Memory device interface methods, apparatus, and systems
Apparatus and systems may include an interface chip, a first memory die having at least one memory array disposed on the interface chip, and a second memory die having at least one memory array disposed on the first memory die. The first memory die can include a plurality of vias configure allow a first plurality of through wafer interconnects (TWIs) to couple the interface chip with the second memory die, and the interface chip can be configured to communicatively couple the first memory die and the second memory die. Other apparatus, systems, and methods are disclosed.
1. An apparatus comprising:
an interface chip;
a first memory die having at least one memory array disposed on the interface chip; and
a second memory die having at least one memory array disposed on the first memory die;
wherein the first memory die includes a plurality of vias configure allow a first plurality of through wafer interconnects (TWIs) to couple the interface chip with the second memory die; and
wherein the interface chip is configured to communicatively couple the first memory die and the second memory die.
2. The apparatus of claim 1 , wherein the interface die is configured to provide electrical power management of the apparatus.
3. The apparatus of claim 1 , wherein the interface chip is configured to detect errors and correct detected errors during data communication between a processor and at least one of the first and second memory dice.
4. The apparatus of claim 1 , wherein the interface chip is configured to transmit and receive test pattern data to determine a timing level of one or more of the plurality of TWIs.
5. The apparatus of claim 1 , including a processor, the processor disposed on a second side of the interface chip opposite a first side of the interface chip upon which the first memory die is disposed.
6. The apparatus of claim 5 , wherein the interface chip includes a via configured to allow a TWI of a second plurality of TWI to pass through the interface chip to the processor.
7. The apparatus of claim 6 , wherein the interface chip includes a communication module to provide at least one of wired or wireless communication.
8. The apparatus of claim 1 , including a substrate, wherein the interface chip is disposed between the substrate and the first memory die, the interface chip including a via configured to allow a TWI of a second plurality of TWI to pass through the interface chip to the substrate.
9. The apparatus of claim 8 , including a processor, the processor disposed between the substrate and a second side of the interface chip opposite a first side of the interface chip upon with the first memory die is disposed.
10. The apparatus of claim 9 , wherein the interface chip includes a via configured to allow a TWI of a second plurality of TWIs to pass through the interface chip to the processor.
11. The apparatus of claim 1 , including a substrate, wherein the interface chip is embedded in the substrate.
12. The apparatus of claim 1 , wherein the interface chip includes a diagnostic module.
13. The apparatus of claim 1 , wherein the first memory device includes a first dynamic random access memory (DRAM) device.
14. The apparatus of claim 13 , wherein the second memory device includes a second DRAM device.
15. The apparatus of claim 13 , wherein the second memory device includes a flash device.
16. The apparatus of claim 13 , wherein the second memory device includes a static random access memory (SRAM) device.
17. A handheld electronic device comprising:
a processor; and
a memory device configured to store and retrieve information for the processor, the memory device including:
an interface chip;
a first memory die having at least one memory array disposed on the interface chip; and
a second memory die having at least one memory array disposed on the first memory die;
wherein the first memory die includes a plurality of vias configure allow a first plurality of through wafer interconnects (TWIs) to couple the interface chip with the second memory die; and
wherein the interface chip is configured to communicatively couple the first memory die and the second memory die.
18. The handheld device of claim 17 , including a substrate,
wherein the interface chip is embedded in the substrate, and
wherein the processor is disposed on the substrate adjacent the first memory die.
19. The handheld device of claim 17 , wherein the interface die includes a multiplexer/demultiplexer circuit.
20. The handheld device of claim 17 , including a maintenance bus, wherein the interface chip includes a diagnostic and built-in-self-test (BIST) module, and wherein the BIST module is configured to send command signals and data to the first and second memory die through the maintenance bus.