Mushroom shaped bump on repassivation
View Patent ↗Systems, methods and/or techniques for mushroom shaped bump on repassivation are described. A method of forming a chip scale package may include applying a first photoresist layer over a semiconductor wafer, developing away a portion of the first photoresist layer to define a cylindrically shaped template with substantially vertical side walls, and plating metal at least partially within the template to form a bump. The bump may include a first cylindrical base portion, a cap, and a lip formed by a portion of the cap that extends horizontally outward beyond the first cylindrical base portion. The cap and lip may be formed such that a vertical distance exists between the lip and the semiconductor wafer, defining an intrusion area. The method may include removing excess portions of the first photoresist layer, including portions residing in the intrusion area, to isolate the bump.
1. A chip scale package, comprising:
a bump formed of metal, comprising:
a cylindrical base portion with substantially vertical linear side walls,
wherein the cylindrical base portion sits directly or indirectly upon a semiconductor die;
a cap located vertically above the cylindrical base portion; and
a lip formed above the cylindrical base portion by a linear horizontal bottom portion of the cap that extends horizontally outward beyond the cylindrical base portion,
wherein the cap and lip are formed such that a vertical distance exists between the lip and the semiconductor die defining an intrusion area.
2. The chip scale package of claim 1 , wherein the bump is formed of copper.
3. The chip scale package of claim 1 , wherein the cap has a domed shape with a vertical or axial thickness that increases toward the radial center of the bump.
4. The chip scale package of claim 1 , wherein the diameter of the cylindrical base portion increases axially toward the top of the cylindrical base portion, and wherein the substantially vertical linear side walls of the cylindrical base portion slope radially outward.
5. The chip scale package of claim 1 , further comprising:
a repassivation material that covers the semiconductor die and at least partially surrounds and/or covers the bump,
wherein the repassivation material fills in the intrusion area defined by the vertical distance between the lip of the bump and the semiconductor die.
6. The chip scale package of claim 5 , wherein the repassivation material defines a via that extends vertically or axially through the repassivation material to expose a portion of the bump.
7. The chip scale package of claim 5 , wherein the repassivation material is solderbrace.
8. The chip scale package of claim 5 , wherein the repassivation material includes polybenzoxazole (PBO) and/or polyimide (PI).
9. The chip scale package of claim 1 , wherein the vertical or axial thickness of the cylindrical base portion of the bump is about 20 um, and the vertical or axial thickness of the cap of the bump is about 10 um.
10. The chip scale package of claim 9 , wherein the diameter of the cylindrical base portion of the bump is about 200 um.
11. A chip scale package, comprising:
a bump formed of metal, comprising:
a first cylindrical base portion with substantially vertical first side walls,
wherein the first cylindrical base portion sits directly or indirectly upon a semiconductor die;
a second cylindrical base portion with substantially vertical second side walls,
wherein the second cylindrical base portion is located vertically above the first cylindrical base portion,
wherein the second cylindrical base portion has a larger diameter than the first cylindrical base portion, and
wherein the first side walls of the first cylindrical base portion and the second side walls of the second cylindrical base portion together form bump side walls with a stair-stepped or multi-bend profile;
a cap located vertically above the second cylindrical base portion; and
a lip formed by a portion of the cap that extends horizontally outward beyond the second cylindrical base portion.
12. The chip scale package of claim 11 , wherein a vertical or axial thickness of the first cylindrical base portion of the bump is about 10 um and a vertical or axial thickness of the second cylindrical base portion of the bump is about 10 um.
13. The chip scale package of claim 11 , wherein the bump is formed of copper.
14. The chip scale package of claim 11 , wherein the cap has a domed shape with a vertical or axial thickness that increases toward a radial center of the bump.
15. The chip scale package of claim 11 , wherein the diameter of the second cylindrical base portion increases axially toward a top of the second cylindrical base portion, and wherein the substantially vertical second side walls of the second cylindrical base portion slope radially outward.
16. The chip scale package of claim 11 , further comprising:
a repassivation material that covers the semiconductor die and at least partially surrounds and/or covers the bump, wherein the repassivation material fills in an intrusion area defined by the vertical distance between the lip of the bump and the semiconductor die.
17. The chip scale package of claim 16 , wherein the repassivation material defines a via that extends vertically or axially through the repassivation material to expose a portion of the bump.
18. The chip scale package of claim 16 , wherein the repassivation material is solderbrace.
19. The chip scale package of claim 16 , wherein the repassivation material includes polybenzoxazole (PBO) and/or polyimide (PI).
20. The chip scale package of claim 11 , wherein a vertical or axial thickness of the cap of the bump is about 10 um.