Methods of forming a semiconductor device with low-k spacers and the resulting device
One method disclosed herein includes forming at least one sacrificial sidewall spacer adjacent a sacrificial gate structure that is formed above a semiconducting substrate, removing at least a portion of the sacrificial gate structure to thereby define a gate cavity that is laterally defined by the sacrificial spacer, forming a replacement gate structure in the gate cavity, removing the sacrificial spacer to thereby define a spacer cavity adjacent the replacement gate structure, and forming a low-k spacer in the spacer cavity. A novel device disclosed herein includes a gate structure positioned above a semiconducting substrate, wherein the gate insulation layer has two upstanding portions that are substantially vertically oriented relative to an upper surface of the substrate. The device further includes a low-k sidewall spacer positioned adjacent each of the vertically oriented upstanding portions of the gate insulation layer.
1. A method, comprising:
forming a sacrificial gate structure above a semiconducting substrate;
forming at least one sacrificial sidewall spacer adjacent said sacrificial gate structure;
removing at least a portion of said sacrificial gate structure to thereby define a gate cavity that is laterally defined by said at least one sacrificial sidewall spacer;
forming a replacement gate structure, comprising a gate insulation layer comprising a substantially horizontal portion and two substantially vertical portions that have a vertical height, wherein the two substantially vertical portions are formed so as to be positioned on the at least one sacrificial sidewall spacer in said gate cavity;
after forming said replacement gate structure, forming a gate cap layer above said replacement gate structure and between said at least one sacrificial sidewall spacer;
after forming said gate cap layer, removing said at least one sacrificial sidewall spacer to thereby define a spacer cavity adjacent said two substantially vertical portions of said gate insulation layer of said replacement gate structure; and
forming a low-k spacer in said spacer cavity by performing a deposition process to forms a low-k material in said spacer cavity and performing a chemical mechanical polishing process to remove excess amounts of said low-k material positioned outside of said spacer cavity such that said low-k spacer in said spacer cavity is positioned horizontally adjacent to and against substantially the entire vertical height of the substantially vertical portions of the gate insulation layer of the replacement gate structure and such that an upper surface of said low-k spacer is substantially planar with an upper surface of said gate cap layer.
2. The method of claim 1 , wherein said sacrificial sidewall spacer is comprised of carbon or a material that exhibits etch selectivity relative to silicon nitride or silicon dioxide.
3. The method of claim 1 , wherein said low-k sidewall spacer is comprised of a material having a k value of less than 7.
4. The method of claim 1 , wherein said sacrificial gate structure is comprised of a silicon dioxide gate insulation layer and a polysilicon gate electrode positioned above said gate insulation layer.
5. The method of claim 1 , wherein said gate insulation layer comprised of a high-k insulating material and a gate electrode comprised of at least one layer of metal.
6. The method of claim 1 , wherein said step of removing at least a portion of said sacrificial gate structure comprises performing at least one etching process to remove a sacrificial gate electrode and a sacrificial gate insulation layer of said sacrificial gate structure.
7. The method of claim 1 , wherein said step of removing said at least one sacrificial sidewall spacer to thereby define said spacer cavity comprises performing at least one etching process to remove said sacrificial sidewall spacer.
8. The method of claim 1 , wherein prior to forming said gate cap layer, the method further comprises performing a recess etching process to remove at least a portion of said sacrificial gate structure.
9. A method, comprising:
forming a sacrificial gate structure above a semiconducting substrate;
forming at least one sacrificial sidewall spacer adjacent said sacrificial gate structure;
performing at least one etching process to remove at least a portion of said sacrificial gate structure to thereby define a gate cavity that is laterally defined by said at least one sacrificial sidewall spacer;
forming a replacement gate structure in said gate cavity, wherein said replacement gate structure comprises a gate insulation layer comprising a substantially horizontal portion and two substantially vertical portions, comprised of a high-k insulating material, that have a vertical height, wherein the two substantially vertical portions are formed so as to be positioned on the at least one sacrificial sidewall space; and a gate electrode comprised of at least one layer of metal;
after forming said replacement gate structure, forming a gate cap layer above said replacement gate structure and between said at least one sacrificial sidewall spacer;
after forming said gate cap layer, removing said at least one sacrificial sidewall spacer to thereby define a spacer cavity adjacent said two substantially vertical portions of said gate insulation layer of said replacement gate structure; and
forming a low-k spacer in said spacer cavity by performing a deposition process to form a low-k material in said spacer cavity and performing a chemical mechanical polishing process to remove excess amounts of said low-k material positioned outside of said spacer cavity such that said low-k spacer in said spacer cavity is positioned horizontally adjacent to and against substantially the entire vertical height of the substantially vertical portions of the gate insulation layer of the replacement gate structure and such that an upper surface of said low-k spacer is substantially planar with an upper surface of said gate cap layer.
10. The method of claim 9 , wherein said sacrificial sidewall spacer is comprised of carbon or a material that exhibits etch selectivity relative to silicon nitride or silicon dioxide.
11. The method of claim 9 , wherein said low-k sidewall spacer is comprised of a material having a k value of less than 7.
12. The method of claim 9 , wherein said step of performing said at least one etching process to remove at least a portion of said sacrificial gate structure comprises performing said at least one etching process to remove said sacrificial gate electrode and a sacrificial gate insulation layer of said sacrificial gate structure.
13. A method, comprising:
forming a sacrificial gate structure above a semiconducting substrate;
forming a first sacrificial sidewall spacer adjacent said sacrificial gate structure;
forming a second sacrificial sidewall spacer adjacent said first sacrificial sidewall spacer;
performing a first etching process to remove said second sacrificial sidewall spacer relative to said first sacrificial sidewall spacer to thereby define a first spacer cavity;
forming a third sacrificial sidewall spacer in said first spacer cavity adjacent said first sacrificial sidewall spacer;
after forming said third sacrificial sidewall spacer, removing at least a portion of said sacrificial gate structure to thereby define a gate cavity that is laterally defined by said first sacrificial sidewall spacer;
forming a replacement gate structure in said gate cavity;
after forming said replacement gate structure, removing at least said first and third sacrificial sidewall spacers to thereby define a second spacer cavity adjacent said replacement gate structure; and
forming a low-k spacer in said second spacer cavity.
14. A method, comprising:
forming a sacrificial gate structure above a semiconducting substrate;
forming at least one sacrificial sidewall spacer adjacent said sacrificial gate structure;
removing at least a portion of said sacrificial gate structure to thereby define a gate cavity that is laterally defined by said at least one sacrificial sidewall spacer;
forming a replacement gate structure in said gate cavity;
forming a gate cap over the replacement structure;
after forming the gate cap, removing said at least one sacrificial sidewall spacer to thereby define a spacer cavity adjacent said replacement gate structure; and
forming a low-k spacer in said spacer cavity such that an upper surface of said low-k spacer is substantially planar with an upper surface of said gate cap layer.