IP Library Granted Patent US 8,937,272
Granted Patent B2
US 8,937,272 · App. 13/476,784 · Granted Jan 20, 2015

Vertical JFET source follower for small pixel CMOS image sensors

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,937,272
App. No.
13/476,784
Granted
Jan 20, 2015
Kind
B2
Abstract

An image sensor pixel suitable for use in a back-side-illuminated or a front-side-illuminated sensor arrangement is provided. The image sensor pixel may be a small size pixel that includes a source follower implemented using a vertical junction field effect (JFET) transistor. The vertical JFET source follower may be integrated directly into the floating diffusion node, thereby eliminating excess metal routing and pixel area typically allocated for the source follower in conventional pixel configurations. Pixel area may instead be allocated for increasing the charge storage capacity of the photodiode or can be used to reduce pixel size while maintaining pixel performance. Using a vertical junction field effect transistor in this way simplifies pixel addressing operations and minimizes random telegraph signal (RTS) noise associated with small size metal-oxide-semiconductor (MOS) transistors.

Claims (27)

1. An image sensor pixel, comprising:

a semiconductor substrate;

a photosensitive element formed in the semiconductor substrate;

a floating diffusion region that includes at least two N-type doping regions formed at respective different depths within the semiconductor substrate;

a charge transfer transistor coupled between the photosensitive element and the floating diffusion region; and

a vertical junction field effect transistor (JFET) source follower coupled to the photosensitive element via the charge transfer transistor, wherein the vertical junction field effect transistor source follower has a gate that is integrated into the floating diffusion region, wherein the vertical junction field effect transistor source follower further includes a channel that is formed from at least two P-type doping regions implanted respectively within the at least two N-type doping regions associated with the floating diffusion region.

2. The image sensor pixel defined in claim 1 , wherein the photosensitive element comprises a pinned photodiode configured to collect and store photo-generated electrons.

3. The image sensor pixel defined in claim 2 , wherein the charge transfer transistor comprises an n-channel metal-oxide-semiconductor (NMOS) transistor.

4. The image sensor pixel defined in claim 3 , further comprising:

an n-channel metal-oxide semiconductor reset transistor.

5. The image sensor pixel defined in claim 1 , wherein the vertical junction field effect transistor source follower further includes a drain that is formed from a P+ doping layer implanted beneath the at least two N-type doping regions associated with the floating diffusion region, and wherein the P+ doping layer is coupled to a ground power supply terminal.

6. The image sensor pixel defined in claim 1 , wherein the charge transfer transistor comprises a p-channel metal-oxide-semiconductor (PMOS) transistor.

7. The image sensor pixel defined in claim 6 , further comprising:

a p-channel metal-oxide semiconductor reset transistor.

8. An image sensor, comprising:

an array of image sensor pixels, wherein each image sensor pixel in the array of image sensor pixels comprises:

a semiconductor substrate;

a photosensitive element formed in the semiconductor substrate;

a floating diffusion region that includes at least two P-type doping regions formed at respective different depths within the semiconductor substrate;

a charge transfer transistor coupled between the photosensitive element and the floating diffusion region; and

a vertical junction field effect transistor (JFET) source follower coupled to the photosensitive element via the charge transfer transistor, wherein the vertical junction field effect transistor source follower has a gate that is integrated into the floating diffusion region, wherein the vertical junction field effect transistor source follower further includes a channel that is formed from at least two N-type doping regions implanted respectively within the at least two P-type doping regions associated with the floating diffusion region.

9. The image sensor defined in claim 8 , wherein each image sensor pixel in the array of image sensor pixel further comprises:

a reset transistor coupled between an adjustable power supply terminal and the floating diffusion region, wherein the reset transistor and the charge transfer transistor comprise n-channel metal-oxide-semiconductor (NMOS) transistors.

10. The image sensor pixel defined in claim 8 , wherein the photosensitive element comprises a pinned photodiode configured to collect and store photo-generated electrons.

11. The image sensor pixel defined in claim 8 , wherein the charge transfer transistor comprises an re-channel metal-oxide-semiconductor (NMOS) transistor.

12. The image sensor pixel defined in claim 8 , wherein the reset transistor comprises an n-channel metal-oxide-semiconductor (NMOS) transistor.

13. The image sensor pixel defined in claim 8 , wherein the vertical junction field effect transistor source follower further includes a drain that is formed from a N+ doping layer implanted beneath the at least two P-type doping regions associated with the floating diffusion region, and wherein the N+ doping layer is coupled to a power supply terminal.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2012
From: HYNECEK, JAROSLAV
To: APTINA IMAGING CORPORATION
Reel/Frame 028243/0586 →