IP Library Granted Patent US 9,190,937
Granted Patent B2
US 9,190,937 · App. 13/760,465 · Granted Nov 17, 2015

Stiction resistant mems device and method of operation

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Quick Facts
Patent No.
US 9,190,937
App. No.
13/760,465
Granted
Nov 17, 2015
Kind
B2
Abstract

A MEMS device ( 20 ) includes a movable element ( 20 ) suspended above a substrate ( 22 ) by a spring member ( 34 ) having a spring constant ( 104 ). A spring softening voltage ( 58 ) is applied to electrodes ( 24, 26 ) facing the movable element ( 20 ) during a powered mode ( 100 ) to decrease the stiffness of the spring member ( 34 ) and thereby increase the sensitivity of the movable element ( 32 ) to an input stimulus ( 46 ). Upon detection of a stiction condition ( 112 ), the spring softening voltage ( 58 ) is effectively removed to enable recovery of the movable element ( 32 ) from the stiction condition ( 112 ). A higher mechanical spring constant ( 104 ) yields a stiffer spring ( 34 ) having a larger restoring force ( 122 ) in the unpowered mode ( 96 ) in order to enable recovery from the stiction condition ( 112 ). A feedback voltage ( 56 ) can be applied to feedback electrodes ( 28, 30 ) facing the movable element ( 32 ) to provide electrical damping.

Claims (32)

1. A microelectromechanical systems (MEMS) device comprising:

a substrate;

a movable element positioned in spaced apart relationship above a surface of said substrate;

at least one spring member interconnecting said movable element with said substrate, said at least one spring member enabling motion of said movable element, and said at least one spring member exhibiting a first stiffness;

at least one electrode facing said movable element;

at least one force feedback electrode facing said movable element;

a voltage source in communication with said at least one electrode, said voltage source being configured to apply a spring softening voltage to said at least one electrode to shift a stiffness of said spring member from said first stiffness to a second stiffness, said second stiffness being less than said first stiffness;

a sense circuit in electrical communication with said at least one electrode for generating an electrical output signal in response to an input stimulus imposed on said movable element;

an electrostatic force feedback circuit interposed between said sense circuit and said at least one force feedback electrode for controlling a feedback voltage applied to said at least one force feedback electrode based on said electrical output signal;

a detection circuit in electrical communication with said at least one electrode, said detection circuit being configured to detect a stiction condition of said movable element in response to an output signal from said at least one electrode; and

a multiplexor circuit in communication with said at least one electrode, said at least one force feedback electrode, and said movable element, said multiplexor circuit being configured to set each of said at least one electrode, said at least one force feedback electrode, and said movable element to an equivalent voltage potential to effectively remove said spring softening voltage in response to said stiction condition.

2. A MEMS device as claimed in claim 1 wherein said movable element is configured to move in response to an input stimulus while said spring softening voltage is applied to said at least one electrode.

3. A MEMS device as claimed in claim 1 wherein:

said movable element is adapted for motion relative to a rotational axis positioned between first and second ends of said movable element, a first section of said movable element is formed between said rotational axis and said first end, a second section of said movable element is formed between said rotational axis and said second end, said first section having a first mass that is greater than a second mass of said second section; and

said at least one electrode includes a first electrode facing said first section of said movable element and a second electrode facing said second section of said movable element, and said spring softening voltage is applied to each of said first and second electrodes.

4. A method of operating a microelectromechanical systems (MEMS) device that includes a movable element positioned in spaced apart relationship above a surface of a substrate, at least one spring member interconnecting said movable element with said substrate, at least one electrode facing said movable element, wherein said at least one spring member enables motion of said movable element, said at least one spring member exhibits a first stiffness, and said method comprises:

applying a spring softening voltage to said at least one electrode to shift a stiffness of said spring member from said first stiffness to a second stiffness, said second stiffness being less than said first stiffness;

detecting a stiction condition of said movable element from an output signal provided from said at least one electrode, said stiction condition indicating that said movable element has moved beyond an allowable movement range, wherein said detecting operation comprises determining that said output signal exceeds an overload threshold value; and

removing said spring softening voltage from said at least one electrode in response to said stiction condition to shift said stiffness of said spring member from said second stiffness to said first stiffness to thereby enable said movable element to return to a first position within said allowable movement range.

5. A method as claimed in claim 4 further comprising sensing an input signal as a function of an input stimulus imposed on said movable element, said sensing operation being performed while said spring softening voltage is applied to said at least one electrode.

6. A method as claimed in claim 4 further comprising:

following said removing operation, detecting return of said movable mass to said first position; and

reapplying said spring softening voltage to said at least one electrode to shift said stiffness of said spring member from said first stiffness to said second stiffness.

7. A method as claimed in claim 4 wherein said movable element is adapted for motion relative to a rotational axis positioned between first and second ends of said movable element, a first section of said movable element is formed between said rotational axis and said first end, a second section of said movable element is formed between said rotational axis and said second end, said first section having a first mass that is greater than a second mass of said second section, said at least one electrode includes a first electrode facing said first section of said movable element and a second electrode facing said second section of said movable element, and said applying operation applies said spring softening voltage to each of said first and second electrodes.

8. A method of operating a microelectromechanical systems (MEMS) device that includes a movable element positioned in spaced apart relationship above a surface of a substrate, at least one spring member interconnecting said movable element with said substrate, and at least one electrode facing said movable element, wherein said at least one spring member enables motion of said movable element, said at least one spring member exhibits a first stiffness, and said MEMS device further includes a sense circuit in electrical communication with said at least one electrode, at least one force feedback electrode facing said movable element, and an electrostatic force feedback circuit interposed between said sense circuit and said at least one force feedback electrode, and said method comprises:

applying a spring softening voltage to said at least one electrode to shift a stiffness of said spring member from said first stiffness to a second stiffness, said second stiffness being less than said first stiffness;

detecting a stiction condition of said movable element from an output signal provided from said at least one electrode, said stiction condition indicating that said movable element has moved beyond an allowable movement range; and

removing said spring softening voltage from said at least one electrode in response to said stiction condition to shift said stiffness of said spring member from said second stiffness to said first stiffness to thereby enable said movable element to return to a first position within said allowable movement range;

generating, at said sense circuit, an electrical output signal in response to an input stimulus imposed on said movable element;

controlling, at said force feedback circuit, a feedback voltage based on said electrical output signal; and

supplying said feedback voltage to said at least one force feedback electrode from said force feedback circuit.

9. A method as claimed in claim 8 wherein said removing operation comprises setting each of said at least one electrode, said at least one force feedback electrode, and said movable element to an equivalent voltage potential.

Assignments (17)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0704 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0744 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0725 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2013
From: LIN, YIZHEN; MCNEIL, ANDREW C.; SCHLARMANN, MARK E.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 029764/0777 →