Defect inspecting apparatus and defect inspecting method

1. A defect inspecting apparatus comprising:

an irradiation optical system including a light source to emit illumination light and a polarization generation part to adjust polarization state of the illumination light emitted from the light source;

a detection optical system including a polarization analysis part to adjust polarization state of scattered light from a sample irradiated by the irradiation optical system and a detection part to detect the scattered light adjusted by the polarization analysis part; and

a signal processing system to process the scattered light detected by the detection optical system to detect a defect presenting in the sample;

the polarization generation part adjusting the polarization state of the illumination light emitted from the light source on the basis of predetermined illumination conditions;

the polarization analysis part adjusting the polarization state of the illumination light emitted from the light source on the basis of predetermined detection conditions.

2. A defect inspecting apparatus according to claim 1 , wherein

the polarization generation part includes a ½-wave plate and a ¼-wave plate, and

the polarization analysis part includes a ½-wave plate, a ¼-wave plate and a polarizing plate.

3. A defect inspecting apparatus according to claim 1 , wherein

the signal processing part includes a polarization condition control part to control polarization conditions of the polarization generation part and the polarization analysis part, and

the polarization generation part and the polarization analysis part adjust the polarization state on the basis of a control signal from the polarization condition control part.

4. A defect inspecting apparatus according to claim 1 , wherein

the signal processing part includes a polarization condition calculation part to calculate polarization conditions of the polarization generation part and the polarization analysis part on the basis of actually measured result of the scattered light from the surface of the sample.

5. A defect inspecting apparatus according to claim 4 , wherein

the polarization condition calculation part calculates the polarization conditions for minimizing intensity of the scattered light from circuit pattern on the surface of the sample on the basis of the actually measured result.

6. A defect inspecting apparatus according to claim 1 , wherein

the signal processing part includes a polarization condition calculation part to calculate polarization conditions of the polarization generation part and the polarization analysis part on the basis of optical simulation result about the scattered light from the surface of the sample.

7. A defect inspecting apparatus according to claim 1 , wherein

the illumination optical system irradiates the surface of the sample with the illumination light in a vertical direction.

8. A defect inspecting method comprising:

an irradiation step of adjusting polarization state of illumination light emitted and irradiating a sample to be inspected with the illumination light;

a detection step of adjusting polarization state of scattered light from the sample irradiated in the irradiation step to be detected; and

a signal processing step of processing the scattered light detected in the detection step and detecting a defect presenting in the sample;

in the irradiation step, the polarization state of the illumination light emitted on the basis of predetermined illumination conditions being adjusted;

in the detection step, the polarization state of the illumination light emitted on the basis of predetermined detection conditions being adjusted.

9. A defect inspecting method according to claim 8 , wherein

in the irradiation step, the polarization state of the illumination light emitted on the basis of the predetermined illumination conditions are adjusted by a ½-wave plate and a ¼-wave plate, and

in the detection step, the polarization state of the illumination light emitted on the basis of the predetermined detection conditions are adjusted by a ½-wave plate and a ¼-wave plate.

10. A defect inspecting method according to claim 8 , wherein

the signal processing step includes a polarization condition control step of controlling polarization conditions adjusted in the irradiation step and the detection step, and

the signal processing step adjusts the polarization state on the basis of the control in the polarization condition control step.

11. A defect inspecting method according to claim 8 , wherein

the signal processing step includes a polarization condition calculation step of calculating polarization conditions on the basis of actually measured result of the scattered light from the surface of the sample.

12. A defect inspecting method according to claim 11 , wherein

the polarization condition calculation step calculates the polarization conditions for minimizing intensity of the scattered light from circuit pattern on the surface of the sample on the basis of the actually measured result.

13. A defect inspecting method according to claim 8 , wherein

the signal processing step includes a polarization condition calculation step of calculating polarization conditions of the illumination step and the detection step on the basis of optical simulation result about the scattered light from the surface of the sample.

14. A defect inspecting method according to claim 8 , wherein

the illumination step irradiates the surface of the sample with the illumination light in a vertical direction.