IP Library Granted Patent US 8,941,014
Granted Patent B2
US 8,941,014 · App. 13/536,172 · Granted Jan 27, 2015

Complex adhesive boundaries for touch sensors

Inventor: David Brent Guard (Southampton, GB)
Assignee: Atmel Corporation
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Quick Facts
Patent No.
US 8,941,014
App. No.
13/536,172
Granted
Jan 27, 2015
Kind
B2
Abstract

In one embodiment, an apparatus includes a cover panel. The apparatus also includes a first optically clear adhesive (OCA) layer coupled to the cover panel. The apparatus also includes a substrate coupled to the first OCA layer. The substrate has drive or sense electrodes of a touch sensor disposed on a first side. The substrate also has a first connection pad region. The first connection pad region includes a first outer zone, a second outer zone, and a first connection pad zone. The first OCA layer extends to portions of at least one of the first outer zone of the first connection pad region, the second outer zone of the first connection pad region, and the first connection pad zone of the first connection pad region.

Claims (80)

1. An apparatus comprising:

a cover panel;

a first optically clear adhesive (OCA) layer coupled to the cover panel;

a substrate coupled to the first OCA layer, the substrate having drive or sense electrodes of a touch sensor disposed on a first side and having a first connection pad defining a first connection pad region;

wherein the first connection pad region comprises:

a first outer zone;

a second outer zone;

a first connection pad zone;

a second connection pad zone; and

a central zone between the first connection pad zone and the second connection pad zone;

wherein the first OCA layer extends to portions of at least one of:

the first outer zone of the first connection pad region;

the second outer zone of the first connection pad region; and

the first connection pad zone of the first connection pad region; and

a second OCA layer coupled to the substrate, such that the second OCA layer extends to portions of the central zone of the first connection pad region and to portions of at least one of:

the first outer zone of the first connection pad region;

the second outer zone of the first connection pad region; and

the second connection pad zone of the first connection pad region.

2. The apparatus of claim 1 , wherein the first OCA layer extends to portions of the first outer zone and portions of the second outer zone of the first connection pad region.

3. The apparatus of claim 1 , wherein:

the first OCA layer extends to portions of the central zone of the first connection pad region.

4. The apparatus of claim 3 , wherein the first OCA layer extends to portions of the first outer zone and portions of the second outer zone of the first connection pad region.

5. The apparatus of claim 1 , wherein the second OCA layer extends to portions of the first outer zone and portions of the second outer zone of the first connection pad region.

6. The apparatus of claim 1 , wherein the second OCA layer extends to portions of the first outer zone and portions of the second outer zone of the first connection pad region.

7. The apparatus of claim 1 , wherein the substrate has drive or sense electrodes of a touch sensor disposed on a second side.

8. The apparatus of claim 7 , wherein the first OCA layer extends to portions of the first outer zone, portions of the second outer zone, and portions of the first connection pad zone of the first connection pad region.

9. The apparatus of claim 7 , wherein the second OCA layer extends to portions of the first outer zone, portions of the second outer zone, and portions of the second connection pad zone of the first connection pad region.

10. The apparatus of claim 7 , wherein the first OCA layer extends to portions of the central zone of the first connection pad region.

11. The apparatus of claim 10 , wherein the first OCA layer extends to portions of the first outer zone, portions of the second outer zone, and portions of the first connection pad zone of the first connection pad region.

12. The apparatus of claim 7 , wherein:

the first OCA layer extends to portions of the first outer zone, portions of the second outer zone, and portions of the central zone of the first connection pad region; and

the second OCA layer extends to portions of the first outer zone, portions of the second outer zone, and portions of the central zone of the first connection pad region.

13. The apparatus of claim 12 , wherein:

the first OCA layer extends to portions of the first connection pad zone of the first connection pad region; and

the second OCA layer extends to portions of the second connection pad zone of the first connection pad region.

14. The apparatus of claim 1 , wherein the substrate has a second connection pad region offset from the first connection pad region, the second connection pad region comprising:

a first outer zone;

a second outer zone; and

a first connection pad zone.

15. The apparatus of claim 14 , wherein the first OCA layer extends to portions of at least one of:

the first outer zone of the second connection pad region;

the second outer zone of the second connection pad region; and

the first connection pad zone of the second connection pad region.

16. The apparatus of claim 14 , wherein the second OCA layer extends to portions of at least one of:

the first outer zone of the second connection pad region;

the second outer zone of the second connection pad region; and

the first connection pad zone of the second connection pad region.

17. The apparatus of claim 1 , wherein the drive or sense electrodes are made of a conductive mesh of conductive material comprising metal.

18. An apparatus comprising:

a cover panel;

a first optically clear adhesive (OCA) layer coupled to the cover panel;

a substrate coupled to the first OCA layer, the substrate having first and second connection pads defining a connection pad region, the connection pad region comprising:

a first outer zone;

a second outer zone;

a first connection pad zone;

a second connection pad zone; and

a central zone between the first connection pad zone and the second connection pad zone;

a plurality of drive electrodes of a touch sensor disposed on a first side of the substrate;

a plurality of sense electrodes of a touch sensor disposed on a second side of the substrate;

the first connection pad disposed on the first side of the substrate within the first connection pad zone of the connection pad region;

the second connection pad disposed on the second side of the substrate within the second connection pad zone of the connection pad region;

a second OCA layer coupled to the substrate;

wherein the first OCA layer extends within the connection pad region to portions of the first outer zone, portions of the central zone, and portions of the second outer zone; and

wherein the second OCA layer extends within the connection pad region to portions of the first outer zone, portions of the central zone, and portions of the second outer zone.

19. An apparatus comprising:

a cover panel;

a first optically clear adhesive (OCA) layer coupled to the cover panel;

a substrate coupled to the first OCA layer, the substrate having first and second connection pads defining a connection pad region, the connection pad region comprising:

a first outer zone;

a second outer zone;

a first connection pad zone;

a second connection pad zone; and

a central zone between the first connection pad zone and the second connection pad zone;

a plurality of drive electrodes of a touch sensor disposed on a first side of the substrate;

a plurality of sense electrodes of a touch sensor disposed on a second side of the substrate;

the first connection pad disposed on the first side of the substrate within the first connection pad zone of the connection pad region;

the second connection pad disposed on the second side of the substrate within the second connection pad zone of the connection pad region;

a second OCA layer coupled to the substrate;

wherein the first OCA layer extends within the connection pad region to portions of the first outer zone, portions of the central zone, portions of the second connection pad zone, and portions of the second outer zone; and

wherein the second OCA layer extends within the connection pad region to portions of the first outer zone, portions of the first connection pad zone, portions of the central zone, and portions of the second outer zone.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 050987/0430 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 050986/0798 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2019
From: ATMEL CORPORATION
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 050950/0594 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2012
From: ATMEL TECHNOLOGIES U.K. LIMITED
To: ATMEL CORPORATION
Reel/Frame 028577/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2012
From: GUARD, DAVID BRENT
To: ATMEL TECHNOLOGIES U.K. LIMITED
Reel/Frame 028462/0102 →
Continuity (1)
Related Publication 20140001023A1 · Jan 2, 2014