IP Library Granted Patent US 9,947,829
Granted Patent B2
US 9,947,829 · App. 13/805,273 · Granted Apr 17, 2018

Substrate with buffer layer for oriented nanowire growth

Inventor: Jonas Ohlsson (Lund, SE)
Assignee: GLO AB
H01L33/12B82Y10/00H01L21/0237H01L21/0254H01L21/02439H01L21/02444H01L21/02458H01L21/02488H01L21/02513H01L21/02603H01L29/0665H01L29/0676H01L29/0684H01L33/18B82Y20/00B82Y40/00B82Y99/00H01L33/007H01L33/06H01L33/08H01L33/24Y10S977/762
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Quick Facts
Patent No.
US 9,947,829
App. No.
13/805,273
Granted
Apr 17, 2018
Kind
B2
Abstract

The present invention provides a substrate ( 1 ) with a bulk layer ( 3 ) and a buffer layer ( 4 ) having a thickness of less than 2 μm arranged on the bulk layer ( 3 ) for growth of a multitude of nanowires ( 2 ) oriented in the same direction on a surface ( 5 ) of the buffer layer ( 4 ). A nanowire structure, a nanowire light emitting diode comprising the substrate ( 1 ) and a production method for fabricating the nanowire structure is also provided. The production method utilizes non-epitaxial methods for forming the buffer layer ( 4 ).

Claims (12)

1. A method for forming a structure comprising a plurality of nanowires oriented in the same direction, wherein the method comprises the steps of:

providing a bulk layer;

depositing a buffer layer with a thickness of less than 2 μm on the bulk layer, wherein the buffer layer is polycrystalline or amorphous and is formed by depositing two or more sub-layers, wherein the buffer layer is a non-epitaxial material selected from the group consisting of AlN and TiN, and combinations thereof, can withstand growth temperatures, and is grown with orientational properties that improve thermal properties of the structure; and

growing one or more GaN nanowires on the buffer layer.

2. The method of claim 1 , wherein the deposition of the buffer layer preserves the orientation of the bulk layer.

3. The method of claim 1 , wherein the deposition of the buffer layer alters the orientation of the bulk layer.

4. The method of claim 1 , wherein the buffer layer or one or more of the sub-layers are deposited by LPCVD, APCVD or PECVD.

5. The method of claim 1 , wherein the buffer layer or one or more of the sub-layers are deposited by ALD.

6. The method of claim 1 , wherein the buffer layer or one or more of the sub-layers are deposited by PVD.

7. The method of claim 1 , wherein the buffer layer or one or more of the sub-layers are grown by MOVPE or HVPE.

8. The method of claim 1 , further comprising forming a masking layer on the buffer layer, forming holes in the masking layer, and growing one or more nanowires on the buffer layer through the holes.

9. The method of claim 1 , wherein the buffer layer does not comprise silicon nitride.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2024
From: GLO TECHNOLOGIES LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 068297/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2023
From: SYSONAN, INC.
To: GLO TECHNOLOGIES LLC
Reel/Frame 065178/0210 →
CHANGE OF NAME Recorded Oct 5, 2023
From: NANOSYS, INC.
To: SYSONAN, INC.
Reel/Frame 065156/0416 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT RECORDED AT REEL 059569 / FRAME 0840 Recorded Sep 7, 2023
From: FORTRESS CREDIT CORP.,
To: NANOSYS, INC.
Reel/Frame 064836/0263 →
SECURITY INTEREST Recorded Apr 1, 2022
From: NANOSYS, INC.
To: FORTRESS CREDIT CORP., AS AGENT
Reel/Frame 059569/0840 →
NUNC PRO TUNC ASSIGNMENT Recorded Aug 13, 2021
From: GLO AB
To: NANOSYS, INC.
Reel/Frame 057184/0564 →
RELEASE OF SECURITY INTEREST Recorded Apr 12, 2021
From: HERCULES CAPITAL, INC.
To: GLO AB
Reel/Frame 057210/0690 →
SECURITY INTEREST Recorded Jan 23, 2019
From: GLO AB
To: HERCULES CAPITAL INC.
Reel/Frame 048110/0063 →
ASSIGNMENT OF IP SECURITY AGREEMENT Recorded Dec 12, 2018
From: GLO AB
To: HERCULES CAPITAL, INC., AS ADMINISTRATIVE AGENT
Reel/Frame 049042/0527 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2013
From: OHLSSON, JONAS
To: GLO AB
Reel/Frame 029686/0921 →
Priority Claims (1)
SE 1050700 · Jun 24, 2010 · national
Continuity (1)
Related Publication 20130221322A1 · Aug 29, 2013