Semiconductor device
Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially reduced when the semiconductor die is attached to the circuit board. In a non-limiting example, the semiconductor device includes: a semiconductor die comprising at least one bump; and a circuit board comprising at least one circuit pattern to which the bump is electrically connected. In a non-limiting example, the circuit board comprises: an insulation layer comprising a center region and peripheral regions around the center region; a plurality of center circuit patterns formed in the center region of the insulation layer; and a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer. The center circuit patterns may be formed wider than the peripheral circuit patterns, formed in a zigzag pattern, and/or may be formed in a crossed shape.
1. A semiconductor device comprising:
a semiconductor die comprising at least one bump; and
a circuit board comprising at least one circuit pattern to which the bump is electrically connected, wherein the circuit board comprises:
an insulation layer comprising a center region and peripheral regions around the center region;
a plurality of center circuit patterns formed in the center region of the insulation layer;
a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer; and
a protection layer,
wherein the center circuit patterns are wider than the peripheral circuit patterns, and
wherein the peripheral circuit patterns comprise:
first-direction peripheral circuit patterns disposed in mutually-facing first peripheral regions and running parallel with a first direction, wherein a respective exposed portion of each of the first-direction peripheral circuit patterns is exposed through a respective opening in the protection layer and runs parallel with the first direction; and
second-direction peripheral circuit patterns disposed in mutually-facing second peripheral regions different from the first peripheral regions, the second-direction peripheral circuit patterns running parallel with a second direction different from the first direction, wherein a respective exposed portion of each of the second-direction peripheral circuit patterns is exposed through a respective opening in the protection layer and runs parallel with the second direction.
2. The semiconductor device as claimed in claim 1 , wherein the openings in the protection layer through which the exposed portions of the peripheral circuit patterns are exposed are rectangular.
3. A semiconductor device comprising:
a semiconductor die comprising at least one bump; and
a circuit board comprising at least one circuit pattern to which the bump is electrically connected, wherein the circuit board comprises:
an insulation layer comprising a center region and peripheral regions around the center region;
a plurality of center circuit patterns formed in the center region of the insulation layer;
a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer; and
a protection layer,
wherein the center circuit patterns are wider than the peripheral circuit patterns, and
wherein:
the peripheral circuit patterns comprise first-direction peripheral circuit patterns disposed in mutually-facing first peripheral regions and running parallel with a first direction, wherein a respective exposed portion of each of the first-direction peripheral circuit patterns is exposed through a respective opening in the protection layer and runs parallel with the first direction; and
the center circuit patterns are disposed between the mutually-facing first peripheral regions of the peripheral circuit patterns, wherein a respective exposed portion of at least half of the center circuit patterns is exposed through a respective opening in the protection layer and runs parallel with a second direction different from the first direction.
4. The semiconductor device as claimed in claim 3 , wherein the center circuit patterns are at least 1.5 times wider than the peripheral circuit patterns.
5. The semiconductor device as claimed in claim 1 , wherein the center circuit patterns are at least 1.5 times wider than the peripheral circuit patterns.
6. The semiconductor device as claimed in claim 1 , wherein the center circuit patterns are about 1.5 times to about 2.5 times wider than the peripheral circuit patterns.
7. A semiconductor device comprising:
a semiconductor die comprising at least one bump; and
a circuit board comprising at least one circuit pattern to which the bump is electrically connected, wherein the circuit board comprises:
an insulation layer comprising a center region and peripheral regions around the center region;
a plurality of center circuit patterns formed in the center region of the insulation layer;
a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer; and
a protection layer,
wherein the center circuit patterns comprise:
first-direction center circuit patterns parallel with a first direction; and
second-direction center circuit patterns parallel with a second direction different from the first direction, and
wherein the peripheral circuit patterns comprise:
first-direction peripheral circuit patterns disposed in mutually-facing first peripheral regions and running parallel with the first direction, wherein a respective exposed portion of each of the first-direction peripheral circuit patterns is exposed through a respective opening in the protection layer and runs parallel with the first direction; and
second-direction peripheral circuit patterns disposed in mutually-facing second peripheral regions different from the first peripheral regions, the second-direction peripheral circuit patterns running parallel with the second direction different from the first direction, wherein a respective exposed portion of each of the second-direction peripheral circuit patterns is exposed through a respective opening in the protection layer and runs parallel with the second direction.
