Device having and method for forming fins with multiple widths
View Patent ↗A structure for a semiconductor device is disclosed. The structure includes a first feature and a second feature. The first feature and the second feature are formed simultaneously in a single etch process from a same monolithic substrate layer and are integrally and continuously connected to each other. The first feature has a width dimension of less than a minimum feature size achievable by lithography and the second feature has a width dimension of at least equal to a minimum feature size achievable by lithography.
1. A structure for a semiconductor device, comprising:
a first feature and a second feature formed simultaneously in a single etch process from a same monolithic substrate layer, the first feature and the second feature being integrally, physically and directly connected to each other; and
the first feature having a width dimension of less than a minimum feature size achievable by lithography,
the second feature having a width dimension of at least equal to a minimum feature size achievable by lithography.
2. The structure of claim 1 , wherein the semiconductor device is a transistor device and wherein at least one of the first feature or the second feature is a fin of the transistor device.
3. The structure of claim 1 , wherein the first and second features are in a metal layer of the semiconductor device.
4. The structure of claim 1 , wherein the first and second features are in an interlevel dielectric layer of the semiconductor device.
5. The structure of claim 1 , wherein the first feature is a bar feature.
6. The structure of claim 1 , wherein the second feature is a ring feature.
7. The structure of claim 1 , wherein the first feature is a ring feature.
8. The structure of claim 1 , wherein the second feature is a bar feature.
9. A structure for a semiconductor device, comprising:
a first feature and a second feature formed simultaneously in a single etch process from a same monolithic substrate layer, the first feature and the second feature being integrally and continuously connected to each other; and
the first feature having a width dimension of less than a minimum feature size achievable by lithography,
the second feature having a width dimension of at least equal to a minimum feature size achievable by lithography,
wherein the first and second features are in a metal layer of the semiconductor device.
10. A structure for a semiconductor device, comprising:
a first feature and a second feature formed simultaneously in a single etch process from a same monolithic substrate layer, the first feature and the second feature being integrally and continuously connected to each other; and
the first feature having a width dimension of less than a minimum feature size achievable by lithography,
the second feature having a width dimension of at least equal to a minimum feature size achievable by lithography,
wherein the first and second features are in an interlevel dielectric layer of the semiconductor device.