IP Library Granted Patent US 8,648,993
Granted Patent B2
US 8,648,993 · App. 13/678,226 · Granted Feb 11, 2014

Combined serial/parallel light configuration and single layer PCB containing the same

Inventors: William Dunn (Alpharetta, GA); David Williams (Canton, GA)
Assignee: Manufacturing Resources International, Inc.
H05B37/02A61N5/06
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Quick Facts
Patent No.
US 8,648,993
App. No.
13/678,226
Granted
Feb 11, 2014
Kind
B2
Abstract

An LED circuit using a combination of series and parallel arrangements for optimum current sharing between LEDs. The current paths allow an LED to fail while minimizing the effect on other LEDs and noticeable luminance variance across the circuit. Some embodiments use metallic PCB technology which permits optimal thermal regulation of heat generated by the LEDs. Exemplary embodiments can be used with a single-layer PCB where only one layer of conducting material must be placed on the substrate. A constricted convection plate may be positioned behind the rear surface of the PCB to define a channel. One or more fans may be positioned to force cooling air through the channel. An LCD assembly using the same is also disclosed.

Claims (81)

1. An LED illumination assembly comprising:

a single-conducting-layer PCB having oppositely facing front and rear surfaces;

a first group of LEDs mounted on the front surface of the PCB and connected in both parallel and series with one another by the single conduction layer;

a second group of LEDs mounted on the front surface of the PCB and connected in both parallel and series with one another by the single conduction layer, where the second group is also connected in parallel to the first group by the single conduction layer;

a positive conduction line on the front surface of the PCB and connecting to the first and second groups, where the positive conduction line is defined by the single conduction layer;

a negative conduction line on the front surface of the PCB and connecting to the first and second groups, where the negative conduction line is defined by the single conduction layer;

a constricted convection plate positioned behind the rear surface of the PCB, the space between the constricted convection plate and the rear surface of the PCB defining a cooling channel; and

a fan positioned to force cooling air through the channel.

2. The LED illumination assembly of claim 1 wherein:

the fan is positioned to draw cooling air through the channel.

3. The LED illumination assembly of claim 1 wherein:

the PCB has an aluminum substrate.

4. The LED illumination assembly of claim 1 wherein:

the fan is positioned to push cooling air through the channel.

5. The LED illumination assembly of claim 1 wherein:

the rear surface of the PCB is metallic.

6. An LED illumination assembly comprising:

a PCB having oppositely facing front and rear surfaces;

a power source;

a positive conduction line connected to the power source;

a first group of LEDs connected in parallel with each other and connected to the positive conduction line;

a second group of LEDs connected in parallel with each other and connected to the first group of LEDs in series;

a third group of LEDs connected in parallel with each other and connected to the second group of LEDs in series;

a fourth group of LEDs connected in parallel with each other and connected to the positive conduction line;

a fifth group of LEDs connected in parallel with each other and connected to the fourth group of LEDs in series;

a sixth group of LEDs connected in parallel with each other and connected to the firth group of LEDs in series;

a negative conduction line connected to the third and sixth groups of LEDs and returning to the power source;

a constricted convection plate positioned behind the rear surface of the PCB, the space between the constricted convection plate and the rear surface of the PCB defining a cooling channel; and

a fan positioned to force cooling air through the channel.

7. The LED illumination assembly of claim 6 wherein:

the positive and negative conduction lines are defined by a single layer.

8. The LED illumination assembly of claim 6 further comprising:

a seventh group of LEDs connected in parallel with each other and connected in series with the third group of LEDs and the negative conduction line.

9. An LED illumination assembly comprising:

a substrate having front and rear sides;

a layer of dielectric material placed on the front side;

a single layer of conductive material placed atop the layer of dielectric material and electrically connecting:

a positive conduction line,

a first group of LEDs connected in parallel with each other and connected to the positive conduction line,

a second group of LEDs connected in parallel with each other and connected to the first group of LEDs in series,

a third group of LEDs connected in parallel with each other and connected to the second group of LEDs in series,

a fourth group of LEDs connected in parallel with each other and connected to the positive conduction line,

a fifth group of LEDs connected in parallel with each other and connected to the fourth group of LEDs in series,

a sixth group of LEDs connected in parallel with each other and connected to the firth group of LEDs in series, and

a negative conduction line connected to the third and sixth groups of LEDs;

a constricted convection plate positioned behind the rear side of the substrate, the space between the constricted convection plate and the rear side of the substrate defining a cooling channel; and

a fan positioned to draw cooling air through the channel.

