IP Library › Assignment 036761/0466
Patent Assignment
Reel/Frame 036761/0466

Assignment of Assignor's Interest

Recorded: 2015-10-08 Pages: 6
Assignor
PAN, ERIC TING-SHAN
Executed: 2015-10-07
Assignee
ATHENAEUM LLC
400 DORLA CT., ZEPHYR COVE, NEVADA, 89448
Covered Properties (22)
Solar-To-Electricity Conversion Modules, Systems & Methods
Epitaxial Film Assembly System & Method
Solar-To-Electricity Conversion Sub-Module
Application: 12/417,931 →
Publication: US 2009/0250096
Solar-To-Electricity Conversion System
Application: 12/417,982 →
Publication: US 2009/0250097
Method for Solar-To-Electricity Conversion
Application: 12/418,020 →
Publication: US 2009/0250098
Solar-To-Electricity Conversion System Using Cascaded Architecture of Photovoltaic and Thermoelectric Devices
Application: 12/418,223 →
Publication: US 2009/0250099
Epitaxy-Level Packaging (ELP) System
Application: 12/607,726 →
Publication: US 2010/0102419
Method of Integrating Epitaxial Film Onto Assembly Substrate
Patent: 8,193,078 →
Application: 12/607,762 →
Publication: US 2010/0105194
Apparatus for Making Epitaxial Film
Patent: 7,905,197 →
Application: 12/607,776 →
Publication: US 2010/0101725
Apparatus for Making Epitaxial Film
Patent: 8,430,056 →
Application: 13/047,360 →
Publication: US 2011/0247550
Method of Integrating Epitaxial Film Onto Assembly Substrate
Patent: 8,530,342 →
Application: 13/487,561 →
Publication: US 2012/0238078
Method of Transferring Epitaxial Film
Patent: 8,507,370 →
Application: 13/487,574 →
Publication: US 2012/0238079
Method of Forming Epitaxial Film
Patent: 8,541,294 →
Application: 13/487,592 →
Publication: US 2012/0238080
Method of Forming Epitaxial Semiconductor Structure
Patent: 8,507,371 →
Application: 13/487,610 →
Publication: US 2012/0238083
Method of Forming Epitaxial Based Integrated Circuit
Patent: 8,673,752 →
Application: 13/487,772 →
Publication: US 2012/0238084
Epitaxy Level Packaging
Patent: 9,023,729 →
Application: 13/724,155 →
Publication: US 2013/0200429
Heterogeneous Integration Process Incorporating Layer Transfer in Epitaxy Level Packaging
Patent: 8,822,309 →
Application: 13/724,701 →
Publication: US 2013/0161834
Heterogeneous Integration Process Incorporating Layer Transfer in Epitaxy Level Packaging
Application: 14/473,624 →
Publication: US 2014/0374924
Solid-State Solar Engine System for Solar-To-Electricity Conversion
Application: 61/043,014 →
Method of Integrating Epitaxial Film onto Assembly Substrate
Application: 61/109,147 →
Ion Induced Exfoliation for Achieving Layer Separation
Application: 61/580,044 →
Epitaxy-Level Packaging
Application: 61/580,086 →
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 6, 2009
From: PAN, ERIC TING-SHAN
To: ATHENAEUM LLC
Reel/Frame 023485/0094 →
Assignment of Assignor's Interest Aug 26, 2016
From: ATHENAEUM LLC
To: IP3, SERIES 100 OF ALLIED SECURITY TRUST I
Reel/Frame 039559/0088 →
Assignment of Assignor's Interest Oct 3, 2016
From: ATHENAEUM LLC
To: PAN, ERIC TING-SHAN
Reel/Frame 039921/0482 →
Assignment of Assignor's Interest Oct 20, 2021
From: IP3, SERIES 100 OF ALLIED SECURITY TRUST I
To: ALPAD CORPORATION
Reel/Frame 057851/0531 →