Application: 63/179,820 →
Temperature Sensor Assembly And Method Of Making Temperature Sensor Assembly
Application: 17/561,103 →
Publication: US US20220357210A1
Dual Gas Detector For Threshold And Advanced Leak Detection
Application: 63/265,527 →
Methods of Minimizing Temperature Cross-Sensitivity in Vapor Sensors and Compositions Therefor
Patent: 7,708,947 →
Application: 11/265,225 →
Publication: US US20070095678A1
Capacitive Vapor Sensor
Patent: 7,421,883 →
Application: 11/297,752 →
Publication: US US20070131021A1
Robust Low Resistance Vapor Sensor Materials
Patent: 8,012,420 →
Application: 11/488,838 →
Publication: US US20080017507A1
Liquid Level Sensor Using Thick Film Substrate
Patent: 7,596,998 →
Application: 11/489,249 →
Publication: US US20080016960A1
Temperature Sensor
Patent: 8,734,012 →
Application: 12/861,397 →
Publication: US US20110044374A1
Robust Low Resistance Vapor Sensor Materials
Patent: 8,105,538 →
Application: 13/197,045 →
Publication: US US20110286889A1
High Temperature Material Compositions for High Temperature Thermal Cutoff Devices
Patent: 8,961,832 →
Application: 13/352,181 →
Publication: US US20120121795A1
High Thermal Stability Pellet Compositions for Thermal Cutoff Devices and Methods for Making and Use Thereof
Patent: 9,171,654 →
Application: 13/918,548 →
Publication: US US20130334471A1
Thermal Cut-Off Device
Patent: 9,378,910 →
Application: 14/044,322 →
Publication: US US20150091689A1
High Temperature Material Compositions for High Temperature Thermal Cutoff Devices
Patent: 9,779,901 →
Application: 14/593,768 →
Publication: US US20150162153A1
Wireless Temperature and/or Humidity Sensor Assembly
Application: 14/909,275 →
Publication: US US20160169713A1
High Thermal Stability Thermal Cutoff Device Pellet Composition
Application: 15/506,183 →
Publication: US US20170278657A1
Pressure Sensor Assembly And Method For Manufacturing A Pressure Sensor Assembly
Application: 16/518,466 →
Publication: US US20200209091A1
Temperature Sensor Probe
Application: 17/367,846 →
Publication: US US20220357216A1
Electric Power Terminal Feed-Through
Patent: 7,745,725 →
Application: 11/988,270 →
Publication: US US20090120686A1
Hermetic Glass-to-Metal Seal Assembly and Method of Manufacturing Hermetic Glass-to-Metal Seal Assembly
Patent: 9,175,999 →
Application: 13/263,951 →
Publication: US US20120034403A1
Hermetically Sealed Terminal Pins with Holes for Connecting to Wires
Patent: 8,851,923 →
Application: 13/569,499 →
Publication: US US20140045369A1
Hermetic Terminal Having Pin-Isolating Feature
Patent: 8,794,999 →
Application: 13/572,225 →
Publication: US US20140045355A1
Solid Core Glass Bead Seal With Stiffening Rib
Patent: 8,921,700 →
Application: 13/924,689 →
Publication: US US20130284496A1
High-Pressure Hermetic Terminal
Patent: 9,979,118 →
Application: 14/772,113 →
Publication: US US20160020547A1
Hermetic Terminal
Patent: 720,301 →
Application: 29/429,570 →
Hermetic Terminal
Patent: 749,515 →
Application: 29/509,330 →
Hermetic Terminal
Patent: 749,516 →
Application: 29/509,337 →
Hermetic Terminal
Patent: 749,517 →
Application: 29/509,348 →
Hermetic Terminal Assembly
Patent: 6,632,104 →
Application: 10/071,542 →
Publication: US US20030157831A1
Hermetic Terminal Assembly and Associated Method of Manufacture
Patent: 6,921,297 →
Application: 10/633,962 →
Publication: US US20040029443A1
Hermetically Sealed Current Conducting Terminal Assembly
Patent: 6,844,502 →
Application: 10/805,515 →
Publication: US US20040173370A1
Terminal Assembly
Patent: 6,841,731 →
Application: 10/739,570 →
Hermetic Feed-Through with Hybrid Seal Structure
Patent: 8,378,239 →
Application: 12/808,452 →
Publication: US US20110108320A1
Solid Core Glass Bead Seal with Stiffening Rib
Patent: 8,487,187 →
Application: 12/555,899 →
Publication: US US20110056731A1
Connector Block with Parallel Electrical Connection
Patent: 8,608,514 →
Application: 13/358,605 →
Publication: US US20130196528A1
Robust Chemiresistor Sensor
Patent: 7,112,304 →
Application: 10/412,602 →
Publication: US US20040200722A1
Method and Apparatus for the Detection of the Response of a Sensing Device
Patent: 6,868,350 →
Application: 10/411,894 →
Publication: US US20040204920A1
Vapor Sensor and Materials Therefor
Patent: 7,138,090 →
Application: 10/411,805 →
Publication: US US20040202856A1
Vapor Sensor and Materials Therefor
Patent: 7,645,422 →
Application: 11/510,942 →
Publication: US US20060292033A1
Sterically Hindered Reagents for Use in Single Component Siloxane Cure Systems
Patent: 7,211,637 →
Application: 10/860,198 →
Publication: US US20050272881A1
Trip-Free Manual Reset Thermostat
Patent: 7,479,868 →
Application: 11/147,478 →
Publication: US US20060279397A1
Thermistor Sensor Probe with Bimetal High Limit Control for Electric Water Heater Control
Patent: 7,162,150 →
Application: 11/287,005 →
Temperature Compensated Vapor Sensor
Patent: 7,265,560 →
Application: 11/286,985 →
Publication: US US20070117207A1
Single-Use Flammable Vapor Sensor Films
Patent: 8,691,390 →
Application: 11/943,023 →
Publication: US US20090130421A1
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 19, 2005
From: WEST, JEFFREY A.; RAMAMURTHY, PRAVEEN
To: THERM-O-DISC, INCORPORATED
Reel/Frame 016911/0827 →
Assignment of Assignor's Interest Jan 26, 2006
From: KHADKIKAR, PRASAD; RAMAMURTHY, PRAVEEN; ZIMMERMANN, BERND D.
