IP Library Granted Patent US 8,498,147
Granted Patent B2
US 8,498,147 · App. 13/619,771 · Granted Jul 30, 2013

Nonvolatile memory cell, nonvolatile memory device and method for driving the same

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Quick Facts
Patent No.
US 8,498,147
App. No.
13/619,771
Granted
Jul 30, 2013
Kind
B2
Abstract

A nonvolatile memory cell is able to reduce the size per the unit area by employing a dual gate structure where the chalcogenide compound is used for a channel. The nonvolatile memory cell includes a phase-change layer, a first and a second gate that are in contact with sides of the phase-change layer to face each other across the phase-change layer and control a current flowing through the phase-change layer by each gate being arranged to induce the phase transition of the phase-change layer independently of the other.

Claims (15)

1. A nonvolatile memory device, comprising:

a plurality of first switching elements and a plurality of second switching elements formed over a substrate;

a first inter-layer dielectric layer formed to cover the first and second switching elements;

a plurality of second word lines locally formed over the first inter-layer dielectric layer;

a second inter-layer dielectric layer formed over the first inter-layer dielectric layer to expose the top surface of the second word lines;

a channel line formed over the first inter-layer dielectric layer to be in contact with the second word lines; and

a plurality of first word lines formed over the channel line to correspond to the second word lines.

2. The nonvolatile memory device of claim 1 , further comprising:

a third inter-layer dielectric layer formed over the second inter-layer dielectric layer to cover the first word lines;

first via contacts formed in the first to third inter-layer dielectric layers and connected to first and second ends of the channel line and source and drain regions of the first and second switching elements;

first metal lines connected to the first via contact;

a first inter-metal dielectric layer formed over the second inter-layer dielectric layer to cover the first metal lines; and

a bit line formed over the first inter-metal dielectric layer.

3. The nonvolatile memory device of claim 1 , wherein the first and second switching elements are formed to overlap with the channel line.

4. The nonvolatile memory device of claim 1 , further comprising an isolation layer formed in the substrate to overlap with the channel line.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS HYNIX SEMICONDUCTOR INC. NOT HYNIX-SEMICONDUCTOR INC. THERE IS NO HYPHEN IN THE NAME. PREVIOUSLY RECORDED ON REEL 67328 FRAME 814. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 14, 2024
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067412/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2024
From: SK HYNIX INC.
To: MIMIRIP LLC
Reel/Frame 067369/0832 →
CHANGE OF NAME Recorded May 6, 2024
From: HYNIX-SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 067328/0814 →