Gate contact for a semiconductor device and methods of fabrication thereof
View Patent ↗Embodiments of a gate contact for a semiconductor device and methods of fabrication thereof are disclosed. In one embodiment, a semiconductor device includes a semiconductor structure and a dielectric layer on a surface of the semiconductor structure, where the dielectric layer has an opening that exposes an area of the semiconductor structure. A gate contact for the semiconductor device is formed on the exposed area of the semiconductor structure through the opening in the dielectric layer. The gate contact includes a proximal end on a portion of the exposed area of the semiconductor structure, a distal end opposite the proximal end, and sidewalls that each extend between the proximal end and the distal end of the gate contact. For each sidewall of the gate contact, an air region separates the sidewall and the distal end of the gate contact from the dielectric layer.
1. A semiconductor device comprising:
semiconductor structure;
a dielectric layer on a surface of the semiconductor structure, the dielectric layer having an opening that exposes an area of the semiconductor structure to thereby provide an exposed area of the semiconductor structure;
a gate contact comprising:
a proximal end on a portion of the exposed area of the semiconductor structure;
a distal end opposite the proximal end; and
sidewalls that each extends between the proximal end and the distal end;
a field plate on a surface of the dielectric layer adjacent to the gate contact; and
for each of the sidewalls of the gate contact, an air region that separates the sidewall of the gate contact from the dielectric layer;
wherein the field plate has a first edge that is aligned with an edge of the distal end of the gate contact and extends laterally away from the gate contact to a second edge of the field plate, and the field plate is separated from an adjacent one of the sidewalls of the gate contact and the distal end of the gate contact by the air region that separates the adjacent one of the sidewalls of the gate contact and the distal end of the gate contact from the dielectric layer.
2. The semiconductor device of claim 1 wherein the proximal end of the gate contact is directly on the portion of the exposed area of the semiconductor structure.
3. The semiconductor device of claim 2 wherein a length of the proximal end of the gate contact is less than a length of the distal end of the gate contact.
4. The semiconductor device of claim 2 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is less than or equal to 0.15 micrometers.
5. The semiconductor device of claim 2 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.25 micrometers.
6. The semiconductor device of claim 2 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.15 micrometers.
7. The semiconductor device of claim 2 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.1 micrometers.
8. The semiconductor device of claim 1 wherein:
the semiconductor structure comprises a recess that is aligned with the opening in the dielectric layer and extends from the surface of the semiconductor structure to a desired depth in the semiconductor structure; and
the proximal end of the gate contact is directly on a portion of the semiconductor structure within the recess.
9. The semiconductor device of claim 8 wherein, for each sidewall of the sidewalls of the gate contact, the air region that separates the sidewall and the distal end of the gate contact from the dielectric layer also separates the sidewall of the gate contact from a sidewall of the recess.
10. The semiconductor device of claim 1 wherein:
the semiconductor structure comprises a recess that is in a portion of the exposed area of the semiconductor structure and extends from the surface of the semiconductor structure to a desired depth in the semiconductor structure; and
the proximal end of the gate contact is aligned with and is within the recess in the semiconductor structure such that the proximal end of the gate contact is directly on a portion of the semiconductor structure within the recess.
11. A semiconductor device comprising:
semiconductor structure and a dielectric layer on a surface of the semiconductor structure, wherein:
the dielectric layer having an opening that exposes an area of the semiconductor structure to thereby provide an exposed area of the semiconductor structure; and
the semiconductor structure comprises:
an outer recess that is aligned with the opening in the dielectric layer and extends from the surface of the semiconductor structure to a first depth in the semiconductor structure; and
an inner recess that is within the outer recess and extends from a bottom of the outer recess to a second depth in the semiconductor structure;
a gate contact comprising:
a proximal end on a portion of the exposed area of the semiconductor structure, the proximal end being aligned with and within the inner recess in the semiconductor structure such that the proximal end of the gate contact is directly on a portion of the semiconductor structure within the inner recess;
a distal end opposite the proximal end; and
sidewalls that each extend between the proximal end and the distal end; and
for each of the sidewalls of the gate contact, an air region that separates the sidewall of the gate contact from the dielectric layer.
12. The semiconductor device of claim 11 wherein, for each sidewall of the sidewalls of the gate contact, the air region that separates the sidewall and the distal end of the gate contact from the dielectric layer also separates the sidewall of the gate contact from a sidewall of the outer recess.
13. The semiconductor device of claim 11 wherein, for each of the sidewalls of the gate contact, the air region further separates the distal end of the gate contact from the dielectric layer.
14. The semiconductor device of claim 11 wherein a length of the proximal end of the gate contact is less than a length of the distal end of the gate contact.
15. The semiconductor device of claim 11 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is less than or equal to 0.15 micrometers.
16. The semiconductor device of claim 11 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.25 micrometers.
17. The semiconductor device of claim 11 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.15 micrometers.
18. The semiconductor device of claim 11 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.1 micrometers.
19. The semiconductor device of claim 11 further comprising a field plate on a surface of the dielectric layer adjacent to the gate contact.
20. The semiconductor device of claim 19 wherein the field plate has a first edge that is aligned with an edge of the distal end of the gate contact and extends laterally away from the gate contact to a second edge of the field plate;
wherein the field plate is separated from an adjacent one of the sidewalls of the gate contact and the distal end of the gate contact by the air region that separates the adjacent one of the sidewalls of the gate contact and the distal end of the gate contact from the dielectric layer.
21. A semiconductor device comprising:
semiconductor structure;
a dielectric layer on a surface of the semiconductor structure, the dielectric layer having an opening that exposes an area of the semiconductor structure to thereby provide an exposed area of the semiconductor structure;
a gate contact comprising:
a proximal end on the exposed area of the semiconductor structure;
a distal end opposite the proximal end; and
sidewalls that each extend between the proximal end and the distal end;
an air region that separates the distal end of the gate contact from the dielectric layer; and
a field plate on a surface of the dielectric layer adjacent to the gate contact with a first edge that is aligned with an edge of the distal end of the gate contact and is separated from an adjacent one of the sidewalls of the gate contact and the distal end of the gate contact by the air region.
22. The semiconductor device of claim 21 wherein the proximal end of the gate contact is directly on the exposed area of the semiconductor structure.
23. The semiconductor device of claim 22 wherein a length of the proximal end of the gate contact is less than a length of the distal end of the gate contact.
24. The semiconductor device of claim 22 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is less than or equal to 0.15 micrometers.
25. The semiconductor device of claim 22 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.25 micrometers.
26. The semiconductor device of claim 22 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.15 micrometers.
27. The semiconductor device of claim 22 wherein a length of the proximal end of the gate contact is a gate length of the semiconductor device and is in a range of and including 0.05 to 0.1 micrometers.