IP Library › Assignment 066044/0807
Patent Assignment
Reel/Frame 066044/0807

Assignment of Assignor's Interest

Recorded: 2023-12-15 Pages: 30
Assignor
GENESIS PHOTONICS INC.
Executed: 2023-11-23
Assignee
NICHIA CORPORATION
491 OKA, KAMINAKA-CHO, ANAN-SHI, TOKUSHIMA, 774-8601, JAPAN
Covered Properties (104)
Light Emitting Diode Module
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Application: 29/598,781 →
Led Chip
Patent: 872,701 →
Application: 29/650,986 →
Light Emitting Diode Package
Patent: 854,195 →
Application: 29/598,780 →
Light Emitting Diode Package
Patent: 843,957 →
Application: 29/638,942 →
Light Emitting Diode Package
Patent: 825,499 →
Application: 29/598,778 →
Light Emitting Diode Package
Patent: 796,456 →
Application: 29/568,192 →
Light Emitting Diode Package Substrate
Patent: 790,487 →
Application: 29/568,703 →
Light Emitting Diode Package Substrate
Patent: 772,181 →
Application: 29/522,732 →
Light Emitting Diode Chip
Patent: 763,805 →
Application: 29/528,298 →
Light Emitting Diode Package Substrate
Patent: 762,596 →
Application: 29/522,734 →
Light Emitting Diode Package
Patent: 761,214 →
Application: 29/522,733 →
Light Emitting Diode Module
Patent: 761,213 →
Application: 29/522,731 →
Light Emitting Diode Chip
Patent: 731,989 →
Application: 29/495,848 →
Broad-Spectrum A1(1-X-Y)Inygaxn Light Emitting Diodes and Solid State White Light Emitting Devices
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Single-Chip White Light Emitting Device
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Application: 11/064,675 →
Publication: US US20050194608A1
Light-Emitting Element with Porous Light-Emitting Layers
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Application: 11/135,639 →
Publication: US US20060081832A1
Method for Making a Semiconductor Light Emitting Device
Patent: 7,157,293 →
Application: 11/062,490 →
Publication: US US20060094139A1
Method for Manufacturing a Semiconductor Device
Patent: 7,491,645 →
Application: 11/585,175 →
Publication: US US20070037306A1
Light-Emitting Device and Method for Manufacturing the Same
Patent: 8,766,293 →
Application: 13/568,399 →
Publication: US US20130037796A1
Plate
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Application: 13/562,281 →
Publication: US US20130056776A1
Light Emitting Diode Device and Flip-Chip Packaged Light Emitting Diode Device
Patent: 9,196,797 →
Application: 13/661,272 →
Publication: US US20130134464A1
Electronic Device
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Application: 13/670,418 →
Publication: US US20130146913A1
Light Emitting Diode and Flip-Chip Light Emitting Diode Package
Patent: 8,680,565 →
Application: 13/707,292 →
Publication: US US20130221394A1
Semiconductor Light Emitting Device and Flip Chip Package Device
Patent: 8,829,543 →
Application: 13/787,765 →
Publication: US US20130277641A1
Substrate Structure
Patent: 8,895,862 →
Application: 13/572,705 →
Publication: US US20130277093A1
Light Emitting Module
Patent: 9,035,335 →
Application: 13/798,126 →
Publication: US US20130285083A1
Light Emitting Device
Application: 15/437,430 →
Publication: US US20170159895A1
Detection Apparatus for Light-Emitting Diode Chips Having a Light Sensing Device Receiving Light Beams Penetrated Through a Transparent Chuck (as Amended)
Patent: 9,274,164 →
Application: 13/836,762 →
Publication: US US20140084931A1
Detection Apparatus
Patent: 8,767,198 →
Application: 13/838,824 →
Publication: US US20140084191A1
Method of Forming Light Emitting Diode Dies, Light Emitting Diode Wafer and Light Emitting Diode Die
Patent: 9,153,743 →
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Publication: US US20140103367A1
Nitride Semiconductor Structure and Semiconductor Light Emitting Device Including the Same
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Publication: US US20160035934A1
Nitride Semiconductor Structure and Semiconductor Light Emitting Device Including the Same
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Application: 13/963,118 →
Publication: US US20140138618A1
Nitride Semiconductor Structure and Semiconductor Light Emitting Device Including the Same
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Publication: US US20150270433A1
