Patent Assignment
Reel/Frame 042610/0451
RELEASE OF SECURITY INTEREST
Recorded: 2017-05-29
Received: 2017-05-29
Pages: 12
Assignor
MORGAN STANLEY SENIOR FUNDING, INC.
Executed: 2017-05-02
Assignee
NXP USA, INC. F/K/A FREESCALE SEMICONDUCTOR, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TX, 78735, UNITED STATES
Covered Applications
(45)
Method of Forming Different Voltage Devices with High-K Metal Gate
App. No. 14/843,364
→
APPARATUS AND METHOD FOR PREVENTING MULTIPLE RESETS
App. No. 14/269,194
→
Method of Forming Different Voltage Devices with High-K Metal Gate
App. No. 14/021,485
→
SYSTEM AND METHOD FOR LOW-LATENCY ADDRESSING IN FLASH MEMORY
App. No. 13/925,807
→
DYNAMIC READ SCHEME FOR HIGH RELIABILITY HIGH PERFORMANCE FLASH MEMORY
App. No. 13/679,481
→
INTEGRATED CIRCUIT DEVICE, CALIBRATION MODULE, AND METHOD THEREFOR
App. No. 13/634,726
→
SENSING DEVICE AND RELATED OPERATING METHODS
App. No. 13/523,675
→
STACKED DIE SEMICONDUCTOR PACKAGE
App. No. 13/490,451
→
MRAM DEVICE AND METHOD OF ASSEMBLING SAME
App. No. 13/334,006
→
METHOD FOR SUPPLYING AN OUTPUT SUPPLY VOLTAGE TO A POWER GATED CIRCUIT AND AN INTEGRATED CIRCUIT
App. No. 12/787,457
→
PHASE-LOCKED LOOP HAVING A FEEDBACK CLOCK DETECTOR CIRCUIT AND METHOD THEREFOR
App. No. 12/695,461
→
SYSTEM AND METHOD FOR COMMUNICATING BETWEEN MULTIPLE VOLTAGE TIERS
App. No. 12/621,026
→
SYSTEM HAVING MULTIPLE VOLTAGE TIERS AND METHOD THEREFOR
App. No. 12/621,005
→
Multi-Core System on Chip
App. No. 12/618,311
→
REGULATOR HAVING INTERLEAVED LATCHES
App. No. 12/555,227
→
VOLTAGE BOOSTING SYSTEM WITH SLEW RATE CONTROL AND METHOD THEREOF
App. No. 12/537,436
→
MEMORY USING MULTIPLE SUPPLY VOLTAGES
App. No. 12/487,791
→
SEMICONDUCTOR SUBSTRATE AND METHOD OF CONNECTING SEMICONDUCTOR DIE TO SUBSTRATE
App. No. 12/471,409
→
SOFT ERROR AND TRANSIENT ERROR DETECTION DEVICE AND METHODS THEREFOR
App. No. 12/415,338
→
MEMORY WITH LEVEL SHIFTING WORD LINE DRIVER AND METHOD THEREOF
App. No. 12/209,477
→
DEVICE AND METHOD FOR CONFIGURING INPUT/OUTPUT PADS
App. No. 12/092,463
→
METHOD AND DEVICE FOR HIGH SPEED TESTING OF AN INTEGRATED CIRCUIT
App. No. 11/914,700
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METHOD FOR POWER REDUCTION AND A DEVICE HAVING POWER REDUCTION CAPABILITIES
App. No. 11/914,079
→
METHOD FOR NOISE REDUCTION IN A PHASE LOCKED LOOP AND A DEVICE HAVING NOISE REDUCTION CAPABILITIES
App. No. 11/910,062
→
METHOD AND APPARATUS FOR AFFECTING A PORTION OF AN INTEGRATED CIRCUIT
App. No. 11/624,454
→
BYTE WRITEABLE MEMORY WITH BIT-COLUMN VOLTAGE SELECTION AND COLUMN REDUNDANCY
App. No. 11/612,626
→
LOW VOLTAGE MEMORY DEVICE AND METHOD THEREOF
App. No. 11/435,942
→
MEMORY WITH LEVEL SHIFTING WORD LINE DRIVER AND METHOD THEREOF
App. No. 11/433,998
→
ARRANGEMENT, PHASE LOCKED LOOP AND METHOD FOR NOISE SHAPING IN A PHASE-LOCKED LOOP
App. No. 10/537,634
→
BIT LINE PRECHARGE IN EMBEDDED MEMORY
App. No. 11/362,694
→
PROCESS FOR FORMING AN ELECTRONIC DEVICE INCLUDING A FIN-TYPE STRUCTURE
App. No. 11/328,668
→
VOLTAGE CONTROLLED OSCILLATOR HAVING DIGITALLY CONTROLLED PHASE ADJUSTMENT AND METHOD THEREFOR
App. No. 11/251,467
→
CASCADABLE LEVEL SHIFTER CELL
App. No. 11/170,398
→
INTEGRATED CIRCUIT HAVING STRUCTURAL SUPPORT FOR A FLIP-CHIP INTERCONNECT PAD AND METHOD THEREFOR
App. No. 11/033,009
→
MEMORY BIT LINE SEGMENT ISOLATION
App. No. 10/912,824
→
TEMPERATURE COMPENSATED ON-CHIP BIAS CIRCUIT FOR LINEAR RF HBT POWER AMPLIFIERS
App. No. 10/857,040
→
Integrated circuit with a transistor over an interconnect layer
App. No. 10/423,589
→
FLIP-CHIP STRUCTURE AND METHOD FOR HIGH QUALITY INDUCTORS AND TRANSFORMERS
App. No. 10/329,081
→
METHOD FOR FORMING A COPPER INTERCONNECT USING A MULTI-PLATEN CHEMICAL MECHANICAL POLISHING (CMP) PROCESS
App. No. 10/175,637
→
METHOD AND APPARATUS FOR AFFECTING A PORTION OF AN INTEGRATED CIRCUIT
App. No. 10/157,094
→
DUAL STEERED FREQUENCY SYNTHESIZER
App. No. 09/968,178
→
MULTIPHASE VOLTAGE CONTROLLED OSCILLATOR
App. No. 09/968,171
→
METHOD OF FORMING A BOND PAD AND STRUCTURE THEREOF
App. No. 09/952,527
→
METHOD FOR ADDING FEATURES TO A DESIGN LAYOUT AND PROCESS FOR DESIGNING A MASK
App. No. 09/906,874
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METHOD FOR FORMING A COPPER INTERCONNECT USING A MULTI-PLATEN CHEMICAL MECHANICAL POLISHING (CMP) PROCESS
App. No. 09/835,276
→