Integrated circuit packaging system with transferable trace lead frame

1. A method comprising:

(a) providing a lead frame having a contact on a lower surface of the lead frame and metal connectors on an upper surface of the lead frame;

(b) forming a masking layer over the upper surface of the lead frame and the metal connectors;

(c) forming a routing layer having a conductive land on the contact by shaping the bottom surface of the lead frame;

(d) forming a bottom encapsulation on the conductive land and the contact thereon with the contact exposed from the bottom encapsulation;

(e) removing the masking layer from the upper surface of the lead frame;

(f) forming an insulation cover directly on a portion of the metal connectors, the insulation cover is on a top portion of the metal connector, a side portion of the metal connector, and a top portion of the conductive land;

(g) connecting an integrated circuit die to the upper surface of the lead frame, the integrated circuit die spaced away from the insulation cover; and

(h) applying an underfill on the integrated circuit die and in a connection opening of the insulation cover.

2. The method of claim 1 , further comprising:

(i) forming an external interconnect on the contact.

3. The method of claim 2 , further comprising:

(j) forming a top encapsulation over the integrated circuit die and the upper surface of the lead frame.

4. The method of claim 3 , further comprising:

(k) forming an internal connector from the integrated circuit die to the at least one of the lead frame, the routing layer, and the conductive land.

5. The method of claim 1 wherein the masking layer includes a thermal-release type of film or a UV-type film.

6. A method comprising:

(a) providing a lead frame having a support portion, an inner portion, a metal connector on an upper surface of the inner portion, the metal connector is separated from another metal connector by the support portion, and a contact is on a bottom surface of the inner portion;

(b) forming a masking layer over an upper surface of the lead frame and the metal connectors;

(c) forming a routing layer having a conductive land on the contact by shaping the lead frame;

(d) forming a bottom encapsulation directly on the conductive land and the contact thereon with the contact exposed from the bottom encapsulation;

(e) removing the masking layer from the upper surface of the lead frame;

(f) forming an insulation cover directly on a portion of the metal connector, the insulation cover is on a top portion of the metal connector, a side portion of the metal connector, and a top portion of the conductive land; and

(g) connecting an integrated circuit die to the metal connector directly over the bottom encapsulation, the integrated circuit die spaced away from the insulation cover; and

(h) applying an underfill on the into rated circuit die and in a connection opening of the insulation cover.

7. The method of claim 6 , wherein the forming step (b) includes forming the masking layer over the metal connector, the support portion, and the inner portion.

8. The method of claim 6 , wherein the forming step (c) includes shaping the lead frame by removing the support portion.

9. The method of claim 6 , wherein the connecting step (g) includes the metal connector separated from another metal connector by the bottom encapsulation.

10. The method of claim 6 , further comprising:

(i) forming an external interconnect on the contact; and

(j) forming a top encapsulation over the integrated circuit die and the upper surface of the lead frame.

11. The method of claim 10 , further comprising:

(k) forming an internal connector from the integrated circuit die to the at least one of the lead frame, the routing layer, and the conductive land.