IP Library Granted Patent US 8,952,310
Granted Patent B2
US 8,952,310 · App. 13/365,039 · Granted Feb 10, 2015

Plasmonic light sensors

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Quick Facts
Patent No.
US 8,952,310
App. No.
13/365,039
Granted
Feb 10, 2015
Kind
B2
Abstract

An electronic device may be provided a plasmonic light sensor. Plasmonic light sensors may include arrays of plasmonic image pixels that detect evanescent electron density waves, or plasmons, generated in the plasmonic image pixel through an interaction with incoming light. Plasmonic image pixels may include microlenses that focus the light onto conducting wires in the plasmonic image pixel. Plasmons generated on the surface of the conducting wire may propagate along the conducting wire. Detector circuitry may be coupled to the wire on which the plasmons propagate to detect the light through detection of the evanescent electron density wave. Detector circuitry may include a biasing component for biasing a photodiode such that a small amount of light results in an avalanche of charge, or a sudden increase in current, produced in the detector circuitry in response to the evanescent wave.

Claims (18)

1. A plasmonic image pixel, comprising:

a support structure;

a conducting wire attached to the support structure;

detector circuitry coupled to the conducting wire, wherein the conducting wire is configured to generate plasmons that propagate along a surface of the conducting wire in response to light, and wherein the detector circuitry is configured to detect the plasmons;

a microlens formed on the support structure that focuses the light onto the conducting wire; and

a conductive coating on the support structure, wherein the conducting wire is electrically coupled to the support structure using the conductive coating, and wherein the conductive coating comprises indium tin oxide.

2. The plasmonic image pixel defined in claim 1 further comprising an additional wire coupled between the detector circuitry and the conductive coating on the support structure.

3. A plasmonic image pixel, comprising:

a support structure;

a conducting wire attached to the support structure; and

detector circuitry coupled to the conducting wire, wherein the conducting wire is configured to generate plasmons that propagate along a surface of the conducting wire in response to light, and wherein the detector circuitry is configured to detect the plasmons;

a conductive coating on the support structure, wherein the conducting wire is electrically coupled to the support structure using the conductive coating;

an additional wire coupled between the detector circuitry and the conductive coating on the support structure wherein the detector circuitry comprises:

a p-type semiconductor layer;

an n-type semiconductor layer adjacent to the p-type semiconductor layer, wherein the n-type semiconductor layer and the p-type semiconductor layer form a p-n junction; and

a biasing element that applies a bias voltage to the p-n junction so that the plasmons that propagate along the surface of the conducting wire cause an avalanche breakdown of the p-n junction that allows a current to flow through the p-n junction, the additional wire, the conductive coating on the support structure, and the conducting wire.

4. The plasmonic image pixel defined in claim 3 , the detector circuitry further comprising circuitry coupled between the p-n junction and the support structure for measuring the current.

5. The plasmonic image pixel defined in claim 4 wherein the conducting wire comprises surface features on the surface of the conducting wire that prevent plasmons from being generated on the surface by light of a first color and that permit plasmons to be generated on the surface by light of another color that is different from the first color.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2012
From: SALSMAN, KENNETH EDWARD
To: APTINA IMAGING CORPORATION
Reel/Frame 028122/0643 →