IP Library › Granted Patent US 790,487
Granted Patent S1
US 790,487 · App. 29/568,703 · Granted Jun 27, 2017

Light emitting diode package substrate

Inventors: Hao-Chung Lee (Tainan, TW); Yu-Feng Lin (Tainan, TW); Xun-Xain Zhan (Tainan, TW)
Assignee: Genesis Photonics Inc.
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Quick Facts
Patent No.
US 790,487
App. No.
29/568,703
Granted
Jun 27, 2017
Kind
S1
Claims (1)

The ornamental design for a light emitting diode package substrate, as shown and described.

Assignments (2)
ADDRESS CHANGE REGISTRATION FORM Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →
Continuity (1)
Division 29522732 · Apr 2, 2015