IP Library Granted Patent US 9,335,170
Granted Patent B2
US 9,335,170 · App. 13/687,299 · Granted May 10, 2016

Inertial sensor and method of levitation effect compensation

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,335,170
App. No.
13/687,299
Granted
May 10, 2016
Kind
B2
Abstract

An inertial sensor ( 110 ) includes a drive system ( 118 ) configured to oscillate a drive mass ( 114 ) within a plane ( 24 ) that is substantially parallel to a surface ( 50 ) of a substrate ( 28 ). The drive system ( 118 ) includes first and second drive units ( 120, 122 ) having fixed fingers ( 134, 136 ) interleaved with movable fingers ( 130, 132 ) of the drive mass ( 114 ). At least one of the drive units ( 120 ) is located on each side ( 126, 128 ) of the drive mass ( 114 ). Likewise, at least one of the drive units ( 122 ) is located on each side ( 126, 128 ) of the drive mass ( 114 ). The drive units ( 122 ) are driven in phase opposition to the drive units ( 120 ) so that a levitation force ( 104 ) generated by the drive units ( 122 ) compensates for, or at least partially suppresses, a levitation force ( 100 ) generated by the drive units ( 120 ).

Claims (32)

1. An inertial sensor comprising:

a substrate;

a drive mass flexibly coupled to said substrate, said drive mass including first movable fingers and second movable fingers, said drive mass having first and second opposing sides delineated by a centerline of said drive mass; and

a drive system configured to oscillate said drive mass within a plane substantially parallel to a surface of said substrate, said drive system comprising:

first drive units coupled to said substrate and having first fixed fingers interleaved with said first movable fingers, at least one of said first drive units being located at said first side and at least another one of said first drive units being located at said second side; and

second drive units coupled to said substrate and having second fixed fingers interleaved with said second movable fingers, at least one of said second drive units being located at said first side and at least another one of said second drive units being located at said second side, and said second drive units being driven in phase opposition to said first drive units.

2. An inertial sensor as claimed in claim 1 wherein:

said inertial sensor is configured to detect angular velocity about an input axis that is substantially parallel to said surface of said substrate;

said drive system moves said drive mass in an oscillatory motion along a drive axis that is substantially parallel to said surface of said substrate and substantially perpendicular to said input axis;

said first drive units produce a first error component detectable along a sense axis that is substantially perpendicular to said surface of said substrate; and

said second drive units produce a second error component detectable along said sense axis, and at least a first portion of said first error component substantially cancels at least a second portion of said second error component.

3. An inertial sensor as claimed in claim 2 wherein said centerline of said drive mass is substantially parallel to said input axis.

4. An inertial sensor as claimed in claim 2 wherein said drive mass undergoes said oscillatory motion at a drive frequency, and said at least a first portion of said first error component and said at least a second portion of said second error component include a first harmonic frequency of said drive frequency.

5. An inertial sensor as claimed in claim 1 further comprising:

a sense mass; and

flexible support elements connecting said sense mass to said drive mass, said flexible support elements enabling said sense mass to oscillate relative to said sense axis in response to said angular velocity.

6. An inertial sensor as claimed in claim 1 wherein:

said at least one of said first drive units located at said first side of said drive mass is aligned transverse to said centerline with said at least another one of said second drive units located at said second side; and

said at least one of said second drive units located at said first side is aligned transverse to said centerline with said at least another one of said first drive units located at said second side of said drive mass.

7. An inertial sensor as claimed in claim 1 wherein:

said at least one of said second drive units located at said first side is adjacent to said at least one of said first drive units located at said first side; and

said at least another one of said second drive units located at said second side is adjacent to said at least another one of said first drive units located at said second side.

8. An inertial sensor as claimed in claim 1 wherein:

each of said first drive units includes a first overlap region in which said first movable fingers and said first fixed fingers are immediately adjacent to one another; and

each of said second drive units includes a second overlap region in which said second movable fingers and said second fixed fingers are immediately adjacent to one another, and said first and second overlap regions exhibit an overlap length that is substantially equivalent for said each of said first and second drive units.

9. An inertial sensor as claimed in claim 8 wherein said first and second overlap regions are displaced away from said centerline an equivalent distance.

10. An inertial sensor as claimed in claim 1 wherein said first and second drive units are displaced away from said centerline toward an outer perimeter of said drive mass.

11. An inertial sensor as claimed in claim 1 wherein said drive mass is a first drive mass, and:

said inertial sensor further comprises a second drive mass flexibly coupled to said substrate, said second drive mass including third movable fingers and fourth movable fingers, said second drive mass having third and fourth opposing sides delineated by a second centerline of said second drive mass; and

said drive system is configured to oscillate said second drive mass within said plane in antiphase to said first drive mass, said drive system further including:

third drive units coupled to said substrate and having third fixed fingers interleaved with said third movable fingers, at least one of said third drive units being located at said third side and at least another one of said third drive units being located at said fourth side; and

fourth drive units coupled to said substrate and having fourth fixed fingers interleaved with said fourth movable fingers, at least one of said fourth drive units being located at said third side and at least another one of said fourth drive units being located at said fourth side, said third drive units being driven in phase opposition to said fourth drive units.

Assignments (30)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
PATENT RELEASE Recorded Jan 14, 2016
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037494/0312 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0671 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0685 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030258/0558 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 030258/0540 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030258/0523 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2012
From: LIN, YIZHEN; MEHNER, JAN; NAUMANN, MICHAEL
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 029364/0055 →