Resistive memory devices
Electronic apparatus, systems, and methods can include a resistive memory cell having a structured as an operably variable resistance region between two electrodes and a metallic barrier disposed in a region between the dielectric and one of the two electrodes. The metallic barrier can have a structure and a material composition to provide oxygen diffusivity above a first threshold during program or erase operations of the resistive memory cell and oxygen diffusivity below a second threshold during a retention state of the resistive memory cell. Additional apparatus, systems, and methods are disclosed.
1. An apparatus comprising:
a resistive memory cell including:
two electrodes;
a dielectric structured as an operably variable resistance region between the two electrodes, the dielectric disposed on one of the two electrodes; and
a plurality of structural pairs disposed between the dielectric and the other one of the two electrodes, each structural pair having an oxide disposed on a metallic barrier, each metallic barrier having metallic conductivity properties, the structural pairs stacked on each other between the dielectric and the other one of the two electrodes, each metallic barrier having a structure and a material composition providing oxygen diffusivity above a first threshold of oxygen diffusivity during program or erase operations of the resistive memory cell and oxygen diffusivity below a second threshold of oxygen diffusivity during a retention state of the resistive memory cell, the first threshold greater than the second threshold, program and erase operations including an electric field applied between the two electrodes that is high with respect to an electric field applied between the two electrodes during a retention state.
2. The apparatus of claim 1 , wherein the structure and material composition of each metallic barrier operatively maintains a metallic state or a semiconducting state during cell operation to provide oxygen movement to allow a low resistance to the resistive memory cell.
3. The apparatus of claim 1 , wherein each metallic barrier includes one or more of Ru, RuO 2 , In 2 O 3 , or ZnO.
4. The apparatus of claim 1 , wherein one or both of the two electrodes includes one or more noble metals.
5. An apparatus comprising:
a resistive memory cell including:
a first electrode and a second electrode;
a dielectric disposed on the first electrode, the dielectric structured as an operably variable resistance region;
a plurality of structural pairs disposed between the dielectric and the second electrode, each structural pair having an oxide disposed on a metallic barrier, each metallic barrier having metallic conductivity properties, the structural pairs stacked on each other between the dielectric and the second electrode, each metallic barrier having a structure and a material composition providing oxygen diffusivity above a first threshold of oxygen diffusivity during program or erase operations of the resistive memory cell and oxygen diffusivity below a second threshold of oxygen diffusivity during a retention state of the resistive memory cell, the first threshold greater than the second threshold, program and erase operations including an electric field applied between the first and second electrodes that is high with respect to an electric field applied between the first and second electrodes during a retention state; and
an oxide of the plurality of structural pairs disposed adjacent and contacting the second electrode.
6. The apparatus of claim 5 , wherein the structure and material composition of each metallic barrier operatively maintain a metallic state or a semiconducting state during cell operation to provide oxygen movement to allow a low resistance to the resistive memory cell.
7. The apparatus of claim 5 , wherein one or more of the metallic barriers includes one or more of Ru, RuO 2 , In 2 O 3 , or ZnO.
8. The apparatus of claim 5 , wherein the dielectric includes one or more of hafnium oxide, zirconium oxide, zirconium silicon oxide, zirconium silicon oxynitride, hafnium silicon oxide, hafnium silicon oxynitride, aluminum oxide, aluminum silicon oxide, aluminum silicon oxynitride, or combinations of these materials.
9. The apparatus of claim 5 , wherein the oxide contacting the second electrode includes one or more of praseodymium calcium manganese oxide, lanthanum strontium cobalt oxide, or lanthanum strontium manganese oxide.
10. The apparatus of claim 5 , wherein one or both of the two electrodes includes one or more platinum, gold, or iridium.
11. The apparatus of claim 5 , wherein the first electrode is disposed within an insulating region below the structural pairs.
12. The apparatus of claim 5 , wherein the resistive memory cell is arranged in an array of resistive memory cells of a memory device.
13. The apparatus of claim 12 , wherein the resistive memory cells are arranged as areal resistive memory cells.