Signal path of a multiple-patterned semiconductor device
A multiple-patterned semiconductor device is provided. The semiconductor device includes one or more layers with signal tracks defined by masks and a structure for transferring a signal between signal tracks and repowering the signal.
1. A method for reducing differences in path delays in a semiconductor device having a wiring layer, the wiring layer having a first signal track patterned by a first mask and processed to a first physical width and a second signal track patterned by a second mask and processed to a second physical width, wherein the first signal track is adjacent to the second signal track and physical widths defined by a single mask more closely track than physical widths defined by separate masks, comprising:
routing, on a first segment of the first signal track, a first signal from a start region of the first segment of the first signal track to a finish region of the first segment of the first signal track;
routing, on a first segment of the second signal track, a second signal from a start region of the first segment of the second signal track to a finish region of the first segment of the second signal track; and
transferring, by criss-crossing the first signal from the finish region of the first segment of the first signal track to a start region of a second segment of the second signal track and the second signal from the finish region of the second segment of the second signal track to a start region of a second segment of the first signal track, the first signal from the first signal track to the second signal track and the second signal from the second signal track to the first signal track.
2. The method of claim 1 , further comprising repowering the first signal with a first conductor at the finish region of the first segment of the first signal track and repowering the second signal with a second conductor at the finish region of the first segment of the second signal track.
3. The method of claim 1 , further comprising:
routing, on the second segment of the first signal track, the second signal from the start region of the second segment of the first signal track to a finish region of the second segment of the first signal track;
routing, on the second segment of the second signal track, the first signal from the start region of the second segment of the second signal track to a finish region of the second segment of the second signal track; and
transferring, by criss-crossing the second signal from the finish region of the second segment of the first signal track to a start region of a third segment of the second signal track and the first signal from the finish region of the second segment of the second signal track to a start region of a third segment of the first signal track, the second signal from the first signal track to the second signal track and the first signal from the second signal track to the first signal track.
4. The method of claim 1 , wherein transferring the first signal from the first signal track to the second signal track and the second signal from the second signal track to the first signal track includes weaving the first and second signals between the first and second signal tracks.
5. The method of claim 1 , further comprising achieving, by alternating the first and second signals between the first and second signal tracks, a timing tolerance standard.
6. The method of claim 5 , wherein the timing tolerance standard includes a difference from an amount of time for a signal path to carry a signal a distance.
7. The method of claim 5 , wherein the timing tolerance standard includes a difference in a transmission time between the first and second signals.
8. The method of claim 1 , wherein a start region of a particular segment includes a first via and a finish region of the particular segment includes a second via.