Nitride Semiconductor Structure and Semiconductor Light Emitting Device Including the Same
Patent: 9,048,364 →
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Publication: US US20140138616A1
Semiconductor Structure
Patent: 9,685,586 →
Application: 14/727,786 →
Publication: US US20150263226A1
Semiconductor Structure
Application: 15/627,417 →
Publication: US US20170288092A1
Semiconductor Structure
Application: 15/627,419 →
Publication: US US20170294555A1
Semiconductor Structure
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Application: 14/940,173 →
Publication: US US20160072009A1
Detection Apparatus for Light-Emitting Diode Chip
Patent: 9,229,065 →
Application: 13/836,181 →
Publication: US US20140159732A1
Light Source Module
Patent: 9,012,929 →
Application: 13/904,027 →
Publication: US US20140167077A1
Light Emitting Device
Patent: 8,916,889 →
Application: 13/831,965 →
Publication: US US20140167080A1
Electrode Pad Structure of Light Emitting Device
Patent: 8,674,396 →
Application: 13/831,864 →
Light Emitting Diode Structure and Manufacturing Method Thereof
Patent: 8,901,551 →
Application: 13/975,387 →
Publication: US US20140264389A1
Light Source Module
Patent: 9,165,909 →
Application: 14/248,343 →
Publication: US US20140306246A1
Light Source Device Having Multiple Led Chips of Different Thickness
Patent: 9,748,209 →
Application: 14/886,110 →
Publication: US US20160043062A1
Light Source Device Having Light-Emitting Diode Chips of Varying Thickness
Application: 15/688,844 →
Publication: US US20180006000A1
Flip-Chip Light-Emitting Diode Unit
Patent: 9,373,768 →
Application: 14/280,190 →
Publication: US US20140339576A1
Light-Emitting Device
Patent: 9,035,342 →
Application: 13/975,391 →
Publication: US US20140346543A1
Light-Emitting Device
Patent: 9,184,360 →
Application: 14/715,581 →
Publication: US US20150263257A1
Light Emitting Diode Structure
Patent: 9,871,169 →
Application: 14/019,553 →
Publication: US US20150021639A1
Light Emitting Diode Structure
Application: 15/871,891 →
Publication: US US20180138369A1
Light Emitting Diode Structure
Application: 16/384,871 →
Publication: US US20190237627A1
Semiconductor Light Emitting Structure and Semiconductor Package Structure
Patent: 9,431,579 →
Application: 14/576,207 →
Publication: US US20150179888A1
Light Emitting Chip
Patent: 9,577,154 →
Application: 14/535,333 →
Publication: US US20150188014A1
Package Method and Package
Application: 15/627,430 →
Publication: US US20170288100A1
Light Emitting Device
Application: 15/405,323 →
Publication: US US20170125645A1
Light Emitting Diode Package Structure
Patent: 9,496,461 →
Application: 14/686,790 →
Publication: US US20150325758A1
Semiconductor Structure
Patent: 9,263,635 →
Application: 14/707,009 →
Publication: US US20150333220A1
Light Emitting Component
Patent: 9,356,205 →
Application: 14/462,581 →
Publication: US US20150364660A1
Light Emitting Component
Patent: 9,831,399 →
Application: 15/168,218 →
Publication: US US20160276554A1
Light Emitting Component
Application: 15/823,480 →
Publication: US US20180083168A1
Light Emitting Module
Application: 15/785,399 →
Publication: US US20180040594A1
Method for Manufacturing Light Emitting Unit
Patent: 9,219,211 →
Application: 14/474,283 →
Publication: US US20160013358A1
Method for Manufacturing Light Emitting Unit
Patent: 9,859,459 →
Application: 14/957,630 →
Publication: US US20160093766A1
Method for Manufacturing Light Emitting Unit
Application: 15/859,714 →
Publication: US US20180122984A1
Method for Manufacturing Light Emitting Unit
Application: 16/231,914 →
Publication: US US20190131490A1
Light Emitting Device
Patent: 9,801,274 →
Application: 14/927,477 →
Publication: US US20160123568A1
Light Emitting Device Using Metal Substrate for Improving Heat Dissipation Efficiency
Application: 15/790,168 →
Publication: US US20180049319A1
Thin-Film Flip-Chip Light Emitting Diode Having Roughening Surface and Method for Manufacturing the Same
Patent: 9,564,554 →
Application: 14/877,948 →
Publication: US US20160104815A1
Thin-Film Flip-Chip Light Emitting Diode Having Roughening Surface and Method for Manufacturing the Same
Patent: 9,786,813 →
