Silicon, aluminum oxide, aluminum nitride template for optoelectronic and power devices
A method of forming a template on a silicon substrate includes providing a single crystal silicon substrate. The method further includes forming an aluminum oxide coating on the surface of the silicon substrate, the aluminum oxide being substantially crystal lattice matched to the surface of the silicon substrate and epitaxially depositing a layer of aluminum nitride (AlN) on the aluminum oxide coating substantially crystal lattice matched to the surface of the aluminum nitride.
1. A method of forming a template on a silicon substrate comprising the steps of:
providing a single crystal silicon substrate;
forming an aluminum oxide coating on the surface of the silicon substrate, the aluminum oxide being substantially crystal lattice matched to the surface of the silicon substrate; and
epitaxially depositing a layer of aluminum nitride (AlN) on the aluminum oxide coating.
2. A method as claimed in claim 1 wherein the step of forming the aluminum oxide coating includes depositing aluminum oxynitride.
3. A method as claimed in claim 1 wherein the step of forming the aluminum oxide coating includes depositing a layer of aluminum oxide with a thickness in a range of approximately 1 nm to approximately 10 nm thick.
4. A method as claimed in claim 1 wherein the step of forming the aluminum oxide coating includes depositing a layer of aluminum oxide with one of a single continuous composition or a linear or stepwise graded composition.
5. A method as claimed in claim 1 wherein the step of epitaxially depositing the layer of aluminum nitride includes depositing a layer in a range of >0 to approximately 100 nm thick.
6. A method as claimed in claim 1 wherein the step of epitaxially depositing the layer of aluminum nitride includes depositing by an MBE process.
7. A method as claimed in claim 1 further including a step of epitaxially depositing a layer of III-N material on the layer of aluminum nitride.
8. A method as claimed in claim 7 wherein the step of epitaxially depositing the layer of III-N material includes growing an LED structure on the layer of aluminum nitride.
9. A method as claimed in claim 8 wherein the step of growing the LED structure on the layer of aluminum nitride includes growing at least one layer including one of i-GaN, n-GaN, active layers, electron blocking layers, or p-GaN.
10. A method as claimed in claim 7 wherein the step of epitaxially depositing the layer of III-N material includes growing an HEMT structure on the layer of aluminum nitride.
11. A method as claimed in claim 10 wherein the step of growing the HEMT structure on the layer of aluminum nitride includes growing at least one layer including one of, i-GaN, AlN, AlGaN, or GaN.
12. A method of forming a template on a silicon substrate comprising the steps of:
providing a single crystal silicon substrate;
forming an aluminum oxide coating on the surface of the silicon substrate with a thickness in a range of approximately 1 nm to approximately 10 nm, the aluminum oxide being substantially crystal lattice matched to the surface of the silicon substrate; and
epitaxially depositing a layer of aluminum nitride (AlN) on the aluminum oxide coating, in a range of >0 to approximately 100 nm thick.
13. A method as claimed in claim 12 further including a step of epitaxially depositing a layer of III-N material on the layer of aluminum nitride.
14. A method as claimed in claim 13 wherein the step of epitaxially depositing the layer of III-N material includes growing an LED structure on the layer of aluminum nitride.
15. A method as claimed in claim 14 wherein the step of growing the LED structure on the layer of aluminum nitride includes growing at least one layer including one of i-GaN, n-GaN, active layers, electron blocking layers, or p-GaN.
16. A method as claimed in claim 13 wherein the step of epitaxially depositing the layer of III-N material includes growing an HEMT structure on the layer of aluminum nitride.
17. A method as claimed in claim 16 wherein the step of growing the HEMT structure on the layer of aluminum nitride includes growing at least one layer including one of, i-GaN, AlN, AlGaN, or GaN.