To: THERM-O-DISC, INCORPORATED
Reel/Frame 017067/0133 →
Assignment of Assignor's Interest Sep 15, 2006
From: ZIMMERMANN, BERND D.; YANG, TUNG-SHENG; ANDERSON, THOMAS C.
To: THERM-O-DISC, INCORPORATED
Reel/Frame 018256/0228 →
Assignment of Assignor's Interest Apr 9, 2010
From: RAMAMURTHY, PRAVEEN C.; AMADIO, BLASE S.
To: THERM-O-DISC INCORPORATED
Reel/Frame 024208/0940 →
Assignment of Assignor's Interest Sep 30, 2010
From: BERGERON, GARY D.
To: THERM-O-DISC, INCORPORATED
Reel/Frame 025067/0133 →
Assignment of Assignor's Interest May 18, 2012
From: PATEREK, FRANZ DIETER; KOLKMAN, ALBERTUS JAN HENDRIK; SCHUCKMANN, SCOTT
To: EMERSON ELECTRIC CO.
Reel/Frame 028233/0860 →
Assignment of Assignor's Interest Oct 3, 2013
From: NGUYEN, TRUONG; CLARK, GEORGE
To: THERM-O-DISC, INCORPORATED
Reel/Frame 031339/0468 →
Assignment of Assignor's Interest Jan 12, 2015
From: KENT, PERRY; NGUYEN, TRUONG
To: THERM-O-DISC, INCORPORATED
Reel/Frame 034682/0489 →
Assignment of Assignor's Interest Sep 1, 2015
From: HINRICHS, KATHERINE; ZHAO, CHANGCAI
To: THERM-O-DISC, INCORPORATED
Reel/Frame 036466/0403 →
Assignment of Assignor's Interest Aug 10, 2017
From: ZHAO, CHANGCAI; WEI, SHI
To: THERM-O-DISC, INCORPORATED
Reel/Frame 043256/0238 →
Assignment of Assignor's Interest Aug 5, 2019
From: LOOMBA, INDRA J.; LI, CHUNMING; LIANG, HAIJIAN; ZHAO, ZHOUYU
To: THERM-O-DISC, INCORPORATED
Reel/Frame 049954/0127 →
Assignment of Assignor's Interest May 24, 2021
From: WEST, JEFFREY A.
To: THERM-O-DISC, INCORPORATED
Reel/Frame 056326/0015 →
Assignment of Assignor's Interest May 24, 2021
From: WEST, JEFFREY A.
To: THERM-O-DISC, INCORPORATED
Reel/Frame 056327/0183 →
Assignment of Assignor's Interest Jun 4, 2021
From: MOLDOVAN, ADRIAN
To: THERM-O-DISC, INCORPORATED
Reel/Frame 056441/0783 →
Assignment of Assignor's Interest Jul 12, 2021
From: WEST, JEFFREY A.; EDDE, GABRIEL ALFRED
To: THERM-O-DISC INCORPORATED
Reel/Frame 056819/0535 →
Assignment of Assignor's Interest Jul 22, 2021
From: LIANG, GUOKUAN; WANG, XIAOJIAN; WU, WENJIE; LIU, XIAO
To: THERM-O-DISC INCORPORATED
Reel/Frame 056944/0142 →
Assignment of Assignor's Interest Jan 27, 2022
From: WEST, JEFFREY A.; STARLING, JARED R.
To: THERM-O-DISC INCORPORATED
Reel/Frame 058794/0325 →
Assignment of Assignor's Interest Feb 8, 2022
From: MOLDOVAN, ADRIAN
To: THERM-O-DISC INCORPORATED
Reel/Frame 058928/0937 →
Security Interest May 31, 2022
From: THERM-O-DISC, INCORPORATED
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 060243/0871 →
Security Interest May 31, 2022
From: THERM-O-DISC, INCORPORATED
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 061521/0328 →
First Lien Patent Security Agreement Jan 31, 2024
From: THERM-O-DISC, INCORPORATED
To: TOKEN FINANCE HOLDINGS, LLC, AS COLLATERAL AGENT
Reel/Frame 066382/0576 →
Omnibus Assignment of Intellectual Property Security Agreements Nov 13, 2024
From: TOKEN FINANCE HOLDINGS, LLC, AS EXISTING AGENT
To: ARGENT INSTITUTIONAL TRUST COMPANY, AS SUCCESSOR AGENT
Reel/Frame 069351/0180 →
Release of Security Interest Jun 5, 2026
From: ARGENT INSTITUTIONAL TRUST COMPANY
To: THERM-O-DISC, INCORPORATED
Reel/Frame 075697/0530 →
Release of Security Interest Jun 9, 2026
From: MORGAN STANLEY SENIOR FUNDING, INC. AS COLLATERAL AGENT
To: THERM-O-DISC, INCORPORATED
Reel/Frame 075844/0075 →
Security Interest Jun 9, 2026
From: THERM-O-DISC, INCORPORATED
To: MORGAN STANLEY SENIOR FUNDING, INC. AS COLLATERAL AGENT
Reel/Frame 074895/0763 →