IP Library Granted Patent US 8,946,860
Granted Patent B2
US 8,946,860 · App. 13/773,432 · Granted Feb 3, 2015

Semiconductor device and related fabrication methods

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Quick Facts
Patent No.
US 8,946,860
App. No.
13/773,432
Granted
Feb 3, 2015
Kind
B2
Abstract

Semiconductor device structures and related fabrication methods are provided. An exemplary semiconductor device structure includes a collector region of semiconductor material having a first conductivity type, a base region of semiconductor material within the collector region, the base region having a second conductivity type opposite the first conductivity type, and a doped region of semiconductor material having the second conductivity type, wherein the doped region is electrically connected to the base region and the collector region resides between the base region and the doped region. In exemplary embodiments, the dopant concentration of the doped region is greater than a dopant concentration of the collector region to deplete the collector region as the electrical potential of the base region exceeds that of the collector region.

Claims (53)

1. A semiconductor device comprising:

a collector region of semiconductor material having a first conductivity type;

a base region of semiconductor material within the collector region, the base region having a second conductivity type opposite the first conductivity type; and

a first doped region of semiconductor material having the second conductivity type, wherein:

the first doped region is electrically connected to the base region;

the collector region resides between the base region and the first doped region;

the collector region overlies the first doped region; and

a dopant concentration of the first doped region is greater than a dopant concentration of the collector region.

2. The semiconductor device of claim 1 , wherein the dopant concentration of the first doped region is at least ten times greater than the dopant concentration of the collector region.

3. The semiconductor device of claim 1 , wherein the collector region comprises an epitaxial layer overlying the first doped region.

4. A semiconductor device comprising:

a collector region of semiconductor material having a first conductivity type;

a base region of semiconductor material within the collector region, the base region having a second conductivity type opposite the first conductivity type; and

a first doped region of semiconductor material having the second conductivity type;

a support layer of semiconductor material;

a buried layer of dielectric material overlying the support layer; and

a second doped region of semiconductor material overlying the buried layer, wherein:

the first doped region is electrically connected to the base region;

the collector region resides between the base region and the first doped region; and

the collector region overlies the second doped region.

5. The semiconductor device of claim 4 , wherein the first doped region abuts the second doped region.

6. The semiconductor device of claim 5 , wherein:

a dopant concentration of the first doped region is greater than a dopant concentration of the collector region; and

a dopant concentration of the second doped region is greater than the dopant concentration of the collector region.

7. The semiconductor device of claim 1 , wherein the first doped region and the base region are physically isolated by the collector region.

8. A bipolar transistor comprising:

a buried region having a first conductivity type;

a collector region overlying the buried region, the collector region having a second conductivity type opposite the first conductivity type;

a base region within the collector region, the base region having the first conductivity type, wherein at least a first portion of the collector region resides between the base region and the buried region; and

a sinker region having the first conductivity type, wherein:

the sinker region abuts the buried region;

at least a second portion of the collector region resides between the sinker region and the base region; and

the sinker region is electrically connected to the base region.

9. The bipolar transistor of claim 8 , wherein the sinker region laterally surrounds the collector region.

10. The bipolar transistor of claim 8 , wherein a dopant concentration of the collector region is less than a dopant concentration of the buried region.

11. The bipolar transistor of claim 10 , wherein the dopant concentration of the collector region is less than a dopant concentration of the sinker region.

12. The bipolar transistor of claim 8 , wherein the dopant concentration of the collector region is less than a dopant concentration of the sinker region.

13. The bipolar transistor of claim 8 , further comprising an emitter region within the base region, the emitter region having the second conductivity type.

14. A semiconductor device comprising:

a collector region of semiconductor material having a first conductivity type;

a sinker region of semiconductor material having a second conductivity type opposite the first conductivity type, wherein the sinker region laterally surrounds the collector region;

a base region of semiconductor material having the second conductivity type within the collector region, at least a first portion of the collector region resides between the sinker region and the base region;

an emitter region of semiconductor material within the base region, the emitter region having the first conductivity type; and

a buried region of semiconductor material having the second conductivity type, wherein:

the collector region overlies the buried region;

the sinker region abuts the buried region;

the sinker region and the buried region are electrically connected to the base region; and

at least a second portion of the collector region resides between the base region and the buried region.

15. The semiconductor device of claim 14 , wherein:

a dopant concentration of the buried region is greater than a dopant concentration of the collector region; and

a dopant concentration of the sinker region is greater than the dopant concentration of the collector region.

16. The semiconductor device of claim 15 , wherein a dopant concentration of the base region is greater than the dopant concentration of the collector region.

17. The semiconductor device of claim 14 , wherein the second portion is beneath the emitter region.

Assignments (21)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0704 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0744 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0725 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 030445/0737 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030445/0709 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded May 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030445/0581 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2013
From: LIN, XIN; BLOMBERG, DANIEL J.; ZUO, JIANG-KAI
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 029875/0447 →