Heterogeneous integration process incorporating layer transfer in epitaxy level packaging
Methods and structures for heterogeneous integration of diverse material systems and device technologies onto a single substrate incorporate layer transfer techniques into an epitaxy level packaging process. A planar substrate surface of multiple epitaxial areas of different materials can be heterogeneously integrated with a substrate material. Complex assembly and lattice engineering is significantly reduced. Microsystems of different circuits made from different materials can be built from a single wafer Fab line employing the claimed processes.
1. A method of forming an epitaxial structure comprising:
implanting an ion species suitable for exfoliation into a crystalline substrate to form an ion implanted exfoliation layer in said crystalline substrate;
bonding a handling substrate to said ion implanted exfoliation layer;
separating said handling substrate and ion implanted exfoliation layer from said crystalline substrate;
mounting an assembly substrate over said ion implanted exfoliation layer;
wherein said assembly substrate includes a number of apertures extending therethrough forming an assembly pattern;
growing an epitaxial material within said assembly pattern to form an epitaxial pattern over said ion implanted and recrystallized exfoliation layer.
2. The method of claim 1 wherein said handling substrate is a separate substrate bonded to said ion implanted exfoliation layer.
3. The method of claim 1 further including a step: separating said assembly substrate containing said epitaxial pattern from said ion implanted and recrystallized exfoliation layer.
4. The method of claim 1 further including a step: forming an interfacial layer over said assembly substrate.
5. The method of claim 1 further including a step: masking said assembly substrate so that said epitaxial pattern includes at least two separate types of epitaxial material in said apertures.