10. The LED illumination assembly of claim 9 further comprising:

a power source in electrical communication with the positive and negative conduction lines.

11. The LED illumination assembly of claim 9 wherein:

the substrate is metallic.

12. The LED illumination assembly of claim 11 wherein:

the substrate is aluminum.

13. The LED illumination assembly of claim 9 further comprising:

a second fan positioned to push cooling air through the channel.

14. The LED illumination assembly of claim 13 wherein:

the second fan is pushing cooling air that has been air conditioned.

15. A liquid crystal assembly comprising:

an LCD;

a backlight assembly placed behind the LCD, the backlight assembly having:

a PCB having oppositely facing front and rear surfaces;

a positive conduction line on the PCB;

a power source electrically connected to the positive conduction line;

a plurality of LEDs attached to the front surface of the single-layer PCB and electrically connected such that:

a first group of LEDs connected in parallel with each other and connected to the positive conduction line,

a second group of LEDs connected in parallel with each other and connected to the first group of LEDs in series,

a third group of LEDs connected in parallel with each other and connected to the second group of LEDs in series,

a fourth group of LEDs connected in parallel with each other and connected to the positive conduction line,

a fifth group of LEDs connected in parallel with each other and connected to the fourth group of LEDs in series, and

a sixth group of LEDs connected in parallel with each other and connected to the firth group of LEDs in series,

a negative conduction line connected to the third and sixth group of LEDs and returning to the power source,

a constricted convection plate positioned behind the rear surface of the PCB, the space between the constricted convection plate and the rear surface of the PCB defining a cooling channel; and

a fan positioned to force cooling air through the channel.

16. The liquid crystal assembly of claim 15 wherein:

the PCB is a metal core PCB.

17. The liquid crystal assembly of claim 15 wherein:

the PCB is aluminum.

18. The liquid crystal assembly of claim 15 wherein:

the fan is positioned to draw cooling air through the channel.

19. The liquid crystal assembly of claim 18 further comprising:

the fan is positioned to push cooling air through the channel.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 24, 2018
From: FIFTH THIRD BANK
To: MANUFACTURING RESOURCES INTERNATIONAL, INC
Reel/Frame 046924/0379 →
RELEASE OF SECURITY INTEREST Recorded Jun 15, 2018
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: MANUFACTURING RESOURCES INTERNATIONAL, INC
Reel/Frame 047227/0329 →
SECURITY AGREEMENT Recorded Jul 10, 2013
From: MANUFACTURING RESOURCES INTERNATIONAL, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 030776/0308 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2013
From: DUNN, WILLIAM; WILLIAMS, DAVID
To: MANUFACTURING RESOURCES INTERNATIONAL, INC.
Reel/Frame 029718/0876 →
Continuity (24)
Continuation 12693148 · Jan 25, 2010
Continuation In Part 12556029 · Sep 9, 2009
Continuation In Part 12556209 · Sep 9, 2009
Continuation In Part 12266749 · Nov 7, 2008
Continuation In Part 12411925 · Mar 26, 2009
Continuation In Part 12620330 · Nov 17, 2009
Continuation In Part 12641468 · Dec 18, 2009
Continuation In Part 12234307 · Sep 19, 2008
Continuation In Part 12209841 · Sep 12, 2008
Continuation In Part 12235232 · Sep 22, 2008
Provisional Application 61147063 · Jan 23, 2009
Provisional Application 61153148 · Feb 17, 2009
Provisional Application 61152879 · Feb 16, 2009
Provisional Application 61252295 · Oct 16, 2009
Provisional Application 61095615 · Sep 9, 2008
Provisional Application 61095616 · Sep 9, 2008
Provisional Application 61060575 · Jun 11, 2008
Provisional Application 61039454 · Mar 26, 2008
Provisional Application 61115333 · Nov 17, 2008
Provisional Application 61138736 · Dec 18, 2008
Provisional Application 61033064 · Mar 3, 2008
Provisional Application 61060504 · Jun 11, 2008
Provisional Application 61061032 · Jun 12, 2008
Related Publication 20130278867A1 · Oct 24, 2013