Method and apparatus for array camera pixel readout

1. An image sensor integrated circuit, comprising:

a substrate,

a plurality of arrays of image pixels on the substrate;

first row control circuitry on the substrate that is configured to operate the image pixels of a first portion of the plurality of arrays of image pixels to capture image data;

second row control circuitry on the substrate that is configured to operate the image pixels of a second portion of the plurality of arrays of image pixels to capture additional image data;

a first line buffer for storing the image data from the image pixels of the first portion of the plurality of arrays of image pixels; and

a second line buffer for storing the image data from the image pixels of the second portion of the plurality of arrays of image pixels, wherein the second line buffer is different from the first line buffer, and the first and second line buffers are respectively capable of storing the image data from the image pixels of the first and second portion of the plurality of arrays of image pixels simultaneously.

2. The image sensor integrated circuit defined in claim 1 , further comprising:

shared readout circuitry configured to readout the image data from the image pixels of the first portion of the plurality of arrays of image pixels and the additional image data from the image pixels of the second portion of the plurality of arrays of image pixels, wherein the shared readout circuitry comprises the first and second line buffers.

3. The image sensor integrated circuit defined in claim 2 wherein the shared readout circuitry further comprises:

a selection circuit for selecting image data from the first and second line buffers.

4. The image sensor integrated circuit defined in claim 3 further comprising:

a plurality of electrical contacts on the substrate, wherein at least some of the plurality of electrical contacts are coupled to the shared readout circuitry.

5. The image sensor integrated circuit defined in claim 4 , wherein the substrate has a surface, wherein the plurality of arrays of image pixels are formed on the surface and wherein the plurality of electrical contacts comprises a plurality of bond pads formed on the surface.

6. The image sensor integrated circuit defined in claim 5 wherein the electrical contacts are formed along at least two adjacent edges of the substrate on the surface.

7. The image sensor integrated circuit defined in claim 6 wherein at least some of the image pixels comprise complementary metal-oxide-semiconductor image sensor pixels.

8. The image sensor integrated circuit defined in claim 7 further comprising:

additional circuitry on the surface of the substrate that is configured to process the captured image data from the image pixels of at least some of the plurality of arrays of image pixels.

9. A camera module, comprising:

a substrate;

an array of image sensors on the substrate, each having first and second rows of image pixel arrays for capturing image data, first and second row control circuits, and shared readout circuitry on the substrate, wherein the shared readout circuitry of each image sensor includes separate first and second buffers for simultaneously storing a portion of the image data from the image pixels of the first and second rows of image pixel arrays respectively of that image sensor, wherein the first row control circuit of each image sensor is configured to operate the image pixels of the first row of image pixel arrays of that image sensor, and wherein the second row control circuit of each image sensor is configured to operate the image pixels of the second row of image pixel arrays of that image sensor.

10. The camera module defined in claim 9 , further comprising:

an array of lenses, wherein each lens in the array of lenses is configured to focus image light onto a corresponding one of the image pixel arrays.

11. The camera module defined in claim 10 wherein the shared readout circuitry of each image sensor comprises:

a selection circuit for selecting image data from the first and second buffers.

12. The camera module defined in claim 11 , further comprising processing circuitry configured to combine the image data captured by the image pixel arrays of the array of image sensors to form output images.

13. The camera module defined in claim 12 further comprising a plurality of serial transport circuits, wherein each serial transport circuit is configured to pass the image data from a corresponding one of the image sensors to the processing circuitry.

14. The camera module defined in claim 9 , further comprising:

a plurality of electrical contacts on the substrate.

15. The camera module defined in claim 14 , wherein the substrate has a surface and an outer perimeter, wherein the first and second rows of image pixel arrays are formed on the surface, wherein the plurality of electrical contacts are formed along the outer perimeter on the surface, and wherein the plurality of electrical contacts substantially surrounds the first and second rows of image pixel arrays.

16. A method of operating an imaging system having at least first, second, third, and fourth image pixel arrays and shared readout circuitry coupled to the image pixels of the first, second, third, and fourth image pixel arrays, the method comprising:

with the image pixels in the at least first, second, third, and fourth image pixel arrays, capturing image data; and

with the shared readout circuitry, reading out the captured image data from a first image pixel of the first image pixel array followed by a corresponding first image pixel of the second image pixel array followed by a corresponding first image pixel of the third image pixel array followed by a corresponding first image pixel of the fourth image pixel array followed by a second image pixel of the first image pixel array followed by a corresponding second image pixel of the second image pixel array.

17. The method defined in claim 16 wherein the imaging system further comprises processing circuitry, the method further comprising:

with the processing circuitry, receiving the captured image data from the first image pixel of the first image pixel array and the corresponding first image pixel of the second image pixel array;

with the processing circuitry, combining the captured image data from the first image pixel of the first image pixel array and the corresponding first image pixel of the second image pixel array to form a first portion of an output image;

with the processing circuitry, receiving the captured image data from the second image pixel of the first image pixel array and the corresponding second image pixel of the second image pixel array from the shared readout circuitry; and

with the processing circuitry, combining the captured image data from the second image pixel of the first image pixel array and the corresponding second image pixel of the second image pixel array to form a second portion of an output image.

18. The method defined in claim 17 wherein the imaging system further comprises processing circuitry, the method further comprising:

with the processing circuitry, receiving the captured image data from the first image pixel of the first image pixel array, the corresponding first image pixel of the second image pixel array, the corresponding first image pixel of the third image pixel array, and the corresponding first image pixel of the fourth image pixel array;

with the processing circuitry, combining the captured image data from the first image pixel of the first image pixel array, the corresponding first image pixel of the second image pixel array, the corresponding first image pixel of the third image pixel array, and the corresponding first image pixel of the fourth image pixel array to form a first portion of an output image;

with the processing circuitry, receiving the captured image data from the second image pixel of the first image pixel array and the corresponding second image pixel of the second image pixel array from the shared readout circuitry; and

with the processing circuitry, combining at least the captured image data from the second image pixel of the first image pixel array and the corresponding second image pixel of the second image pixel array to form a second portion of an output image.