Semiconductor device and driver circuit with an active device and isolation structure interconnected through a diode circuit, and method of manufacture thereof
View Patent ↗Embodiments of semiconductor devices and driver circuits include a semiconductor substrate having a first conductivity type, an isolation structure (including a sinker region and a buried layer), an active device within area of the substrate contained by the isolation structure, and a diode circuit. The buried layer is positioned below the top substrate surface, and has a second conductivity type. The sinker region extends between the top substrate surface and the buried layer, and has the second conductivity type. The active device includes a body region of the second conductivity type, and the diode circuit is connected between the isolation structure and the body region. The diode circuit may include one or more Schottky diodes and/or PN junction diodes. In further embodiments, the diode circuit may include one or more resistive networks in series and/or parallel with the Schottky and/or PN diode(s).
1. A semiconductor device, comprising:
a semiconductor substrate having a first conductivity type and a top substrate surface;
a buried layer below the top substrate surface, wherein the buried layer has a second conductivity type that is different from the first conductivity type;
a sinker region between the top substrate surface and the buried layer, wherein the sinker region has the second conductivity type, and an isolation structure is formed by the sinker region and the buried layer;
an active device in a portion of the semiconductor substrate contained by the isolation structure, wherein the active device includes
a body region of the second conductivity type, wherein the body region and the isolation structure are separated by a portion of the semiconductor substrate having the first conductivity type, and
a source region of the first conductivity type formed in the body region; and
a diode circuit connected between the isolation structure and the body region.
2. The semiconductor device of claim 1 , wherein the diode circuit comprises:
a Schottky diode formed from a Schottky contact coupled with the isolation region.
3. The semiconductor device of claim 2 , wherein the diode circuit further comprises:
a resistive network in series with the Schottky diode.
4. The semiconductor device of claim 2 , wherein the diode circuit further comprises:
a resistive network in series with the Schottky diode; and
a resistive network in parallel with the Schottky diode.
5. The semiconductor device of claim 1 , further comprising:
a further region of the first conductivity type extending into the sinker region, wherein the diode circuit comprises a PN junction diode formed between the further region and the sinker region.
6. The semiconductor device of claim 1 , wherein the diode circuit comprises a polycrystalline silicon diode interconnected between the body region and the sinker region.
7. The semiconductor device of claim 1 , wherein the active device further comprises:
a drift region of the first conductivity type within a central portion of the active area and extending from the top substrate surface into the semiconductor substrate; and
a drain region of the first conductivity type extending into the drift region from the top substrate surface.
8. A semiconductor device, comprising:
a semiconductor substrate having a first conductivity type and a top substrate surface;
a buried layer below the top substrate surface, wherein the buried layer has a second conductivity type that is different from the first conductivity type;
a sinker region between the top substrate surface and the buried layer, wherein the sinker region has the second conductivity type, and an isolation structure is formed by the sinker region and the buried layer;
an active device in a portion of the semiconductor substrate contained by the isolation structure, wherein the active device includes a body region of the second conductivity type, wherein the body region and the isolation structure are separated by a portion of the semiconductor substrate having the first conductivity type; and
a diode circuit connected between the isolation structure and the body region, wherein the diode circuit includes
a Schottky diode formed from a Schottky contact coupled with the isolation region, and
a resistive network in parallel with the Schottky diode between the isolation structure and the body region.