IP Library Granted Patent US 8,756,559
Granted Patent B2
US 8,756,559 · App. 13/665,256 · Granted Jun 17, 2014

Systems and methods for determining aging damage for semiconductor devices

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Quick Facts
Patent No.
US 8,756,559
App. No.
13/665,256
Granted
Jun 17, 2014
Kind
B2
Abstract

A method includes generating a circuit design and executing a simulation of the circuit design at a plurality of time slices. Type 1 damage and type 2 damage are determined for each time slice. A total type 1 damage is provided as a sum of the type 1 damage for all of the slices in which type 1 damage is greater than type 2 damage. A total type 2 damage is similarly added for the slices where the type 2 damage is dominant. A type 1 aging effect is determined based on the total type 1 damage. A type 2 aging effect is determined based on the total type 2 damage. The type 1 aging effect is added to the type 2 aging effect to obtain a total aging effect. The circuit design is tested using the total aging effect to determine if the circuit design provides adequate lifetime performance.

Claims (57)

1. A method, comprising:

in a computer system, executing logic instructions for:

generating a circuit design;

simulating operation of the circuit design at a plurality of time slices;

determining type 1 damage and type 2 damage for each time slice;

providing a total type 1 damage as a sum of the type 1 damage for all of the slices in which type 1 damage is greater than type 2 damage;

providing a total type 2 damage as a sum of the type 2 damage for all of the slices in which type 2 damage is greater than type 1 damage;

determining a type 1 aging effect based on the total type 1 damage;

determining a type 2 aging effect based on the total type 2 damage;

adding the type 1 aging effect to the type 2 aging effect to obtain a total aging effect;

executing the simulation of the circuit design using the total aging effect to determine if the circuit design provides adequate lifetime performance,

wherein

the providing the total type 1 damage includes including one half of the type 1 damage in the total type 1 damage for each slice in which the type 1 damage equals the type 2 damage; and

the providing the total type 2 damage includes including one half of the type 2 damage in the total type 2 damage for each slice in which the type 2 damage equals the type 1 damage.

2. The method of claim 1 , wherein the executing the simulation comprises determining voltages at nodes of the circuit design at the plurality of time slices, wherein the circuit design includes a plurality of transistors wherein each transistor of the plurality of transistors is simulated at the plurality of time slices.

3. The method of claim 1 , wherein the determining the type 1 aging effect based on the total type 1 damage comprises an extrapolation of the type 1 damage for a predetermined time period.

4. The method of claim 3 , wherein the determining the type 1 aging effect is further characterized by the predetermined time period being an expected operational lifetime of the circuit design.

5. The method of claim 1 , the determining the type 2 aging effect based on the total type 2 damage comprises an extrapolation of the type 2 damage for a predetermined time period.

6. The method of claim 1 , further comprising providing an altered circuit design if the circuit design does not provide adequate lifetime performance.

7. The method of claim 1 , further comprising determining damage recovery for each time slice, and including the damage recovery in at least one of the total type 1 damage and the total type 2 damage.

8. The method of claim 1 , wherein the determining type 1 damage comprises determining bias temperature instability damage.

9. The method of claim 1 , wherein the determining type 2 damage comprises determining hot carrier injection damage.

10. A method, comprising:

in a computerized electronic design automation system:

generating a circuit design;

executing a simulation of the circuit design to provide voltages at nodes of a plurality of transistors that comprise the circuit design at a plurality of time slices;

determining damage due to a type 1 cause and a type 2 cause for each time slice of the plurality of time slices for each transistor of the plurality of transistors by determining which of the type 1 cause and the type 2 cause is a dominant cause of damage for each time slice;

adding the damage for all of the slices in which the type 1 cause is the dominant cause of damage to obtain a total type 1 damage for each transistor of the plurality of transistors;

determining an aging effect due to the type 1 cause based on the total type 1 damage for each transistor of the plurality of transistors;

adding the damage for all of the slices in which the type 2 cause is the dominant cause of damage to obtain a total type 2 damage;

determining an aging effect due to the type 2 cause based on the total type 2 damage for each transistor of the plurality of transistors;

adding the aging effect due to the type 1 cause to the aging effect due to the type 2 cause to obtain a total aging effect for each transistor of the plurality of transistors, wherein if the determining which of the type 1 cause and type 2 cause is a dominant cause of damage for each time slice results in a determination that the damage due to the type 1 cause is equal to the damage due to the type 2 cause, then attributing one half of the damage to each of the total type 1 damage and the total type 2 damage;

applying the total aging effect to the circuit design for each transistor of the plurality of transistors;

executing the simulation of the circuit design with the total aging effect added;

altering the circuit to obtain an altered circuit design if the testing the circuit design reveals inadequate performance.

11. The method of claim 10 , wherein the determining the aging effect due to the type 1 cause comprises extrapolating the total type 1 damage based on a predetermined time period to obtain a time-based type 1 damage estimate and using the time-based type 1 damage estimate to obtain the aging effect due to the type 1 cause.

12. The method of claim 11 , wherein the determining the aging effect due to the type 1 cause is further characterized by the predetermined time being an expected lifetime of an operation of the circuit design.

13. The method of claim 12 , further comprising making an integrated circuit having a circuit with the altered circuit design.

14. The method of claim 13 , wherein the executing the simulation is further characterized by the voltages at nodes comprising a gate/source voltage and a drain/source voltage for each transistor.

15. The method of claim 10 , wherein the determining damage is further characterized by the type 1 cause comprises bias temperature instability and the type 2 cause comprises hot carrier injection.

16. A method, comprising:

executing logic instructions in a computerized design system configured for:

generating a circuit design;

executing a simulation of the circuit design at a plurality of time slices to identify voltages at nodes of transistors that comprise the circuit design;

determining type 1 damage and type 2 damage for each time slice using the voltages at the nodes for each time slice of the plurality of time slices;

providing a total type 1 damage as a sum of the type 1 damage for all of the slices in which type 1 damage is greater than type 2 damage and including one half of the type 1 damage in the total type 1 damage for each slice in which the type 1 damage equals the type 2 damage;

providing a total type 2 damage as a sum of the type 2 damage for all of the slices in which type 2 damage is greater than type 1 damage and including one half of the type 2 damage in the total type 2 damage for each slice in which the type 2 damage equals the type 1 damage;

extrapolating the total type 1 damage for an expected lifetime of an operation of a circuit having the circuit design to obtain an extrapolated type 1 damage;

extrapolating the total type 2 damage for the expected lifetime of the operation of the circuit having the circuit design to obtain an extrapolated type 2 damage;

determining a type 1 aging effect based on the extrapolated type 1 damage;

determining a type 2 aging effect based on the extrapolated type 2 damage;

adding the type 1 aging effect to the type 2 aging effect to obtain a total aging effect;

executing the simulation of the circuit design using the total aging effect to determine if the circuit design provides adequate lifetime performance.

17. The method of claim 16 , further comprising:

altering the circuit design to obtain an altered circuit design if the testing the circuit design does not determine that the circuit design provides adequate performance; and

making an integrated circuit that includes a circuit according to the altered circuit design.

18. The method of claim 16 , wherein the determining the type 1 damage comprises determining bias temperature instability damage and determining the type 2 damage comprises determining hot carrier injection damage.

Assignments (20)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Jan 14, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0671 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0685 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
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To: CITIBANK, N.A., AS COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2012
From: SHROFF, MEHUL D.; ABRAMOWITZ, PETER P.
To: FREESCALE SEMICONDUCTOR, INC.
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