IP Library Granted Patent US 8,610,688
Granted Patent B2
US 8,610,688 · App. 13/411,343 · Granted Dec 17, 2013

Electrode crossovers

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Quick Facts
Patent No.
US 8,610,688
App. No.
13/411,343
Granted
Dec 17, 2013
Kind
B2
Abstract

In one embodiment, a touch sensor includes drive electrodes. The drive electrodes include drive electrode structures that are each coupled to an adjacent drive electrode structure by a first strip of conductive material. The touch sensor also includes sense electrodes. The sense electrodes include sense electrode structures that are each coupled to an adjacent sense electrode structure by a second strip of conductive material. The sense electrode structures are formed on a same layer as the drive electrode structures. The first or second strip of conductive material include one or more conductive crossovers that each couple two drive electrode structures to each other or couple two sense electrode structures to each other.

Claims (28)

1. A touch sensor comprising:

a plurality of drive electrodes comprising a plurality of drive electrode structures each coupled to an adjacent drive electrode structure by a first strip of conductive material; and

a plurality of sense electrodes comprising a plurality of sense electrode structures each coupled to an adjacent sense electrode structure by a second strip of conductive material, the plurality of sense electrode structures being formed on a same layer as the plurality of drive electrode structures, the first or second strip of conductive material comprising one or more conductive crossovers that each couple two drive electrode structures to each other or couple two sense electrode structures to each other;

a microcontroller configured to alternately reverse the roles of the plurality of drive electrodes and the plurality of sense electrodes by:

applying a signal at one end of the plurality of drive electrodes to drive the plurality of drive electrodes while the plurality of sense electrodes receive signals; and

applying a signal at one end of the plurality of sense electrodes to drive the plurality of sense electrodes while the plurality of drive electrodes receive signals, and

wherein at least a portion of one or more of the conductive crossovers is disposed in a separate layer from the drive or sense electrodes.

2. The touch sensor of claim 1 , further comprising insulating material separating each of the conductive crossovers from conductive material of an adjacent electrode.

3. The touch sensor of claim 1 , further comprising insulating material separating each of the conductive crossovers from conductive material of an adjacent electrode, the adjacent electrode being one of the plurality of drive or sense electrodes different from the plurality that comprises the conductive crossovers.

4. The touch sensor of claim 1 , wherein each of the electrode structures comprises a conductive mesh of lines of conductive material.

5. The touch sensor of claim 1 , wherein the conductive material comprises copper or silver.

6. The touch sensor of claim 1 , wherein the drive and sense electrode structures comprise substantially diamond-shaped electrode structures.

7. The touch sensor of claim 6 , wherein each of the substantially diamond-shaped electrode structures include a cut made to substantially split the diamond into two portions that are coupled by a narrow strip of material.

8. A device comprising:

a touch sensor comprising:

a plurality of drive electrodes comprising a plurality of drive electrode structures each coupled to an adjacent drive electrode structure by a first strip of conductive material; and

a plurality of sense electrodes comprising a plurality of sense electrode structures each coupled to an adjacent sense electrode structure by a second strip of conductive material, the plurality of sense electrode structures being formed on a same layer as the plurality of drive electrode structures, the first or second strip of conductive material comprises one or more conductive crossovers that each couple two drive electrode structures to each other or couple two sense electrode structures to each other;

a computer-readable non-transitory storage medium embodying logic that is configured when executed to control the touch sensor; and

a microcontroller configured to alternately reverse the roles of the plurality of drive electrodes and the plurality of sense electrodes by:

applying a signal at one end of the plurality of drive electrodes to drive the plurality of drive electrodes while the plurality of sense electrodes receive signals; and

applying a signal at one end of the plurality of sense electrodes to drive the plurality of sense electrodes while the plurality of drive electrodes receive signals, and

wherein at least a portion of one or more of the conductive crossovers is disposed in a separate layer from the drive or sense electrodes.

9. The device of claim 8 , further comprising insulating material separating each of the conductive crossovers from conductive material of an adjacent electrode.

10. The device of claim 8 , further comprising insulating material separating each of the conductive crossovers from conductive material of an adjacent electrode, the adjacent electrode being one of the plurality of drive or sense electrodes different from the plurality that comprises the conductive crossovers.

11. The device of claim 8 , wherein each of the electrode structures comprises a conductive mesh of lines of conductive material.

12. The device of claim 8 , wherein the conductive material comprises copper or silver.

13. The device of claim 8 , wherein the drive and sense electrode structures comprise substantially diamond-shaped electrode structures.

14. The device of claim 13 , wherein each of the substantially diamond-shaped electrode structures include a cut made to substantially split the diamond into two portions that are coupled by a narrow strip of material.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2019
From: MICROCHIP TECHNOLOGY INC.; ATMEL CORPORATION; MICROCHIP TECHNOLOGY GERMANY GMBH
To: NEODRÓN LIMITED
Reel/Frame 048259/0840 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Dec 21, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 047976/0884 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Dec 21, 2018
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 047976/0937 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2013
From: QRG LIMITED
To: ATMEL CORPORATION
Reel/Frame 030443/0353 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2013
From: HRISTOV, LUBEN; PHILIPP, HARALD
To: QRG LIMITED
Reel/Frame 030443/0317 →