Application: 15/423,595 →
Publication: US US20170148952A1
Thin-Film Flip-Chip Light Emitting Diode Having Roughening Surface and Method for Manufacturing the Same
Application: 15/726,673 →
Publication: US US20180033914A1
Light Emitting Diode and Manufacturing Method Thereof
Patent: 9,728,672 →
Application: 15/045,440 →
Publication: US US20160247964A1
Light-Emitting Diode and a Method for Manufacturing the Same
Application: 15/670,050 →
Publication: US US20170338375A1
Light Emitting Diode Having Distributed Bragg Reflectors (Dbr) and Manufacturing Method Thereof
Patent: 9,705,045 →
Application: 15/045,488 →
Publication: US US20160240744A1
Light Emitting Diode Structure and Method for Manufacturing the Same
Patent: 9,882,096 →
Application: 15/073,715 →
Publication: US US20160276547A1
Multiple Quantum Well Structure and Method for Manufacturing the Same
Patent: 9,640,716 →
Application: 14/811,821 →
Publication: US US20170033260A1
Light Emitting Device and Manufacturing Method Thereof
Patent: 9,997,676 →
Application: 15/268,654 →
Publication: US US20170005238A1
Light Emitting Device
Application: 16/004,445 →
Publication: US US20180294388A1
Electrode Pad Structure of a Light Emitting Diode
Application: 15/975,743 →
Publication: US US20180261729A1
Light Emitting Diode with Bragg Reflector
Application: 15/045,279 →
Publication: US US20160247974A1
Light Emitting Device Comprising Micro-Structures
Application: 15/045,273 →
Publication: US US20160247985A1
Light-Emitting Device and Method for Manufacturing the Same
Application: 15/135,584 →
Publication: US US20160343910A1
Light-Emitting Device and Method for Manufacturing the Same
Application: 16/101,681 →
Publication: US US20180374892A1
Light-Emitting Device and Method for Manufacturing the Same
Application: 16/564,053 →
Publication: US US20200006419A1
Light-Emitting Device
Patent: 9,922,963 →
Application: 15/268,681 →
Publication: US US20170084587A1
Light-Emitting Device
Application: 15/924,461 →
Publication: US US20180211942A1
Manufacturing Method
Application: 16/699,805 →
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Light-Emitting Device and Backlight Module Using the Same
Patent: 9,978,718 →
Application: 15/073,705 →
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Package Substrate and Package Structure Using the Same
Patent: 9,953,956 →
Application: 15/073,707 →
Publication: US US20160284666A1
Light Emitting Diode
Application: 15/981,855 →
Publication: US US20180261727A1
Light Emitting Diode
Application: 16/659,548 →
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Semiconductor Device Containing Nitrogen
Application: 15/708,162 →
Publication: US US20180083162A1
Nitrogen-Containing Semiconductor Device
Application: 15/708,156 →
Publication: US US20180083108A1
Micro Light Emitting Diode and Manufacturing Method Thereof
Application: 15/680,227 →
Publication: US US20180090639A1
Micro Light Emitting Diode and Manufacturing Method Thereof
Application: 16/195,812 →
Publication: US US20190088819A1
Method of Mass Transferring Electronic Device
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Light Emitting Device and Manufacturing Method Thereof
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Light-Emitting Device and Manufacturing Method Thereof
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Light-Emitting Device and Manufacturing Method Thereof
Application: 15/787,811 →
Publication: US US20180138378A1
Light Emitting Device
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Publication: US US20190165232A1
Light Emitting Apparatus and Manufacturing Method Thereof
Application: 16/180,027 →
Publication: US US20190157503A1
Light Emitting Diode Chip and Light Emitting Diode Device
Application: 16/531,148 →
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Light Emitting Diode and Manufacturing Method Thereof
Application: 16/705,255 →
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Red Light Emitting Diode and Manufacturing Method Thereof
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Publication: US US20200357955A1
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 29, 2004
From: CHEN, CHENG CHUAN; CHEN, MING CHANG
To: GENESIS PHOTONICS, INC.
