IP Library Granted Patent US 8,896,341
Granted Patent B2
US 8,896,341 · App. 13/634,726 · Granted Nov 25, 2014

Integrated circuit device, calibration module, and method therefor

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Quick Facts
Patent No.
US 8,896,341
App. No.
13/634,726
Granted
Nov 25, 2014
Kind
B2
Abstract

An integrated circuit device comprising at least one calibration module for calibrating an impedance of at least one on-die interconnect line driver in order to adaptively match an impedance between the at least one on-die interconnect line driver and at least one on-die interconnect line conjugated thereto. The at least one calibration module is arranged to receive an indication of an output signal of the at least one line driver, compare the received indication of an output signal to a reference signal and detect a presence or an absence of a voltage overshoot of the output signal of the at least one line driver, and upon detection of a presence or an absence of a voltage overshoot of the output signal of the at least one line driver, cause the adjustment of power supply of the at least one line driver, to be decreased or increased correspondingly.

Claims (27)

1. An integrated circuit device comprising:

at least one calibration module for calibrating an impedance of at least one on-die interconnect line driver in order to adaptively match an impedance between the at least one on-die interconnect line driver and at least one on-die interconnect line conjugated thereto, the at least one calibration module being arranged to receive an indication of an output signal of the at least one interconnect line driver, to compare the received indication of the output signal to a reference signal, and to detect at least one from a group consisting of:

a presence of a voltage overshoot of the output signal of the at least one interconnect line driver, and upon said presence detection to cause a power supply of the at least one line driver to be decreased; and

an absence of a voltage overshoot of the output signal of the at least one interconnect line driver, and upon said absence detection to cause the power supply of the at least one line driver to be increased.

2. The integrated circuit device of claim 1 wherein the at least one calibration module comprises a voltage comparator arranged to compare a voltage level of the output signal of the at least one line driver to a reference voltage signal, and thereupon to output an indication of whether or not a voltage overshoot has been detected.

3. The integrated circuit device of claim 2 wherein the reference voltage signal comprises a supply voltage for the at least one line driver.

4. The integrated circuit device of claim 3 wherein the at least one calibration module further comprises a calibration control unit arranged to:

receive from the voltage comparator the indication of the output signal; and based thereon, calibrate the power supply of the at least one line driver, based at least partly on the received indication.

5. The integrated circuit device of claim 3 wherein, upon receipt of an indication that a voltage overshoot has not been detected, the calibration control unit is arranged to configure an increase of power supply of the at least one line driver.

6. The integrated circuit device of claim 2 wherein the at least one calibration module further comprises a calibration control unit arranged to:

receive from the voltage comparator the indication of the output signal; and based thereon, calibrate the power supply of the at least one line driver, based at least partly on the received indication.

7. The integrated circuit device of claim 6 wherein, upon receipt of an indication that a voltage overshoot has been detected, the calibration control unit is arranged to configure a decrease of power supply of the at least one line driver.

8. The integrated circuit device of claim 7 wherein, upon receipt of an indication that a voltage overshoot has not been detected, the calibration control unit is arranged to configure an increase of power supply of the at least one line driver.

9. The integrated circuit device of claim 6 wherein, upon receipt of an indication that a voltage overshoot has not been detected, the calibration control unit is arranged to configure an increase of power supply of the at least one line driver.

10. The integrated circuit device of claim 2 wherein, upon receipt of an indication that a voltage overshoot has not been detected, the calibration control unit is arranged to configure an increase of power supply of the at least one line driver.

11. A calibration module for calibrating an impedance of at least one on-die interconnect line driver in order to adaptively match an impedance between the at least one on-die interconnect line driver and at least one on-die interconnect line conjugated thereto, the at least one calibration module being arranged to:

receive an indication of an output signal of the at least one line driver;

compare the received indication of the output signal to a reference signal; and

detect at least one from a group consisting of:

a presence of a voltage overshoot of the output signal of the at least one line driver, and upon said detection of the presence of the voltage overshoot, cause a power supply of the at least one line driver to be decreased; and

an absence of a voltage overshoot of the output signal of the at least one line driver, and upon said detection of the absence of the voltage overshoot, cause the power supply of the at least one line driver to be increased.

12. A method for calibrating an impedance of at least one on-die interconnect line driver in order to adaptively match an impedance between the at least one on-die interconnect line driver and at least one on-die interconnect line coupled thereto, the method comprising:

receiving an indication of an output signal of the at least one line driver;

comparing the received indication of the output signal to a reference signal; and

detecting at least one from a group consisting of:

a presence of a voltage overshoot of the output signal of the at least one line driver, and upon said detection of the presence of the voltage overshot, causing a power supply of the at least one line driver to be decreased; and

an absence of a voltage overshoot of the output signal of the at least one line driver, and upon said detection of the absence of the voltage overshoot, causing the power supply of the at least one line driver to be increased.

Assignments (34)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP USA, INC. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 042610/0451 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2017
From: NXP USA, INC.
To: VLSI TECHNOLOGY LLC
Reel/Frame 042374/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0614 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0652 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0633 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2012
From: SOFER, SERGEY; FEFER, YEFIM-HAIM; LIVSHITS, PAVEL
To: FREESCALE SEMICONDUCTOR INC
Reel/Frame 029168/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2012
From: SOFER, SERGEY
To: FREESCALE SEMICONDUCTOR INC
Reel/Frame 028956/0035 →