Granted Patent B2

US 9,046,556 · App. 13/523,675 · Granted Jun 2, 2015

Abstract

Claims (45)

1. A sensing device comprising:

a first sensing arrangement on a substrate semiconductor die to sense a first property;

a heating arrangement to heat the first semiconductor die when activated;

a temperature sensing arrangement;

a control system coupled to the first sensing arrangement, the heating arrangement and the temperature sensing arrangement, the control system to activate the heating arrangement and automatically deactivate the heating arrangement in sync with obtaining a plurality of measurement values for the first property from the first sensing arrangement and a plurality of measured temperature values corresponding to a temperature of the first sensing arrangement from the temperature sensing arrangement concurrently to obtaining the plurality of measurement values for the first property.

2. The sensing device of claim 1 , further comprising a storage element to maintain a trim code for the first sensing arrangement, wherein the control system is coupled to the storage element to determine a temperature compensation value based on the trim code and the plurality of measured temperature values and output a temperature compensated measurement value for the first property based on the temperature compensation value and the plurality of measurement values for the first property.

3. The sensing device of claim 1 , further comprising a second die having the heating arrangement disposed thereon.

4. The sensing device of claim 3 , wherein the control system is disposed on the second die.

5. The sensing device of claim 3 , wherein the first die and the second die are encapsulated in a single device package.

6. The sensing device of claim 3 , wherein the temperature sensing arrangement is disposed on the second die.

7. The sensing device of claim 3 , wherein the first die and the second die are stacked.

8. The sensing device of claim 1 , wherein the first sensing arrangement comprises a magnetic sensing arrangement configured to sense an ambient magnetic field.

9. A method of calibrating a sensing arrangement of a sensing device, the sensing arrangement being disposed on a semiconductor die, the sensing device including a temperature sensing arrangement, a heating arrangement, and a control system coupled to the sensing arrangement, the temperature sensing arrangement, and the heating arrangement, the method comprising:

obtaining, by the control system from the sensing arrangement, a first measurement value for a first property sensed by the sensing arrangement that corresponds to a first temperature;

obtaining, by the control system from the temperature sensing arrangement, a first temperature measurement value corresponding to the first temperature concurrently to obtaining the first measurement value;

activating, by the control system, the heating arrangement to heat the semiconductor die after obtaining the first measurement value; and

after activating the heating arrangement:

obtaining, from the sensing arrangement, a second measurement value for the first property that corresponds to a second temperature;

obtaining, from the temperature sensing arrangement, a second temperature measurement value corresponding to the second temperature concurrently to obtaining the second measurement value; and

automatically deactivating, by the control system, the heating arrangement in sync with obtaining the second measurement value.

10. The method of claim 9 , further comprising:

obtaining, from the sensing arrangement after obtaining the second measurement value, a third measurement value for the first property that corresponds to a third temperature;

determining a temperature compensation value based on the third temperature and a trim code for the sensing arrangement, wherein the trim code is determined based at least in part on the first measurement value, the first temperature measurement value, the second measurement value, and the second temperature measurement value; and

adjusting the third measurement value by the temperature compensation value to obtain a temperature compensated measurement value for the first property.

11. The method of claim 9 , wherein automatically deactivating the heating arrangement in sync with obtaining the second measurement value comprises deactivating the heating arrangement concurrently to operating a sampling arrangement coupled to an output of the sensing arrangement to obtain the second measurement value.

12. The method of claim 9 , wherein the heating arrangement is disposed on a second semiconductor die encapsulated with the semiconductor die in a device package.

13. The method of claim 12 , further comprising mounting the device package to an electronics substrate prior to obtaining the first measurement value, wherein activating the heating arrangement comprises:

receiving an indication from a computing device mounted to the electronics substrate; and

activating the heating arrangement in response to receiving the indication.

14. The method of claim 13 , wherein automatically deactivating the heating arrangement in sync with obtaining the second measurement value comprises deactivating the heating arrangement while the indication is asserted.

15. The method of claim 13 , further comprising:

storing a trim code determined based at least in part on the first measurement value, the first temperature measurement value, the second measurement value, and the second temperature measurement value;

obtaining, from the sensing arrangement after obtaining the second measurement value, a third measurement value for the first property;

obtaining, from the temperature sensing arrangement, a third temperature measurement value;

determining a temperature compensation value based on the third temperature measurement value and the trim code;

adjusting the third measurement value by the temperature compensation value to obtain a temperature compensated measurement value for the first property; and

providing the temperature compensated measurement value to the computing device.

16. A system comprising:

a first semiconductor die having a magnetic sensing arrangement provided thereon; and

a second semiconductor die including:

a heating arrangement configured to heat the first semiconductor die; and

a control system provided thereon, wherein the control system is coupled to the magnetic sensing arrangement and the heating arrangement to activate the heating arrangement and automatically deactivate the heating arrangement in sync with obtaining a plurality of raw magnetic field measurement values from the magnetic sensing arrangement and a plurality of temperature measurement values corresponding to a temperature of the magnetic sensing arrangement from a temperature sensing arrangement concurrently to obtaining the plurality of raw magnetic field measurement values.

17. The system of claim 16 , wherein the temperature sensing arrangement is disposed on the second semiconductor die.

18. The system of claim 17 , further comprising a storage element on the second semiconductor die to maintain a trim code for the magnetic sensing arrangement, wherein the control system is coupled to the storage element to determine a temperature compensation value based on the plurality of temperature measurement values and the trim code and adjust a raw magnetic field measurement value from the magnetic sensing arrangement using the temperature compensation value to obtain a temperature compensated magnetic field measurement value.

19. The system of claim 16 , further comprising an electronics substrate having a computing device provided thereon, wherein the control system is coupled to the computing device via the electronics substrate to receive an indication of a desire to heat the first semiconductor die and activate the heating arrangement in response to the indication.

Assignments (33)