Patent Assignment
Reel/Frame 066044/0133
Address Change Registration Form
Recorded: 2023-12-15
Pages: 19
Assignor
GENESIS PHOTONICS INC.
Executed: 2022-12-01
Assignee
GENESIS PHOTONICS INC.
NO.31, SECTION 2, HUANDONG ROAD, SHANHUA DISTRICT (TAINAN SCIENCE PARK), TAINAN CITY, 741, TAIWAN
Covered Properties
(104)
Light Emitting Diode Module
Patent:
886,751 →
Application:
29/598,781 →
Led Chip
Patent:
872,701 →
Application:
29/650,986 →
Light Emitting Diode Package
Patent:
854,195 →
Application:
29/598,780 →
Light Emitting Diode Package
Patent:
843,957 →
Application:
29/638,942 →
Light Emitting Diode Package
Patent:
825,499 →
Application:
29/598,778 →
Light Emitting Diode Package
Patent:
796,456 →
Application:
29/568,192 →
Light Emitting Diode Package Substrate
Patent:
790,487 →
Application:
29/568,703 →
Light Emitting Diode Package Substrate
Patent:
772,181 →
Application:
29/522,732 →
Light Emitting Diode Chip
Patent:
763,805 →
Application:
29/528,298 →
Light Emitting Diode Package Substrate
Patent:
762,596 →
Application:
29/522,734 →
Light Emitting Diode Package
Patent:
761,214 →
Application:
29/522,733 →
Light Emitting Diode Module
Patent:
761,213 →
Application:
29/522,731 →
Light Emitting Diode Chip
Patent:
731,989 →
Application:
29/495,848 →
Broad-Spectrum A1(1-X-Y)Inygaxn Light Emitting Diodes and Solid State White Light Emitting Devices
Single-Chip White Light Emitting Device
Light-Emitting Element with Porous Light-Emitting Layers
Method for Making a Semiconductor Light Emitting Device
Method for Manufacturing a Semiconductor Device
Light-Emitting Device and Method for Manufacturing the Same
Plate
Light Emitting Diode Device and Flip-Chip Packaged Light Emitting Diode Device
Electronic Device
Light Emitting Diode and Flip-Chip Light Emitting Diode Package
Semiconductor Light Emitting Device and Flip Chip Package Device
Substrate Structure
Light Emitting Module
Light Emitting Device
Detection Apparatus for Light-Emitting Diode Chips Having a Light Sensing Device Receiving Light Beams Penetrated Through a Transparent Chuck (as Amended)
Detection Apparatus
Method of Forming Light Emitting Diode Dies, Light Emitting Diode Wafer and Light Emitting Diode Die
Nitride Semiconductor Structure and Semiconductor Light Emitting Device Including the Same
Nitride Semiconductor Structure and Semiconductor Light Emitting Device Including the Same
Nitride Semiconductor Structure and Semiconductor Light Emitting Device Including the Same
Nitride Semiconductor Structure and Semiconductor Light Emitting Device Including the Same
Semiconductor Structure
Semiconductor Structure
Semiconductor Structure
Semiconductor Structure
Detection Apparatus for Light-Emitting Diode Chip
Light Source Module
Light Emitting Device
Electrode Pad Structure of Light Emitting Device
Patent:
8,674,396 →
Application:
13/831,864 →
Light Emitting Diode Structure and Manufacturing Method Thereof
Light Source Module
Light Source Device Having Multiple Led Chips of Different Thickness
Light Source Device Having Light-Emitting Diode Chips of Varying Thickness
Flip-Chip Light-Emitting Diode Unit
Light-Emitting Device
Light-Emitting Device
Light Emitting Diode Structure
Light Emitting Diode Structure
Light Emitting Diode Structure
Semiconductor Light Emitting Structure and Semiconductor Package Structure
Light Emitting Chip
Package Method and Package
Light Emitting Device
Light Emitting Diode Package Structure
Semiconductor Structure
Light Emitting Component
Light Emitting Component
Light Emitting Component
Light Emitting Module
Method for Manufacturing Light Emitting Unit
Method for Manufacturing Light Emitting Unit
Method for Manufacturing Light Emitting Unit
Method for Manufacturing Light Emitting Unit
Light Emitting Device
Light Emitting Device Using Metal Substrate for Improving Heat Dissipation Efficiency
Thin-Film Flip-Chip Light Emitting Diode Having Roughening Surface and Method for Manufacturing the Same
Thin-Film Flip-Chip Light Emitting Diode Having Roughening Surface and Method for Manufacturing the Same
Thin-Film Flip-Chip Light Emitting Diode Having Roughening Surface and Method for Manufacturing the Same
Light Emitting Diode and Manufacturing Method Thereof
Light-Emitting Diode and a Method for Manufacturing the Same
Light Emitting Diode Having Distributed Bragg Reflectors (Dbr) and Manufacturing Method Thereof
Light Emitting Diode Structure and Method for Manufacturing the Same
Multiple Quantum Well Structure and Method for Manufacturing the Same
Light Emitting Device and Manufacturing Method Thereof
Light Emitting Device
Electrode Pad Structure of a Light Emitting Diode
Light Emitting Diode with Bragg Reflector
Light Emitting Device Comprising Micro-Structures
Light-Emitting Device and Method for Manufacturing the Same
Light-Emitting Device and Method for Manufacturing the Same
Light-Emitting Device and Method for Manufacturing the Same
Light-Emitting Device
Light-Emitting Device
Manufacturing Method
Light-Emitting Device and Backlight Module Using the Same
Package Substrate and Package Structure Using the Same
Light Emitting Diode
Light Emitting Diode
Semiconductor Device Containing Nitrogen
Nitrogen-Containing Semiconductor Device
Micro Light Emitting Diode and Manufacturing Method Thereof
Micro Light Emitting Diode and Manufacturing Method Thereof
Method of Mass Transferring Electronic Device
Light Emitting Device and Manufacturing Method Thereof
Light-Emitting Device and Manufacturing Method Thereof
Light-Emitting Device and Manufacturing Method Thereof
Light Emitting Device
Light Emitting Apparatus and Manufacturing Method Thereof
Light Emitting Diode Chip and Light Emitting Diode Device
Light Emitting Diode and Manufacturing Method Thereof
Red Light Emitting Diode and Manufacturing Method Thereof
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 29, 2004
From: CHEN, CHENG CHUAN; CHEN, MING CHANG
To: GENESIS PHOTONICS, INC.
