Method of making a logic transistor and a non-volatile memory (NVM) cell
View Patent ↗An oxide-containing layer is formed directly on a semiconductor layer in an NVM region, and a first partial layer of a first material is formed over the oxide-containing layer in the NVM region. A first high-k dielectric layer is formed directly on the semiconductor layer in a logic region. A first conductive layer is formed over the first dielectric layer in the logic region. A second partial layer of the first material is formed directly on the first partial layer in the NVM region and over the first conductive layer in the logic region. A logic device is formed in the logic region. An NVM cell is formed in the NVM region, wherein the first and second partial layer together are used to form one of a charge storage layer if the cell is a floating gate cell or a select gate if the cell is a split gate cell.
1. A method for forming a semiconductor structure having a non-volatile memory (NVM) region and a logic region, the method comprising:
forming an oxide-containing layer directly on a semiconductor layer in the NVM region;
forming a first partial layer of a first material directly on the oxide-containing layer in the NVM region;
forming a first dielectric layer having a high dielectric constant directly on the semiconductor layer in the logic region;
forming a first conductive layer directly on the first dielectric layer in the logic region;
forming a second partial layer of the first material directly on the first partial layer in the NVM region and directly on the first conductive layer in the logic region;
forming a logic device in the logic region, wherein the logic device includes a portion of the first dielectric layer and the first conductive layer; and
forming an NVM cell in the NVM region using the oxide-containing layer, the first partial layer, and the second partial layer, wherein the first partial layer and the second partial layer together are used to form one of:
a charge storage layer, wherein the NVM cell comprises a floating gate NVM cell, and
a select gate, wherein the NVM cell comprises a split gate NVM cell.
2. The method of claim 1 , wherein the step of forming the logic device in the logic region comprises:
patterning the second partial layer, the first conductive layer, and the first dielectric layer to form a logic stack in the logic region; and
replacing the second partial layer with a second conductive layer in the logic stack.
3. The method of claim 1 , wherein the NVM cell is a floating gate NVM cell and the first material is nitride.
4. The method of claim 1 , wherein the first material is polysilicon.
5. The method of claim 1 , wherein the first conductive layer comprises a metal.
6. The method of claim 1 , wherein the first conductive layer operates to set a work function of the logic device in the logic region.
7. The method of claim 1 , wherein the steps of forming the oxide-containing layer and the first partial layer comprise:
growing the oxide-containing layer on the semiconductor layer in the NVM region and the logic region;
depositing the first partial layer over the oxide-containing layer in the NVM region and the logic region; and
removing the oxide-containing layer and the first partial layer from the logic region.
8. The method of claim 1 , wherein the steps of forming the first dielectric layer and the first conductive layer comprise:
depositing the first dielectric layer over the first partial layer in the NVM region and on the semiconductor layer in the logic region;
depositing the first conductive layer over the first dielectric layer in the NVM region and the logic region; and
using the first partial layer in the NVM region as an etch stop layer to remove the first conductive layer and the first dielectric layer from the NVM region.
9. The method of claim 1 , wherein the NVM cell comprises the floating gate NVM cell, the method further comprises:
patterning the second partial layer, the first conductive layer, and the first dielectric layer to form a logic stack in the logic region;
patterning the first partial layer and the second partial layer to form the charge storage layer of the floating gate NVM cell in the NVM region;
forming a second dielectric layer over the charge storage layer in the NVM region;
removing the second partial layer from the logic stack in the logic region;
forming a second conductive layer over the second dielectric layer in the NVM region and over the first conductive layer of the logic stack in the logic region; and
patterning the second conductive layer in the NVM region to form a control gate of the floating gate NVM cell.
10. The method of claim 1 , wherein the NVM cell comprises the split gate NVM cell, the method further comprises:
patterning the second partial layer, the first conductive layer, and the first dielectric layer to form a logic stack in the logic region;
patterning the first partial layer and the second partial layer to form the select gate of the split gate NVM cell in the NVM region;
forming a second dielectric layer over the select gate in the NVM region;
removing the second partial layer from the logic stack in the logic region; and
forming a second conductive layer over the second dielectric layer in the NVM region and over the first conductive layer of the logic stack in the logic region; and
patterning the second conductive layer in the NVM region to form a control gate of the split gate NVM cell.
11. A method for forming a semiconductor structure having a non-volatile memory (NVM) region and a logic region, the method comprising:
forming an oxide-containing layer on a semiconductor layer in the NVM region and the logic region;
forming a first partial layer of a first material over the oxide-containing layer in the NVM region and the logic region;
removing the oxide-containing layer and the first partial layer from the logic region;
forming a first dielectric layer having a high dielectric constant over the first partial layer in the NVM region and over the semiconductor layer in the logic region;
forming a first conductive layer over the first dielectric layer in the NVM region and the logic region;
removing the first dielectric layer and the first conductive layer from the NVM region;
forming a second partial layer of the first material directly on the first partial layer in the NVM region and over the first conductive layer in the logic region;
forming a logic device in the logic region using the second partial layer as a dummy gate, wherein the logic device includes a portion of the first dielectric layer and the first conductive layer; and
forming an NVM cell in the NVM region using the oxide-containing layer, the first partial layer, and the second partial layer, wherein the first partial layer and the second partial layer together are used to form one of:
a charge storage layer, wherein the NVM cell comprises a floating gate NVM cell, and
a select gate, wherein the NVM cell comprises a split gate NVM cell.
12. The method of claim 11 , further comprising:
forming a second conductive layer in the NVM region and the logic region, wherein the second conductive layer is formed over the second partial layer in the NVM region and is used to replace the dummy gate of the logic device in the logic region.
13. The method of claim 11 , wherein the step of forming the oxide-containing layer on the semiconductor layer in the NVM region and the logic region comprises:
growing the oxide-containing layer on the semiconductor layer in the NVM region and the logic region.
14. The method of claim 11 , wherein the NVM cell is a floating gate NVM cell and the first material is nitride.
15. The method of claim 11 , wherein the first material is polysilicon.
16. The method of claim 11 , wherein the first conductive layer comprises a metal.
17. The method of claim 11 , wherein the first conductive layer operates to set a work function of the logic device in the logic region.
18. A method for forming a semiconductor structure having a non-volatile memory (NVM) region and a logic region, the method comprising:
forming an oxide-containing layer directly on a semiconductor layer in the NVM region;
forming a first polysilicon layer directly on the oxide-containing layer in the NVM region;
forming a first dielectric layer having a high dielectric constant directly on the semiconductor layer in the logic region;
forming a first conductive layer directly on the first dielectric layer in the logic region;
forming a second polysilicon layer directly on the first polysilicon layer in the NVM region and directly on the first conductive layer in the logic region;
forming a logic device in the logic region, wherein the logic device includes a portion of the first dielectric layer and the first conductive layer; and
forming an NVM cell in the NVM region using the oxide-containing layer, the first polysilicon layer, and the second polysilicon layer, wherein the first polysilicon layer and the second polysilicon layer together are used to form a common layer of the NVM cell.
19. The method of claim 18 , wherein the step of forming the logic device in the logic region comprises:
patterning the second polysilicon layer, the first conductive layer, and the first dielectric layer to form a logic stack in the logic region;
removing the second polysilicon layer from the logic stack;
forming a second conductive layer over the common layer of the NVM cell in the NVM region and over the first conductive layer of the logic stack; and
patterning the second conductive layer to form a control gate of the NVM cell over the common layer.
20. The method of claim 19 , wherein the common layer of the NVM cell is characterized as one of a select gate of the NVM cell or a charge storage layer of the NVM cell.