Clamping apparatus for cleaving a bonded wafer structure
View Patent ↗Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
1. An apparatus for cleaving a bonded wafer structure comprising a first wafer and a second wafer, the first wafer having a peripheral edge including a first portion, the second wafer having a peripheral edge including a second portion, the first portion disposed opposite the second portion, the apparatus comprising:
a first grasping member having one or more first annular members, the first annular members having a surface for contacting the first portion of the peripheral edge of the first wafer; and
a second grasping member having one or more second annular members, the second annular members having a surface for contacting the second portion of the peripheral edge of the second wafer, wherein the first annular member or the second annular member has an actuated edge for grasping and releasing the wafer.
2. The apparatus as set forth in claim 1 wherein the first grasping member comprises one first annular member, the first annular member being a continuous annulus.
3. The apparatus as set forth in claim 2 wherein the second grasping member comprises one second annular member, the second annular member being a continuous annulus.
4. The apparatus as set forth in claim 1 wherein the first grasping member comprises no more than one first annular member.
5. The apparatus as set forth in claim 4 wherein the second grasping member comprises no more than one second annular member.
6. The apparatus as set forth in claim 1 further comprising an actuator attached to the first grasping member, the first grasping member applying a force to the first wafer to cleave the bonded wafer structure upon activation of the actuator.
7. The apparatus as set forth in claim 6 further comprising an actuator attached to the second grasping member, the second grasping member applying a force to the second wafer to cleave the bonded wafer structure upon activation of the actuator.
8. The apparatus as set forth in claim 1 wherein the first grasping member comprises more than one annular member.
9. The apparatus as set forth in claim 8 wherein the second grasping member comprises more than one annular member.