IP Library › Patent Application 13758334
Patent Application
App. No. 13/758,334

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS

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Quick Facts
Patent No.
US None
App. No.
13/758,334
Abstract

A film is formed on a substrate by performing a cycle at least twice, the cycle including a nucleus formation process for forming nuclei on the substrate and a nucleus growth suppression process for suppressing growth of the nuclei. A time required for the nucleus growth suppression process is less than or equal to a time required for the nucleus formation process. Alternatively, the nucleus formation process is further performed after the cycle is repeatedly performed a plurality of times.

Claims (9)

1 . A method of manufacturing a semiconductor device, comprising forming a silicon film by performing a cycle at least twice, the cycle including a nucleus growth suppression process of supplying a chlorine-containing gas onto a substrate to suppress a growth of nuclei and control a local growth of silicon on the substrate and a nucleus formation process of supplying a silicon-containing gas onto the substrate to form silicon nuclei on the substrate,

wherein a time required for the nucleus growth suppression process is less than or equal to a time required for the nucleus formation process.

2 . A substrate processing apparatus comprising:

a process chamber configured to process a substrate;

a chlorine-containing gas supply system configured to supply at least a chlorine-containing gas into the process chamber;

a silicon-containing gas supply system configured to supply at least a silicon-containing gas into the process chamber; and

a controller configured to control at least the chlorine-containing gas supply system and the silicon-containing gas supply system to form a silicon film by performing a cycle at least twice, the cycle including a nucleus growth suppression process of supplying the chlorine-containing gas onto the substrate to suppress a growth of nuclei and control a local growth of silicon on the substrate and a nucleus formation process of supplying the silicon-containing gas onto the substrate to form silicon nuclei on the substrate, wherein a time required for the nucleus growth suppression process is less than or equal to a time required for the nucleus formation process.

3 . The method of claim 1 , further comprising performing the nucleus formation process after the cycle is performed at least twice.

4 . The method of claim 1 , wherein the time required for the nucleus growth suppression process is 0.4 to 1 times the time required for the nucleus formation process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2013
From: KOSHI, YASUNOBU; NISHIDA, KEIGO; MAEDA, KIYOHIKO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 029752/0041 →