Embedded component package and fabrication method

1. A structure comprising:

a substrate comprising:

an integrated circuit (IC) chip;

an active frontside surface;

an inactive backside surface, wherein the IC chip comprises a bond pad directly on the frontside surface;

a backside through via extending into the substrate from the frontside surface, the backside through via having a first length;

a backside cavity comprising a backside cavity base and backside cavity sidewalls; and

an embedded component through via extending into the substrate from the frontside surface, the embedded component through via having a second length less than the first length;

a backside passivation layer formed on the backside surface of the substrate; and

a backside cavity passivation layer formed on the backside cavity base,

wherein the backside passivation layer and the backside cavity passivation layer are separated from each other by a passivation layer gap.

2. The structure of claim 1 , comprising

a backside through via nub protruding from the backside passivation layer, where the backside through via nub comprises an end portion of a continuous metal column filling the backside through via.

3. The structure of claim 1 , wherein:

the backside cavity base is parallel to the active frontside surface; and

the backside cavity sidewalls are perpendicular to the active frontside surface.

4. The structure of claim 2 , comprising

an embedded component through via nub protruding from the backside cavity passivation layer, where the embedded component through via nub comprises an end portion of a continuous metal column filling the embedded component through via.

5. The structure of claim 1 , comprising a backside cavity side passivation layer formed on at least a portion of the backside cavity sidewalls.

6. A structure comprising:

a substrate comprising:

an integrated circuit (IC) chip;

an active frontside surface;

an inactive backside surface, wherein the IC chip comprises a bond pad directly on the frontside surface;

a backside cavity in the backside surface, the backside cavity comprising a backside cavity base and backside cavity sidewalls;

a backside through via extending through the substrate from the frontside surface to the backside surface; and

an embedded component through via extending through the substrate from the frontside surface to the backside cavity;

an encapsulant filling at least a portion of the backside cavity;

a backside passivation layer formed on the backside surface of the substrate; and

a backside cavity passivation layer formed on the backside cavity base,

wherein the backside passivation layer and the backside cavity passivation layer are separated from each other by at least a passivation layer gap.

7. A method comprising:

forming a backside through via in a substrate that comprises an integrated circuit (IC) chip;

forming an embedded component through via in the substrate;

exposing the backside through via at a backside surface of the substrate by, at least in part, grinding the substrate; and

etching a backside cavity in the backside surface to expose an embedded component through via nub of the embedded component through via, the embedded component through via nub protruding into the backside cavity, wherein said etching a backside cavity comprises:

forming a backside passivation layer on the backside surface of the substrate;

applying a patterned mask to the backside passivation layer, the patterned mask exposing an embedded component cavity region of the backside surface above the embedded component through via;

etching the embedded component cavity region to expose the embedded component through via nub; and

forming a backside cavity passivation layer on a base of the backside cavity, from which the embedded component through via nub protrudes.

8. The method of claim 7 , wherein said exposing the backside through via comprises exposing

a backside through via nub, where the backside through via nub comprises an end portion of a continuous metal column filling the backside through via.

9. The method of claim 7

wherein the embedded component through via nub comprises an end portion of a continuous metal column filling the embedded component through via.

10. The structure of claim 7 , comprising forming a backside cavity side passivation layer formed on at least a portion of the backside cavity sidewalls.

11. The method of claim 7 , wherein said exposing the backside through via comprises exposing an axial end conductive surface and a radial side conductive surface of material filling the backside through via from the backside surface of the substrate and from a passivation lining of the backside through via.

12. The method of claim 7 , further comprising:

coupling an embedded component located within the backside cavity to the embedded component through via, wherein the embedded component comprises passive electronic component comprising a first surface facing a base of the backside cavity, a second surface opposite the first surface, and a plurality of side surfaces connecting the first surface and the second surface; and

encapsulating the embedded component in an encapsulant, such that at least a portion of at least one of the plurality of side surfaces is exposed from the encapsulant.

13. The method of claim 7 , wherein:

the backside cavity base is parallel to the active frontside surface; and

the backside cavity sidewalls are perpendicular to the active frontside surface.

14. The method of claim 7 wherein the backside through via is at least six times longer than the embedded component through via.

15. The method of claim 7 , wherein said forming a backside passivation layer and said forming a backside cavity passivation layer are performed in a same manner.

16. The method of claim 7 further comprising coupling an embedded component to the embedded component through via and within the backside cavity.

17. The method of claim 16 wherein the embedded component extends from a base of the backside cavity to outside of the backside cavity.

18. The method of claim 7 , wherein the exposing the backside through via at the backside surface of the substrate comprises exposing an axial end conductive surface and a radial side conductive surface of the backside through via from the backside surface of the substrate.

19. The method of claim 7 , comprising:

coupling an embedded component positioned within the backside cavity to the embedded component through via, and

filling at least a portion of the backside cavity with an encapsulant,

wherein:

the embedded component comprises a semiconductor die comprising a first surface facing a base of the backside cavity, a second surface opposite the first surface, and a plurality of side surfaces connecting the first surface and the second surface; and

at least a portion of at least one of the plurality of side surfaces is exposed through the encapsulant.

20. The method of claim 7 , comprising:

coupling an embedded component positioned within the backside cavity to the embedded component through via, and

substantially filling the backside cavity with an encapsulant such that the embedded component is completely covered with the encapsulant, and the encapsulant extends from the backside cavity beyond a backside passivation layer on the backside surface of the substrate.