Protecting a thermal sensitive component in a thermal process

1. A method for protecting a thermal sensitive component during a thermal process, the method comprising:

providing the thermal sensitive component disposed on a board;

providing a protection apparatus comprising a thermoelectric material; and

protecting the thermal sensitive component with the protection apparatus during the thermal process, wherein the thermal process comprises a sub-process of a board process, and the board process comprises a manufacturing process, a repairing process or a rework process, and further wherein protection apparatus actively cools the thermal sensitive component during the thermal process in response to applying a voltage to the protection apparatus.

2. The method of claim 1 , wherein the board comprises a printed circuit board.

3. The method of claim 1 , wherein the thermal process is a wave soldering process occurring at 90° C. to 260° C. and using the board having a through hole penetrable by a solder connection on the thermal sensitive component, or is a surface mount technology (SMT) reflow process occurring at 183° C. to 260° C. and using the board further comprising electronic components mounted thereon by the SMT process.

4. The method of claim 1 , further comprising:

connecting a solder connection to a printed circuit of the board by a wave soldering process, wherein the printed circuit and the thermal sensitive component are disposed on different sides of the board, respectively; and

removing the protection apparatus in response to termination of the wave soldering process.

5. The method of claim 4 , wherein, during the wave soldering process, the protection apparatus is thermally coupled to the thermal sensitive component, such that the protection apparatus provides thermal insulation to the thermal sensitive component and provides a cold source due to a thermoelectric effect to prevent the temperature of the thermal sensitive component from rising as a result of the wave soldering process.

6. The method of claim 1 , wherein the protection apparatus comprises a cap body and a battery, the cap body capping the thermal sensitive component and being in thermal communication with the thermal sensitive component during the thermal process, and the battery causing the thermoelectric material to produce a thermoelectric effect and thereby cooling the thermal sensitive component.

7. The method of claim 6 , wherein the cap body comprises a second body portion and a first body portion disposed on the second body portion, wherein one of the first body portion and the second body portion is made of an P-type thermoelectric material, wherein the other one of the first body portion and the second body portion is made of an N-type thermoelectric material.

8. The method of claim 6 , wherein the cap body comprises a first substrate body, a second substrate body, an P-type thermoelectric material chip and an N-type thermoelectric material chip which are disposed between the first substrate body and the second substrate body, and an electrode of an PN junction, wherein the first substrate body and the second substrate body are hermetically sealed to define a hermetically sealed space.

9. The method of claim 8 further comprising, before protecting the thermal sensitive component with the protection apparatus, performing a vacuum pumping process on the hermetically sealed space of the protection apparatus.