Parasitic lateral PNP transistor and manufacturing method thereof
A parasitic lateral PNP transistor is disclosed, in which, an N-type implanted region formed in each of two adjacent active regions forms a base region; a P-type doped polysilicon pseudo buried layer located under a shallow trench field oxide region between the two active regions serves as an emitter; and a P-type doped polysilicon pseudo buried layer located under each of the shallow trench field oxide regions on the outer side of the active regions serves as a collector region. The transistor has a C-B-E-B-C structure which alters the current path in the base region to a straight line, which can improve the current amplification capacity of the transistor and thus leads to a significant improvement of its current gain and frequency characteristics, and is further capable of reducing the area and increasing current intensity of the transistor. A manufacturing method of the parasitic lateral PNP transistor is also disclosed.
1. A parasitic lateral PNP transistor, comprising:
a P-type substrate;
three shallow trench field oxide regions formed in the substrate;
an N-type implanted layer formed beneath a top surface of the substrate and surrounding the three shallow trench field oxide regions, the N-type implanted layer including two portions each located between two adjacent ones of the three shallow trench field oxide regions and serving as a base region of the parasitic lateral PNP transistor;
two N-type polysilicon layers formed on the top surface of the substrate and contacting with the two portions of the N-type implanted layer;
a polysilicon pseudo buried layer formed under a bottom of each of the shallow trench field oxide regions and including a P-type impurity;
a P-type doped region, formed around each polysilicon pseudo buried layer; wherein each P-type doped region is surrounded by and contacting with the N-type implanted layer,
wherein the polysilicon pseudo buried layer and the P-type doped region under a bottom of a middle one of the three shallow trench field oxide regions jointly serve as an emitter region of the parasitic lateral PNP transistor, and the polysilicon pseudo buried layer and the P-type doped region under a bottom of each of the shallow trench field oxide regions adjacent to the middle shallow trench field oxide region jointly serve as a collector region of the parasitic lateral PNP transistor.
2. The parasitic lateral PNP transistor according to claim 1 , wherein a width of the polysilicon pseudo buried layer is smaller than or equal to that of the bottom of the shallow trench field oxide region, and the width of the polysilicon pseudo buried layer is 0.05 μm to 0.3 μm.
3. The parasitic lateral PNP transistor according to claim 1 , wherein a depth of the bottom of the shallow trench field oxide region is 0.3 μm to 0.5 μm.
4. The parasitic lateral PNP transistor according to claim 1 , wherein a distance between the emitter region and each of the collector regions is 0.4 μm to 2 μm.
5. The parasitic lateral PNP transistor according to claim 1 , further comprising:
a metal contact formed on a top of each N-type polysilicon layer to pick up a base;
a first deep hole contact formed in the shallow trench field oxide region that is located on a top of the emitter region, the first deep hole contact contacting with the emitter region to pick up an emitter; and
a second deep hole contact formed in each of the shallow trench field oxide regions that are located on top of the collector regions, the second deep hole contact contacting with the corresponding collector region to pick up a collector.
6. A method of manufacturing a parasitic lateral PNP transistor, comprising:
providing a P-type substrate;
etching the P-type substrate to form three shallow trenches therein;
forming a groove at a bottom of each of the three shallow trenches;
filling polysilicon into each groove to form a polysilicon pseudo buried layer therein;
implanting a P-type impurity into each polysilicon pseudo buried layer and causing the implanted P-type impurity to diffuse such that a P-type doped region is formed around each polysilicon pseudo buried layer, wherein the polysilicon pseudo buried layer and the P-type doped region under a bottom of a middle one of the three trenches jointly serve as an emitter region of the parasitic lateral PNP transistor, and the polysilicon pseudo buried layer and the P-type doped region under a bottom of each of the shallow trenches adjacent to the middle shallow trench jointly serve as a collector region of the parasitic lateral PNP transistor;
filling an oxide into each of the shallow trenches to form a shallow trench field oxide region therein;
implanting an N-type impurity into the substrate and causing the implanted N-type impurity to diffuse so as to form an N-type implanted layer beneath a top surface of the substrate and surrounding the three shallow trenches and the polysilicon pseudo buried layer and the P-type doped region under each shallow trench, wherein two portions of the N-type implanted layer each located between two adjacent ones of the three shallow trenches serve as two base regions of the parasitic lateral PNP transistor; and
forming an N-type polysilicon layer on the top surface of the substrate and contacting with the two portions of the N-type implanted layer.
7. The method according to claim 6 , further comprising:
forming a metal contact on a top of each N-type polysilicon layer to pick up a base;
forming a first deep hole contact in the shallow trench field oxide region that is located on a top of the emitter region, the first deep hole contact contacting with the emitter region to pick up an emitter; and
forming a second deep hole contact in each of the shallow trench field oxide regions that are located on top of the collector regions, the second deep hole contact contacting with the corresponding collector region to pick up a collector.
8. The method according to claim 6 , wherein forming a groove at a bottom of each of the shallow trenches comprises:
depositing a first dielectric layer on the top surface of the P-type substrate;
removing a portion of the first dielectric layer formed over a bottom of each shallow trench by using an etching process such that the remaining portion of the first dielectric layer forms inner sidewalls over inner side faces of each shallow trench; and
forming a groove at the bottom of each shallow trench by an over-etch process to the P-type substrate.
9. The method according to claim 8 , further comprising removing the inner sidewalls prior to filling an oxide into each of the shallow trenches.
10. The method according to claim 8 , wherein the first dielectric layer is an oxide film or a nitride film or a composite film consisting of an oxide film and a nitride film.
11. The method according to claim 6 , wherein a width of the groove is smaller than or equal to that of the bottom of the shallow trench, and the width of the groove is 0.05 μm to 0.3 μm.
12. The method according to claim 6 , wherein the P-type impurity is implanted with an implantation dose of 5e14 cm −2 to 5e15 cm −2 and an implantation energy of 3 KeV to 30 KeV, and the P-type impurity is boron or boron fluoride.
13. The method according to claim 6 , wherein the N-type impurity is implanted with an implantation dose of 1e11 cm −2 to 1e13 cm −2 and an implantation energy of 200 KeV to 1000 KeV, and the N-type impurity is phosphorus or arsenic.
14. The method according to claim 6 , wherein the N-type polysilicon layer is formed by in-situ doping.
15. The method according to claim 6 , wherein the N-type polysilicon layer is formed by first growing a non-doped polysilicon layer and then doping it by ion implantation with an implantation dose of 1e15 cm −2 to 1e16 cm −2 .