8. The semiconductor device as claimed in claim 7 , wherein the openings in the protection layer through which the exposed portions of the peripheral circuit patterns are exposed are rectangular.
9. The semiconductor device as claimed in claim 7 , wherein the exposed portions of the peripheral circuit patterns are linear.
10. The semiconductor device as claimed in claim 7 , wherein the center circuit patterns are at least 1.5 times wider than the peripheral circuit patterns.
11. The semiconductor device as claimed in claim 7 , wherein the center circuit patterns are about 1.5 times to about 2.5 times wider than the peripheral circuit patterns.
12. A semiconductor device comprising:
a semiconductor die comprising at least one bump; and
a circuit board comprising at least one circuit pattern to which the bump is electrically connected, wherein the circuit board comprises:
an insulation layer comprising a center region and peripheral regions around the center region;
a plurality of center circuit patterns formed in the center region of the insulation layer;
a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer; and
a protection layer,
wherein the center circuit patterns comprise:
first-direction center circuit patterns parallel with a first direction; and
second-direction center circuit patterns parallel with a second direction different from the first direction, and
wherein:
each of the first-direction center circuit patterns comprises a respective exposed portion that is exposed through a respective opening in the protection layer and runs parallel with the first direction; and
each of the second-direction center circuit patterns comprises a respective exposed portion that is exposed through a respective opening in the protection layer and runs parallel with the second direction.
13. The semiconductor device as claimed in claim 12 , wherein the center circuit patterns are at least 1.5 times wider than the peripheral circuit patterns.
14. The semiconductor device as claimed in claim 12 , wherein the openings in the protection layer through which the exposed portions of the center circuit patterns are exposed are rectangular.
15. A semiconductor device comprising:
a semiconductor die comprising at least one bump; and
a circuit board comprising at least one circuit pattern to which the bump is electrically connected, wherein the circuit board comprises:
an insulation layer comprising a center region and peripheral regions around the center region;
a plurality of center circuit patterns formed in the center region of the insulation layer;
a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer; and
a protection layer,
wherein each of the center circuit patterns has a crossed shape in at least first and second directions, and
wherein each of the center circuit patterns is exposed through a respective opening in the protection layer.
16. A semiconductor device comprising:
a semiconductor die comprising at least one bump; and
a circuit board comprising at least one circuit pattern to which the bump is electrically connected, wherein the circuit board comprises:
an insulation layer comprising a center region and peripheral regions around the center region;
a plurality of center circuit patterns formed in the center region of the insulation layer; and
a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer; and
a protection layer,
wherein each of the center circuit patterns has a crossed shape in at least first and second directions, and
wherein the peripheral circuit patterns comprise:
first-direction peripheral circuit patterns disposed in mutually-facing first peripheral regions and running parallel with the first direction, wherein a respective exposed portion of each of the first-direction peripheral circuit patterns is exposed through a respective opening in the protection layer and runs parallel with the first direction; and
second-direction peripheral circuit patterns disposed in mutually-facing second peripheral regions different from the first peripheral regions, the second-direction peripheral circuit patterns running parallel with the second direction, wherein a respective exposed portion of each of the second-direction peripheral circuit patterns is exposed through a respective opening in the protection layer and runs parallel with the second direction.
17. The semiconductor device as claimed in claim 16 , wherein the openings in the protection layer through which the exposed portions of the peripheral circuit patterns are exposed are rectangular.
18. The semiconductor device as claimed in claim 16 , wherein each of the center circuit patterns has a crossed shape in at least three directions.
19. The semiconductor device as claimed in claim 15 , wherein each of the center circuit patterns has a crossed shape in at least three directions.
20. The semiconductor device as claimed in claim 15 , wherein:
each of the peripheral circuit patterns comprises a respective exposed portion that is rectangular shaped and exposed through a respective opening in the protection layer; and
each of the center circuit patterns comprises a respective exposed portion that is cross shaped and exposed through the respective opening in the protection layer.