High temperature material compositions for high temperature thermal cutoff devices
The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
1. A high temperature thermally-actuated thermal cutoff device comprising:
a housing;
a high-temperature thermal pellet comprising an organic polycyclic aromatic hydrocarbon compound selected from the group consisting of triptycene, aminoanthraquinone, and combinations thereof that is present at greater than or equal to about 96% by weight of the pellet, wherein the high-temperature thermal pellet is disposed in the housing and maintains its structural rigidity up to a transition temperature of greater than or equal to about 240° C.; and
a high-temperature seal comprising a cured high-temperature epoxy resin formed from at least two precursors including a first precursor comprising bisphenol A and a second precursor comprising a hardener that are cured to create a barrier that interacts with the high-temperature thermal pellet to substantially prevent escape of the organic polycyclic aromatic hydrocarbon compound from the housing into an external environment up to the transition temperature.
2. The high temperature thermally-actuated thermal cutoff device of claim 1 , wherein the organic polycyclic aromatic hydrocarbon compound comprises 1-aminoanthraquinone.
3. The high temperature thermally-actuated thermal cutoff device of claim 1 , wherein the organic polycyclic aromatic hydrocarbon compound consists essentially of 1-aminoanthraquinone.
4. The high temperature thermally-actuated thermal cutoff device of claim 1 , wherein the device is capable of operating at greater than or equal to about 1,000 hours at a sustained temperature of about 235° C.
5. The high temperature thermally-actuated thermal cutoff device of claim 4 , wherein the epoxy resin is formed from a diglycidyl ether bisphenol A resin and a hardener comprising a modified imidazole compound.
6. The high temperature thermally-actuated thermal cutoff device of claim 5 , wherein the hardener comprises 2-ethyl-4-methyl-1H-imidazole.
7. The high temperature thermally-actuated thermal cutoff device of claim 1 , wherein the high-temperature seal is formed by combining the first precursor that comprises bisphenol A diglycidyl ether and the second precursor that comprises 2-ethyl-4-methyl-1H-imidazole.
8. The high temperature thermally-actuated thermal cutoff device of claim 1 , wherein the high-temperature seal is formed by combining at least three precursors, wherein the first precursor comprises a bisphenol A diglycidyl ether polymer; the second precursor comprises 1-(2-cyanoethyl)-2-ethyl-4-methyl imidazole; and the third precursor comprises benzenetetracarboxylic-1,2,4,5-dianhydride, hexahydrophthalic anhydride, and phthalic anhydride.
9. The high temperature thermally-actuated thermal cutoff device of claim 1 , wherein the high-temperature thermal pellet further comprises one or more components selected from the group consisting of: a binder, a press aid, a release agent, a pigment, and combinations thereof.
10. The high temperature thermally-actuated thermal cutoff device of claim 1 , wherein the high-temperature thermal pellet consists essentially of the organic polycyclic aromatic hydrocarbon compound and one or more components cumulatively present at greater than 0% to less than or equal to about 4% by weight of a total weight of the high-temperature thermal pellet, wherein the one or more components are selected from the group consisting of: binders, lubricants, press-aids, pigments, and combinations thereof.
11. A method of making a high-temperature thermally-actuated, current cutoff device, comprising:
preparing a high-temperature pellet composition comprising a single organic crystalline compound selected from triptycene or aminoanthraquinone and present at greater than or equal to about 96% by weight of the pellet to form a high-temperature thermal pellet that maintains its structural rigidity up to a transition temperature of about 240° C.;
disposing the high-temperature thermal pellet into the thermally-actuated, current cutoff device;
combining at least two distinct curable polymeric precursors for forming a cured high-temperature epoxy resin, wherein the at least two distinct curable polymeric precursors comprise a first precursor comprising bisphenol A and a second precursor comprising a hardener;
applying the at least two distinct curable polymeric precursors to one or more openings of the thermally-actuated, current cutoff device; and
curing the at least two distinct curable polymeric precursors to form a high-temperature seal comprising the cured high-temperature epoxy resin that creates a barrier that interacts with the high-temperature pellet composition to substantially prevent escape of the high-temperature pellet composition into an external environment up to the transition temperature.
12. The method of claim 11 , wherein the first precursor comprises a diglycidyl ether bisphenol A resin and the second precursor is a hardener comprising a modified imidazole compound.
13. The method of claim 12 , wherein the first precursor further comprises a component selected from the group consisting of: an elastomer, neopentyl glycol diglycidyl ether, and combinations thereof; and the second precursor comprises 2-ethyl-4-methyl-1H-imidazole.
14. The method of claim 11 , wherein the high-temperature seal is formed by combining at least three precursors, wherein the first precursor comprises a bisphenol A diglycidyl ether polymer; the second precursor comprises 1-(2-cyanoethyl)-2-ethyl-4-methyl imidazole; and a third precursor comprises benzenetetracarboxylic-1,2,4,5-dianhydride, hexahydrophthalic anhydride, and phthalic anhydride.
15. A high temperature thermally-actuated thermal cutoff device comprising:
a housing;
a high-temperature thermal pellet comprising 1-aminoanthraquinone, wherein the high-temperature thermal pellet is disposed in the housing and maintains its structural rigidity up to a transition temperature of greater than or equal to about 240° C.; and
a high-temperature epoxy seal that creates a barrier that interacts with the high-temperature thermal pellet to substantially prevent escape of the 1-aminoanthraquinone from the housing into an external environment up to the transition temperature, wherein the high-temperature epoxy seal is formed by combining at least two precursors, wherein a first precursor is selected from the group consisting of: bisphenol A diglycidyl ether, an elastomer, neopentyl glycol diglycidyl ether, and combinations thereof; and a second precursor comprises a modified imidazole compound.
16. The high temperature thermally-actuated thermal cutoff device of claim 15 , wherein the first precursor comprises a diglycidyl ether bisphenol A resin and the second precursor comprises 2-ethyl-4-methyl-1H-imidazole.
17. The high temperature thermally-actuated thermal cutoff device of claim 15 , wherein the high-temperature seal is formed by combining at least three precursors, wherein a first precursor comprises a bisphenol A diglycidyl ether polymer; a second precursor comprises 1-(2-cyanoethyl)-2-ethyl-4-methyl imidazole; and a third precursor comprises benzenetetracarboxylic-1,2,4,5-dianhydride, hexahydrophthalic anhydride, and phthalic anhydride.