IP Library Granted Patent US 9,013,615
Granted Patent B2
US 9,013,615 · App. 13/591,642 · Granted Apr 21, 2015

Image sensor with flexible interconnect capabilities

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Quick Facts
Patent No.
US 9,013,615
App. No.
13/591,642
Granted
Apr 21, 2015
Kind
B2
Abstract

Electronic devices may include image sensors having configurable image sensor pixel interconnections. Image sensors may include image sensor pixels coupled to analog circuitry via configurable interconnect circuitry. The analog circuitry may include many analog circuit blocks. The analog circuit blocks may control and read out signals from associated image sensor pixels. The configurable interconnect circuitry may be controlled to reroute the connections between the analog circuit blocks and specific groups of image sensor pixels. Digital circuitry may be coupled to the analog circuitry via configurable interconnect circuitry. The digital circuitry may include digital circuit blocks. There may be significantly more image pixels controlled by a small number of analog circuit blocks, which are in turn controlled by a smaller number of digital circuit blocks. The image sensor pixel array, the configurable interconnect circuitry, the analog circuitry, and the digital circuitry may be vertically stacked.

Claims (30)

1. An image sensor, comprising:

a plurality of groups of image sensor pixels;

a plurality of control circuits operable to receive pixel output signals, wherein the control circuits are vertically stacked with respect to the image sensor pixels; and

configurable interconnect circuitry interposed between the image sensor pixels and the control circuits, wherein the configurable interconnect circuitry is operable to selectively route the pixel output signals from a selected group of image sensor pixels to at least one of the control circuits, selectively route first control signals from a first one of the control circuits to at least a first portion of image sensor pixels in the selected group, and selectively route the pixel output signals from the first portion of image sensor pixels to the first control circuit.

2. The image sensor defined in claim 1 , wherein the control circuits comprise analog control circuitry, and wherein the image sensor further comprises:

image sensor digital processing circuitry that is vertically stacked with respect to the analog control circuitry.

3. The image sensor defined in claim 2 , further comprising:

additional configurable interconnect circuitry interposed between the analog control circuitry and the image sensor digital processing circuitry.

4. The image sensor defined in claim 1 , further comprising:

addressing circuitry that is coupled to the configurable interconnect circuitry and that generates control signals for programming the configurable interconnect circuitry.

5. The image sensor defined in claim 4 , wherein the plurality of groups of image sensor pixels, the analog control circuitry, the digital processing circuitry, and the addressing circuitry are each formed on different respective integrated circuits that are each vertically stacked with respect to each other.

6. The image sensor defined in claim 1 , wherein the image sensor pixels are arranged in an array of rows and columns, wherein each group of the plurality of groups of image sensor pixels includes image sensor pixels from at least two rows and at least two columns in the array.

7. The image sensor defined in claim 6 , wherein the selected group of image sensor pixels comprises image sensor pixels from at least two adjacent rows of the array.

8. The image sensor defined in claim 7 , wherein the selected group of image sensor pixels comprises image sensor pixels from at least two adjacent columns of the array.

9. The image sensor defined in claim 6 , wherein the control circuits are configured to access each image sensor pixel in the selected group of image sensor pixels simultaneously through the configurable interconnect circuitry.

10. The image sensor defined in claim 1 , wherein the configurable interconnect circuitry is configured to selectively route second control signals from a second one of the control circuits to at least a second portion of image sensor pixels in the selected group that is different than the first portion, and wherein the configurable interconnect circuitry is configured to selectively route the pixel output signals from the second portion of image sensor pixels to the second control circuit.

11. The image sensor defined in claim 1 , wherein the plurality of groups of image sensor pixels are formed on a first integrated circuit, wherein the plurality of control circuits are formed on a second integrated circuit that is different from the first integrated circuit, wherein the second integrated circuit is vertically stacked with respect to the first integrated circuit, and wherein the configurable interconnect circuitry is formed on the first integrated circuit.

12. The image sensor defined in claim 1 , wherein the plurality of groups of image sensor pixels are formed on a first integrated circuit, wherein the plurality of control circuits are formed on a second integrated circuit that is different from the first integrated circuit, wherein the second integrated circuit is vertically stacked with respect to the first integrated circuit, and wherein the configurable interconnect circuitry is formed on the second integrated circuit.

13. The image sensor defined in claim 1 , wherein the plurality of groups of image sensor pixels are formed on a first integrated circuit, wherein the plurality of control circuits are formed on a second integrated circuit that is different from the first integrated circuit, wherein the configurable interconnect circuitry is formed on a third integrated circuit that is different from the first and second integrated circuits, wherein the second integrated circuit is vertically stacked with respect to the first integrated circuit, and wherein the third integrated circuit is vertically stacked with respect to the first integrated circuit and interposed between the first and second integrated circuits.

14. An image sensor, comprising:

a plurality of groups of image sensor pixels;

a plurality of control circuits operable to receive pixel output signals, wherein the control circuits are vertically stacked with respect to the image sensor pixels;

configurable interconnect circuitry interposed between the image sensor pixels and the control circuits, wherein the configurable interconnect circuitry is operable to selectively route the pixel output signals from a selected group of image sensor pixels to at least one of the control circuits; and

addressing circuitry that is coupled to the configurable interconnect circuitry and that generates control signals for programming the configurable interconnect circuitry, wherein the configurable interconnect circuitry comprises:

first multiplexers operable to selectively route the pixel output signals from the selected group of image sensor pixels to at least one of the control circuits; and

second multiplexers operable to selectively route pixel control signals from the at least one of the control circuits to the selected group of image sensor pixels.

15. The image sensor defined in claim 14 , wherein the configurable interconnect circuitry further comprises:

third multiplexers that receive the control signals from the addressing circuitry and that generate control bits for controlling the first and second multiplexers.

16. The image sensor defined in claim 15 , wherein the configurable interconnect circuitry further comprises:

exclusive OR gates coupled to outputs of the third multiplexers, wherein first and second multiplexers receive the control bits generated using the third multiplexers via the exclusive OR gates.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2012
From: KIRSCH, GRAHAM
To: APTINA IMAGING CORPORATION
Reel/Frame 028829/0348 →