IP Library Granted Patent US 8,853,672
Granted Patent B2
US 8,853,672 · App. 13/794,539 · Granted Oct 7, 2014

Gallium nitride substrate and epitaxial wafer

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Quick Facts
Patent No.
US 8,853,672
App. No.
13/794,539
Granted
Oct 7, 2014
Kind
B2
Abstract

A gallium nitride substrate includes a plurality of physical level differences in a surface thereof. All the physical level differences existing in the surface have a dimension of not more than 4 μm. A relationship of (H−L)/H×100≦80 is satisfied in all the physical level differences, where H represents a higher value of cathodoluminescence emission intensities of a wavelength corresponding to a bandgap of the gallium nitride substrate, and L represents a lower value of the cathodoluminescence emission intensities, the cathodoluminescence emission intensities being measured in an upper step and a lower step of the physical level difference.

Claims (10)

1. A gallium nitride substrate, comprising:

a plurality of physical level differences in a surface thereof,

wherein all the physical level differences existing in the surface have a dimension of not more than 4 μm, and

wherein a relationship of (H−L)/H×100≦80 is satisfied in all the physical level differences, where H represents a higher value of cathodoluminescence emission intensities of a wavelength corresponding to a bandgap of the gallium nitride substrate, and L represents a lower value of the cathodoluminescence emission intensities, the cathodoluminescence emission intensities being measured in an upper step and a lower step of the physical level difference.

2. The gallium nitride substrate according to claim 1 , wherein all the physical level differences have a dimension of not more than 3 μm.

3. The gallium nitride substrate according to claim 2 , wherein all the physical level differences have a dimension of not more than 2 μm.

4. An epitaxial wafer, comprising:

the gallium nitride substrate according to claim 1 ;

a buffer layer on the gallium nitride substrate; and

an InGaN quantum well structure including an InGaN quantum well layer on the buffer layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037827/0453 →
COMPANY SPLIT Recorded Jul 24, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036181/0104 →
MERGER Recorded Feb 15, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032268/0297 →