IP Library Granted Patent US 9,274,164
Granted Patent B2
US 9,274,164 · App. 13/836,762 · Granted Mar 1, 2016

Detection apparatus for light-emitting diode chips having a light sensing device receiving light beams penetrated through a transparent chuck

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Quick Facts
Patent No.
US 9,274,164
App. No.
13/836,762
Granted
Mar 1, 2016
Kind
B2
Abstract

A detection apparatus for light-emitting diode chips comprises a transparent chuck with the light-concentration capability, a probing device and a light-sensing device. The transparent chuck comprises a light-incident plane and a light-emitting plane. The light-incident plane is used to bear a plurality of light-emitting diode chips under detection. The probing device comprises two probe pins and a power supply. The two ends of each probe pin is electrically connected to one of the light-emitting diode chips and the power supply, respectively, to make the light-emitting diode chip emit a plurality of light beams. The light beams penetrate through the transparent chuck by emitting into the incident plane of the transparent chuck. The light-sensing device is disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.

Claims (14)

1. A detection apparatus for light-emitting diode chips, the detection apparatus at least comprising:

a transparent chuck with the light-concentration capability, the transparent chuck comprising a light-incident plane and a light-emitting plane, where the light-incident plane is used to bear a plurality of light-emitting diode chips under detection;

a probing device, comprising two probe pins and a power supply, the two ends of each probe pin being electrically connected respectively to one of the light-emitting diode chips and the power supply to enable the light-emitting diode chip to emit a plurality of light beams which are emitted into the light-incident plane; and

a light-sensing device, disposed on one side of the light-emitting plane of the transparent chuck to receive the light beams which penetrate through the transparent chuck.

2. The detection apparatus for light-emitting diode chips of claim 1 , wherein the area of the light-emitting plane of the transparent chuck is smaller than that of the light-incident plane.

3. The detection apparatus for light-emitting diode chips of claim 1 , wherein the light-emitting plane of the transparent chuck comprises a plurality of micro-structures.

4. The detection apparatus for light-emitting diode chips of claim 3 , wherein the micro-structures are prisms having a first inclined surface and a second inclined surface, and the first inclined surface and the second inclined surface jointly form a vertex angle.

5. The detection apparatus for light-emitting diode chips of claim 3 , wherein each of the micro-structures has a curved surface.

6. The detection apparatus for light-emitting diode chips of claim 1 , wherein the cross section of the light-emitting plane of the transparent chuck is an outward curved convex.

7. The detection apparatus for light-emitting diode chips of claim 1 , wherein the internal of the transparent chuck comprises a storage space in which a convergent lens is installed to provide the transparent chuck with the light-concentration function.

8. The detection apparatus for light-emitting diode chips of claim 1 , wherein the internal of the transparent chuck comprises a storage space in which a light guide device is installed to guide the light beams which are emitted into the transparent chuck.

9. The detection apparatus for light-emitting diode chips of claim 8 , wherein the light guide device is an optical fiber.

10. The detection apparatus for light-emitting diode chips of claim 8 , wherein the light guide device is a light guide pillar or a light guide panel.

11. The detection apparatus for light-emitting diode chips of claim 1 , wherein the light-sensing device is an integral sphere, a solar panel, a phototransistor, or a light dependent resistance (LDR).

Assignments (3)
ADDRESS CHANGE REGISTRATION FORM Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2013
From: WU, TAI-WEI; TSAI, TAI-CHENG; SHEU, GWO-JIUN; HSU, SHOU-WEN; LI, YUN-LI
To: GENESIS PHOTONICS INC.
Reel/Frame 030070/0197 →