Reel/Frame 015499/0412 →
Assignment of Assignor's Interest
Feb 23, 2005
From: CHEN, CHENG CHUAN
To: GENESIS PHOTONICS INC.
Reel/Frame 016328/0589 →
Assignment of Assignor's Interest
Feb 23, 2005
From: CHEN, CHENG-CHUAN; LAI, KUN-YU
To: GENESIS PHOTONICS INC.
Reel/Frame 016322/0515 →
Assignment of Assignor's Interest
Aug 4, 2005
From: CHEN, CHENG-CHUAN
To: GENESIS PHOTONICS
Reel/Frame 016864/0585 →
Assignment of Assignor's Interest
Oct 27, 2005
From: CHEN, CHENG-CHUAN; LAI, KUN-YU
To: GENESIS PHOTONICS INC.
Reel/Frame 016950/0329 →
Assignment of Assignor's Interest
Oct 24, 2006
From: CHEN, CHENG-CHUAN
To: GENESIS PHOTONICS INC.
Reel/Frame 018457/0111 →
Assignment of Assignor's Interest
Aug 3, 2012
From: SU, PO-JEN; LI, YUN-LI
To: GENESIS PHOTONICS INC.
Reel/Frame 028714/0645 →
Assignment of Assignor's Interest
Aug 7, 2012
From: WU, JYUN-DE; LI, YU-CHU
To: GENESIS PHOTONICS INC.
Reel/Frame 028737/0990 →
Assignment of Assignor's Interest
Oct 26, 2012
From: LO, YU-YUN; HUANG, YI-RU; WU, CHIH-LING; LIN, TZU-YANG
To: GENESIS PHOTONICS INC.
Reel/Frame 029238/0167 →
Assignment of Assignor's Interest
Mar 21, 2013
From: HUANG, JING-EN; HUANG, YI-RU; WU, CHIH-LING; LO, YU-YUN
To: GENESIS PHOTONICS INC.
Reel/Frame 030054/0717 →
Assignment of Assignor's Interest
Jul 9, 2014
From: HUANG, JING-EN; HUANG, KUAN-CHIEH; TING, SHAO-YING; HUANG, YI-RU
To: GENESIS PHOTONICS INC.
Reel/Frame 033267/0812 →
Assignment of Assignor's Interest
Apr 7, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035343/0569 →
Assignment of Assignor's Interest
Apr 8, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035391/0719 →
Assignment of Assignor's Interest
Apr 8, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035388/0948 →
Assignment of Assignor's Interest
Apr 10, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035375/0139 →
Assignment of Assignor's Interest
Mar 29, 2017
From: LEE, HAO-CHUNG; ZHAN, XUN-XAIN; LIN, YU-FENG
To: GENESIS PHOTONICS INC.
Reel/Frame 041772/0377 →
Assignment of Assignor's Interest
Mar 29, 2017
From: LIU, CHUAN-YU; ZHAN, XUN-XAIN; TSENG, CHUN-MING; WU, YU-JUNG
To: GENESIS PHOTONICS INC.
Reel/Frame 041790/0438 →
Assignment of Assignor's Interest
Mar 29, 2017
From: LEE, HAO-CHUNG; ZHAN, XUN-XAIN; LIN, YU-FENG
To: GENESIS PHOTONICS INC.
Reel/Frame 041772/0402 →
Assignment of Assignor's Interest
Aug 9, 2018
From: TING, SHAO-YING; LAN, YAN-TING; HUANG, JING-EN; HUANG, YI-RU
To: GENESIS PHOTONICS INC.
Reel/Frame 046591/0042 →
Assignment of Assignor's Interest
Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →