Integrated circuit device, wireless communication unit and method of manufacture therefor
View Patent ↗An integrated circuit device comprising at least one radio frequency (RF) transceiver module. The at least one RF transceiver module includes a plurality of low noise amplifiers (LNAs) operably coupled to external contacts of the integrated circuit device and arranged to receive an RF signal from the respective external contact, amplify the received RF signal, and to output the amplified RF signal. Each transceiver module further includes a plurality of power amplifier (PA) modules operably coupled to the external contact of the integrated circuit device, and arranged to receive an RF signal to be transmitted, amplify the received RF signal to be transmitted, and output the amplified signal. The plurality of LNAs and the plurality of PAs are selectively configurable to operate in at least a first, multi-antenna configuration and a second, single antenna high transmit power configuration.
1. An integrated circuit device comprising:
at least one radio frequency (RF) transceiver module, wherein the at least one RF transceiver module comprises
a plurality of low noise amplifiers (LNAs) having respective input ports operably coupled to at least one external contact of the integrated circuit device and arranged to receive a first RF signal from the at least one external contact and output an amplified received first RF signal, and
a plurality of power amplifiers (PAs) having respective output ports operably coupled to the at least one external contact of the integrated circuit device, and arranged to receive at respective power amplifier input ports a second RF signal and output an amplified second RF signal to be transmitted, wherein
the plurality of LNAs and the plurality of PAs are selectively configurable to operate in at least a first, multi-antenna configuration and a second, single antenna high transmit power configuration, wherein the plurality of PAs is selectively configured to operate in the second, single antenna high transmit power configuration by configuring the integrated circuit device such that the second RF signal is amplified by at least two PAs and output to the at least one external contact.
2. The integrated circuit device of claim 1 wherein the plurality of LNAs and the plurality of PAs are selectively configurable to operate in at least one from a group of:
a multi-antenna transceiver configuration;
a single antenna, high transmit power, transceiver configuration;
a single antenna, low transmit power, transceiver configuration.
3. The integrated circuit device of claim 1 wherein, when configured to operate in the first, multi-antenna configuration, the RF transceiver module comprises:
a first LNA operably coupled at an input thereof to a first external contact of the integrated circuit device, and selectively configurable to receive the first RF signal from the first external contact and output an amplified first RF signal; and
a second LNA operably coupled at an input thereof to a second external contact of the integrated circuit device, and selectively configurable to receive the first RF signal from the second external contact and output an amplified first RF signal.
4. The integrated circuit device of claim 1 wherein, when configured to operate in the first, multi-antenna configuration, the RF transceiver module comprises:
a first PA operably coupled at an output thereof to the first external contact of the integrated circuit device, and selectively configurable to receive at an input thereof the second RF signal to be transmitted and output to the first external contact an amplified second RF signal to be transmitted; and
a second PA operably coupled at an output thereof to the second external contact of the integrated circuit device, and selectively configurable to receive at an input thereof the second RF signal to be transmitted and output to the second external contact an amplified second RF signal to be transmitted.
5. The integrated circuit device of claim 4 wherein the first LNA and the first PA are arranged to comprise compatible impedances with respect to the first external contact.
6. The integrated circuit device of claim 1 wherein the plurality of LNAs comprise a third LNA operably coupled at an input thereof to at least one of the first and second external contacts of the integrated circuit device and having an input impedance of at least a factor less than other LNAs of the plurality of LNAs.
7. The integrated circuit device of claim 6 wherein the third LNA is selectively configured for use in a receive mode of operation in the second, single antenna high transmit power configuration.
8. The integrated circuit device of claim 1 wherein the third LNA comprises an impedance that is compatible with the first PA and the second PA when operably coupled in parallel thereto, with respect to the first and the second external contacts.
9. The integrated circuit device of claim 1 wherein the RF transceiver module further comprises a control module arranged to selectively configure the plurality of LNAs and the plurality of PAs to operate in at least the first, multi-antenna configuration and the second, single antenna high transmit power configuration.
10. A wireless communication unit comprising the integrated circuit device of claim 1 .
11. A method for of generating a design for an integrated circuit for a wireless communication unit, the method comprising:
determining a radio frequency (RF) transceiver configuration for the wireless communication unit;
selecting a required antenna and matching network configuration for the determined RF transceiver configuration;
fabricating RF transceiver circuitry for the integrated circuit comprising a selected antenna and matching network configuration to operate in at least one from a group consisting of:
a configurable first, multi-antenna configuration, and
a configurable second single antenna higher transmit power configuration, wherein amplified signals output by a plurality of power amplifiers (PAs) of the integrated circuit are combined to provide a high transmit power signal; and
configuring the RF transceiver circuitry to operate according to the determined RF transceiver configuration.
12. The method of claim 11 , further including manufacturing the integrated circuit in accordance with the design.