IP Library Granted Patent US 8,742,538
Granted Patent B2
US 8,742,538 · App. 13/671,595 · Granted Jun 3, 2014

SiGe HBT and manufacturing method thereof

Inventor: Wensheng Qian (Shanghai, CN)
Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,742,538
App. No.
13/671,595
Granted
Jun 3, 2014
Kind
B2
Abstract

A silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) is disclosed, which includes: two isolation structures each being formed in a trench; a set of three or more pseudo buried layers formed under each trench with every adjacent two pseudo buried layers of the set being vertically contacted with each other; and a collector region. In this design, the lowermost pseudo buried layers of the two sets are laterally in contact with each other, and the collector region is surrounded by the two isolation structures and the two sets of pseudo buried layers. As the breakdown voltage of a SiGe HBT according to the present invention is determined by the distance between an uppermost pseudo buried layer and the edge of an active region, SiGe HBTs having different breakdown voltages can be achieved. A manufacturing method of the SiGe HBT is also disclosed.

Claims (9)

1. A silicon-germanium (SiGe) heterojunction bipolar transistor (HBT), comprising:

a substrate;

two trenches formed in the substrate, each having an isolation structure formed therein;

two sets of pseudo buried layers, each set being formed in the substrate under a corresponding trench, each set comprising three or more pseudo buried layers with every adjacent two pseudo buried layers vertically contacting with each other, the lowermost pseudo buried layers of the two sets laterally contacting with each other, the uppermost pseudo buried layer of each set being in contact with its corresponding trench; and

a collector region, surrounded by the isolation structures in the two trenches and the two sets of pseudo buried layers.

2. The SiGe HBT according to claim 1 , wherein except for the lowermost pseudo buried layer, each of the other pseudo buried layers in a set is not laterally connected to its corresponding pseudo buried layer in the other set.

3. The SiGe HBT according to claim 1 , wherein each trench has a cross section shape of trapezoid, which is narrow at top and wide at bottom.

4. The SiGe HBT according to claim 1 , wherein the collector region has a cross section shape of an inverted “T”, which is narrow at top and wide at bottom with recessed portions around its middle part on both sides.

5. The SiGe HBT according to claim 4 , wherein on each side of the collector region, a distance between the uppermost pseudo buried layer and the recessed portion is adjustable.

Assignments (2)
MERGER Recorded May 13, 2014
From: SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
To: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 032885/0047 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2012
From: QIAN, WENSHENG
To: SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
Reel/Frame 029260/0963 →
Priority Claims (1)
CN 2011 1 0349921 · Nov 8, 2011 · national
Continuity (1)
Related Publication 20130113022A1 · May 9, 2013