Reel/Frame 015499/0412 →
Assignment of Assignor's Interest Feb 23, 2005
From: CHEN, CHENG CHUAN
To: GENESIS PHOTONICS INC.
Reel/Frame 016328/0589 →
Assignment of Assignor's Interest Feb 23, 2005
From: CHEN, CHENG-CHUAN; LAI, KUN-YU
To: GENESIS PHOTONICS INC.
Reel/Frame 016322/0515 →
Assignment of Assignor's Interest Aug 4, 2005
From: CHEN, CHENG-CHUAN
To: GENESIS PHOTONICS
Reel/Frame 016864/0585 →
Assignment of Assignor's Interest Oct 27, 2005
From: CHEN, CHENG-CHUAN; LAI, KUN-YU
To: GENESIS PHOTONICS INC.
Reel/Frame 016950/0329 →
Assignment of Assignor's Interest Oct 24, 2006
From: CHEN, CHENG-CHUAN
To: GENESIS PHOTONICS INC.
Reel/Frame 018457/0111 →
Assignment of Assignor's Interest Aug 3, 2012
From: SU, PO-JEN; LI, YUN-LI
To: GENESIS PHOTONICS INC.
Reel/Frame 028714/0645 →
Assignment of Assignor's Interest Aug 7, 2012
From: WU, JYUN-DE; LI, YU-CHU
To: GENESIS PHOTONICS INC.
Reel/Frame 028737/0990 →
Assignment of Assignor's Interest Oct 26, 2012
From: LO, YU-YUN; HUANG, YI-RU; WU, CHIH-LING; LIN, TZU-YANG
To: GENESIS PHOTONICS INC.
Reel/Frame 029238/0167 →
Assignment of Assignor's Interest Jul 9, 2014
From: HUANG, JING-EN; HUANG, KUAN-CHIEH; TING, SHAO-YING; HUANG, YI-RU
To: GENESIS PHOTONICS INC.
Reel/Frame 033267/0812 →
Assignment of Assignor's Interest Apr 7, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035343/0569 →
Assignment of Assignor's Interest Apr 8, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035391/0719 →
Assignment of Assignor's Interest Apr 8, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035388/0948 →
Assignment of Assignor's Interest Apr 10, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035375/0139 →
Assignment of Assignor's Interest Mar 29, 2017
From: LIU, CHUAN-YU; ZHAN, XUN-XAIN; TSENG, CHUN-MING; WU, YU-JUNG
To: GENESIS PHOTONICS INC.
Reel/Frame 041790/0438 →
Assignment of Assignor's Interest Mar 29, 2017
From: LEE, HAO-CHUNG; ZHAN, XUN-XAIN; LIN, YU-FENG
To: GENESIS PHOTONICS INC.
Reel/Frame 041772/0402 →
Assignment of Assignor's Interest Mar 29, 2017
From: LEE, HAO-CHUNG; ZHAN, XUN-XAIN; LIN, YU-FENG
To: GENESIS PHOTONICS INC.
Reel/Frame 041772/0377 →
Assignment of Assignor's Interest Aug 9, 2018
From: TING, SHAO-YING; LAN, YAN-TING; HUANG, JING-EN; HUANG, YI-RU
To: GENESIS PHOTONICS INC.
Reel/Frame 046591/0042 →
Address Change Registration Form Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →