Film deposition method and film deposition apparatus
A film deposition method including: a step of carrying a substrate into a vacuum chamber, and placing the substrate on a turntable; a step of rotating the turntable; and an adsorption-formation-irradiation step of supplying a first reaction gas to the substrate from a first reaction gas supply part to adsorb the first reaction gas on the substrate; supplying a second reaction gas from a second reaction gas supply part so that the first reaction gas adsorbed on the substrate reacts with the second reaction gas so as to form a reaction product on the substrate; and supplying a hydrogen containing gas to a plasma generation part that is separated from the first reaction gas supply part and the second reaction gas supply part in a circumferential direction of the turntable so as to generate plasma above the turntable and to irradiate the plasma to the reaction product.
1. A film deposition method comprising:
a step of carrying a substrate into a vacuum chamber, and placing the substrate on a turntable that is rotatably provided in the vacuum chamber;
a step of rotating the turntable; and
an adsorption-formation-irradiation step of
supplying a first reaction gas to the substrate from a first reaction gas supply part so as to adsorb the first reaction gas on the substrate;
supplying a second reaction gas that is reactive with the first reaction gas to the substrate from a second reaction gas supply part so that the first reaction gas adsorbed on the substrate reacts with the second reaction gas so as to form a reaction product on the substrate; and
supplying a hydrogen containing gas from a gas introduction nozzle to a plasma generation part that is separated from the first reaction gas supply part and the second reaction gas supply part in a circumferential direction of the turntable so as to generate plasma above the turntable and to irradiate the plasma to the reaction product, wherein the plasma generation part is located above the gas introduction nozzle so that the gas introduction nozzle is located between the plasma generation part and the turntable.
2. The film deposition method as claimed in claim 1 , wherein the hydrogen containing gas is one or both of a hydrogen gas or an ammonium gas.
3. The film deposition method as claimed in claim 1 , wherein, in the adsorption-formation-irradiation step, an argon gas is supplied to the plasma generation part.
4. The film deposition method as claimed in claim 1 , wherein, in the adsorption-formation-irradiation step, an argon gas is supplied to the plasma generation part,
the hydrogen containing gas is an ammonium gas, and
a ratio of a supply amount of the ammonium gas with respect to a supply amount of the argon gas is in a range between 0.15% and 0.75%.
5. The film deposition method as claimed in claim 1 , wherein, in the adsorption-formation-irradiation step, an argon gas is supplied to the plasma generation part,
the hydrogen containing gas is an ammonium gas, and
a ratio of a supply amount of the ammonium gas with respect to a supply amount of the argon gas is in a range between 0.3% and 0.5%.
6. The film deposition method as claimed in claim 1 , further comprising a formation step before the adsorption-formation-irradiation step, the formation step including
supplying the first reaction gas to the substrate from the first reaction gas supply part so as to adsorb the first reaction gas on the substrate; and
supplying the second reaction gas that is reactive with the first reaction gas to the substrate from the second reaction gas supply part so that the first reaction gas adsorbed on the substrate reacts with the second reaction gas so as to form a reaction product on the substrate.
7. The film deposition method as claimed in claim 6 , wherein, thickness of the reaction product formed on the substrate in the formation step is determined so as to prevent the plasma from reaching the substrate in the plasma irradiation step.
8. The film deposition method as claimed in claim 1 , wherein the gas introduction nozzle has a plurality of ejection holes arranged at predetermined intervals along a longitudinal direction of the gas introduction nozzle.